System producing a conductive path on a substrate
A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.
1. A system for producing a conductive path on a substrate comprising:
an optical assembly including:
a patterning laser, operative to generate a patterning laser beam; and
an ablating laser, operative to generate an ablating laser beam; and
a substrate positioning assembly, movable relative to said optical assembly, operative to position said optical assembly relative to a substrate,
a camera in electronic communication with a workstation, wherein said workstation is configured to:
identify a cut between two ends of said conductive path,
send instructions to deposit a layer of material such that said layer of material is in contact with said two ends of said conductive path, and
send instructions to selectably sinter regions of said layer of material thereby causing said metal particles to together define a conductor at sintered regions between said two ends of said conductive path,
said patterning laser beam being operative to selectably sinter regions of said layer of material having a thickness in a range of 0.1 to 5 microns, including metal particles having a diameter in a range of 10 to 100 nanometers, deposited on said substrate, thereby causing said metal particles to together define a conductor at sintered regions; and
said ablating laser beam, being operative to deposit said layer of material and, below a threshold at which said sintered regions would be ablated, to ablate portions of said layer of material other than at said sintered regions.
2. The system for producing a conductive path on a substrate according to claim 1 , wherein said substrate positioning assembly is moveable in both x and y directions relative to said optical assembly.
3. The system for producing a conductive path on a substrate according to claim 1 , wherein said patterning laser is a continuous wave laser.
4. The system for producing a conductive path on a substrate according to claim 1 , wherein said ablating laser is a pulsed laser.
5. The system for producing a conductive path on a substrate according to claim 1 , further comprising a blower.
6. The system for producing a conductive path on a substrate according to claim 1 , wherein said layer of material comprises conductive ink.
7. The system for producing a conductive path on a substrate according to claim 1 , wherein said patterning laser beam is a continuous laser beam and has a power level between 40-100 mW.
8. The system for producing a conductive path on a substrate according to claim 1 , wherein said workstation is configured to send instructions to:
define at least two areas on said substrate forming part of said conductive path; and
employ said ablating laser beam to ablate portions of a non-conductive layer formed over said substrate in said at least two areas.
9. The system for producing a conductive path on a substrate according to claim 6 , wherein said layer of material is a nanoparticle silver ink, a nanoparticle copper ink, or a non-metal conductive ink.