Display module having LED packages including connection substrate
A display module and a manufacturing method thereof is provided. The display module may include a substrate; a thin film transistor (TFT) layer disposed on a surface of the substrate; a plurality of LED packages including a connection substrate and a plurality of LEDs disposed on a first surface of the connection substrate; and a wiring configured to electrically connect the TFT layer and the plurality of LEDs. The wiring includes a first wiring for electrically coupling with the plurality of LEDs on the first surface, and a second wiring for electrically coupling with the TFT layer on a second surface of the connection substrate.
1. A display module, comprising:
a substrate;
a thin film transistor (TFT) layer disposed on a surface of the substrate;
a plurality of LED packages comprising a connection substrate and a plurality of LEDs disposed on a first surface of the connection substrate;
a wiring configured to electrically connect the TFT layer and the plurality of LEDs;
a molding part configured to cover the plurality of LED packages and the substrate; and
a black matrix disposed between each of the plurality of LED packages on the TFT layer,
wherein the wiring comprises a first wiring for electrically coupling with the plurality of LEDs on the first surface of the connection substrate, and a second wiring for electrically coupling with the TFT layer on a second surface of the connection substrate,
wherein the molding part covers the TFT layer exposed between the plurality of LED packages, and
wherein spaces provided between each of the plurality of LED packages and the black matrix are filled with the molding part.
2. The display module of claim 1 , wherein an electrode of each of the plurality of LEDs is electrically coupled with the first wiring through a first electrode pad formed on the first surface of the connection substrate, and
wherein an electrode on the TFT layer is electrically coupled with the second wiring through a second electrode pad formed on the second surface of the connection substrate.
3. The display module of claim 2 , wherein each of the plurality of LED packages is electrically coupled to a common electrode or individual electrodes formed on the TFT layer.
4. The display module of claim 1 , wherein the first wiring and the second wiring are electrically coupled to each other through at least one via hole.
5. The display module of claim 1 , wherein the connection substrate further comprises at least one wiring layer.
6. The display module of claim 1 , wherein each of the plurality of LED packages constitutes at least one display pixel.
7. The display module according to claim 1 , wherein the plurality of LEDs are micro LEDs.