Ceramic-circuit composite structure and method for making the same

1. A ceramic-circuit composite structure, comprising:

a ceramic plate;

a curved-surface circuit buried in the ceramic plate, wherein the curved-surface circuit is a wavy curved-surface circuit; and

a power supply module electrically connected to the curved-surface circuit;

wherein the curved-surface circuit is an irregularly curved-surface heating circuit;

wherein the ceramic-circuit composite structure further includes a static electricity circuit buried in the ceramic plate and lying above the curved-surface circuit, wherein the static electricity circuit is a wavy curved-surface circuit; and

wherein the ceramic-circuit composite structure further includes a plasma control mesh or plasma control circuit buried in the ceramic plate and lying above the static electricity circuit.

2. The ceramic-circuit composite structure of claim 1 , wherein the ceramic plate has a supporting surface that has a recessed supporting portion.

3. The ceramic-circuit composite structure of claim 1 , wherein the ceramic-circuit composite structure further includes a hollow ceramic tube provided between the ceramic plate and the power supply module, and a pair of metal electrodes are provided in the hollow ceramic tube and are electrically connected to the curved-surface circuit and the power supply module.

4. The ceramic-circuit composite structure of claim 1 , wherein the ceramic-circuit composite structure further includes a hollow ceramic tube provided between the ceramic plate and the power supply module, and a pair of metal electrodes are provided in the hollow ceramic tube and are electrically connected to the curved-surface circuit, the static electricity circuit, the plasma control mesh or plasma control circuit, and the power supply module.

5. The ceramic-circuit composite structure of claim 1 , wherein the material of the ceramic plate is selected from a group composed of a composition of aluminum nitride/yttrium oxide/carbon, a composition of aluminum oxide/magnesium oxide, silicon nitride, silicon carbide, resin, a semiconductor material, and an insulating material.

6. The ceramic-circuit composite structure of claim 1 , wherein the curved-surface circuit is made of a metal material or a conductive material.

7. The ceramic-circuit composite structure of claim 6 , wherein the metal material is a combination of molybdenum, tungsten, nickel, titanium, and carbon.

8. A method for making the ceramic-circuit composite structure of claim 1 as follows:

in step (a), a green body composed of ceramic particles is provided, and the green body is molded by a high-pressure curved-surface mold or is processed into a curved-surface green body after being formed by high-pressure molding;

in step (b), at least one curved-surface circuit is prepared on one side of the green body by printing, by jet printing, by electronic printing, or by making use of a ready-made circuit;

in step (c), the green body is subjected to high-pressure molding to produce an unsintered ceramic plate; and

in step (d), the unsintered ceramic plate is subjected to debinding, sintering, and grinding to produce the ceramic-circuit composite structure, wherein the sintering is atmospheric-pressure sintering, high-pressure sintering, or hydraulic-pressure sintering.

9. The method of claim 8 , wherein the step (b) further includes providing a plasma control mesh or plasma control circuit above the at least one curved-surface circuit.

10. The method of claim 8 , wherein the method further includes step (e), in which a hollow ceramic tube is adhesively bonded to the ceramic-circuit composite structure and then a pair of metal electrodes are disposed in the hollow ceramic tube and joined to the ceramic-circuit composite structure by co-firing.

11. A method for making the ceramic-circuit composite structure of claim 1 , wherein the method includes the steps of:

(a) providing a green body that is composed of ceramic particles and shaped by tape casting;

(b) preparing at least one curved-surface circuit on one side of the green body by printing, by jet printing, by electronic printing, or by making use of a ready-made circuit;

(c) subjecting the green body to lamination through tape casting, followed by cold isostatic pressing or hydraulic pressing to produce an unsintered ceramic plate; and

(d) debinding, sintering, and then grinding the unsintered ceramic plate to produce the ceramic-circuit composite structure, wherein the sintering may be atmospheric-pressure sintering, high-pressure sintering, or hydraulic-pressure sintering.

12. The method of claim 11 , wherein the step (b) further includes providing a plasma control mesh or plasma control circuit above the at least one curved-surface circuit.