IP Library Granted Patent US 11,466,154
Granted Patent B2
US 11,466,154 · App. 16/982,082 · Granted Oct 11, 2022

Room temperature curable organopolysiloxane composition and electric/electronic apparatus

Inventors: Jody J. Henning (Midland, MI); John B. Horstman (Midland, MI); Vennesa O. Jansma (Midland, MI); Steven Swier (Midland, MI)
Assignee: DOW SILICONES CORPORATION
C08L83/04C08G77/18C08K5/5419C09D7/63C09D183/04C08L2203/206C08L2666/44
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Quick Facts
Patent No.
US 11,466,154
App. No.
16/982,082
Granted
Oct 11, 2022
Kind
B2
Abstract

A room temperature curable organopolysiloxane composition comprises: (A) an organopolysiloxane having alkoxysilyl-containing groups at both molecular terminals; (B) an organopolysiloxane resin; (C) an alkoxysilane; and (D) a condensation-reaction catalyst. The room temperature curable organopolysiloxane composition exhibits good to excellent storage stability. In addition, the room temperature curable organopolysiloxane composition can form a cured product exhibiting good to excellent mechanical properties.

Claims (35)

1. A room temperature curable organopolysiloxane composition comprising:

(A) about 100 parts by mass of an organopolysiloxane represented by the following general formula:

X—(SiR 1 2 O) m —SiR 1 2 —X;

wherein each R 1 is the same or different monovalent hydrocarbon group lacking an aliphatic unsaturated bond, each X is an alkoxysilyl-containing group selected from the group consisting of a group represented by the following general formula:

—R 3 —SiR 1 a (OR 2 ) (3-a) ,

a group represented by the following general formula;

—R 3 —(SiR 1 2 O) n —SiR 1 2 —R 3 —SiR 1 a (OR 2 ) (3-a) ,

and a group represented by the following general formula;

—R 3 —(SiR 1 2 O) n —SiR 1 b —[OSiR 1 2 —R 3 —SiR 1 a (OR 2 ) (3-a) ] (3-b) ;

wherein each R 1 is as described above, R 2 is an alkyl group, each R 3 is the same or different alkylene group, “a” is 0, 1 or 2, “b” is 0 or 1, “n” is an integer of from 1 to 20, and “in” is an integer of from 50 to 1000;

(B) about 50 to about 200 parts by mass of an organopolysiloxane resin represented by the following average unit formula:

(R 4 3 SiO 1/2 ) c (R 4 2 SiO 2/2 ) d (R 4 SiO 3/2 ) e (ZO 1/2 ) f ;

wherein each R 4 is the same or different monovalent hydrocarbon group, each Z is H or an alkyl group, and “c”, “d” and “e” are numbers satisfied by the following conditions: 0≤c<0.1, 0.3≤d≤0.6, 0.4≤e≤0.7, and c+d+e=1, and wherein “f′ is a number satisfying that the organopolysiloxane resin contains OZ in a range of from about 30 mol % to about 54 mol % based on Si units;

(C) about 0.5 to about 20 parts by mass of an alkoxysilane represented by the following general formula:

R 5 X Si(OR 6 ) (4-x) ;

wherein R 5 is a monovalent hydrocarbon group, R 6 is an alkyl group, and “x” is an integer of from 0 to 2; and

(D) about 0.1 to about 20 parts by mass of a condensation-reaction catalyst.

2. The room temperature curable organopolysiloxane composition according to claim 1 , wherein the alkoxysilyl-containing group in component (A) is a group represented by the following formula:

—C 2 H 4 —Si(CH 3 ) 2 O—Si(CH 3 ) 2 —C 2 H 4 —Si(OCH 3 ) 3 .

3. The room temperature curable organopolysiloxane composition according to claim 2 , wherein component (B) comprises an organopolysiloxane resin represented by the following average unit formula:

[(CH 3 ) 2 SiO 2/2 ] d (CH 3 SiO 3/2 ) e (ZO 1/2 ) f ;

wherein: “d” and “e” are numbers satisfied by the following conditions: 0.3≤d≤0.6, 0.4≤e≤0.7, and d+e=1; each Z is H or an alkyl group; and “f′ is a number satisfying that the organopolysiloxane resin contains OZ in a range of from about 30 mol % to about 54 mol % based on Si units.

4. The room temperature curable organopolysiloxane composition according to claim 3 , wherein component (C) comprises dimethyldimethoxysilane and/or methyltrimethoxysilane.

5. The room temperature curable organopolysiloxane composition according to claim 1 , wherein component (B) comprises an organopolysiloxane resin represented by the following average unit formula:

[(CH 3 ) 2 SiO 2/2 ] d (CH 3 SiO 3/2 ) e (ZO 1/2 ) f ;

wherein: “d” and “e” are numbers satisfied by the following conditions: 0.3≤d≤0.6, 0.4≤e≤0.7, and d+e=1; each Z is H or an alkyl group; and “f′ is a number satisfying that the organopolysiloxane resin contains OZ in a range of from about 30 mol % to about 54 mol % based on Si units.

6. The room temperature curable organopolysiloxane composition according to claim 1 , wherein component (C) comprises dimethyldimethoxysilane and/or methyltrimethoxysilane.

7. The room temperature curable organopolysiloxane composition according to claim 1 , wherein component (B) contains silanol groups.

8. A conformal coating agent comprising the room temperature curable organopolysiloxane composition according to claim 1 .

9. An electric/electronic apparatus obtained by using the room temperature curable organopolysiloxane composition according to claim 1 .

10. The room temperature curable organopolysiloxane composition according to claim 1 , wherein component (B) contains silicon atom-bonded methoxy groups.

11. The room temperature curable organopolysiloxane composition according to claim 1 , wherein the content of component (B) is in a range of from about 80 to about 200 parts by mass, or optionally in a range of from about 100 to about 200 parts by mass, relative to 100 parts by mass of component (A).

12. The room temperature curable organopolysiloxane composition according to claim 1 , wherein the content of component (C) is in a range of front about 0.5 to about 15 parts by mass, or optionally in a range of from about 1 to about 10 part(s) by mass, relative to 100 parts by mass of component (A).

13. The room temperature curable organopolysiloxane composition according to claim 1 , wherein the content of component (D) is in a range of from about 0.1 to about 15 parts by mass, or optionally in a range of from about 1 to about 15 parts by mass, relative to 100 parts by mass of component (A).

14. The room temperature curable organopolysiloxane composition according to claim 1 , wherein component (B) contains silanol groups and silicon atom-bonded methoxy groups.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2022
From: HENNING, JODY J.; HORSTMAN, JOHN B.; JANSMA, VENNESA O.; SWIER, STEVEN
To: DOW SILICONES CORPORATION
Reel/Frame 060908/0746 →
Continuity (2)
Provisional Application 62645886 · Mar 21, 2018
Related Publication 20210095125A1 · Apr 1, 2021