IP Library › Granted Patent US 11,466,170
Granted Patent B2
US 11,466,170 · App. 16/768,749 · Granted Oct 11, 2022

Conductive paste

Inventors: Kenji Kobayashi (Niigata, JP); Kazuo Muramatsu (Niigata, JP); Hideo Tanabe (Niigata, JP)
Assignee: NAMICS CORPORATION
C09D11/52C09D11/033C09D11/037C09D11/102H01L31/022466H01L31/0747
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,466,170
App. No.
16/768,749
Granted
Oct 11, 2022
Kind
B2
Abstract

A conductive paste, for forming an electrode of a solar cell, includes (A) a conductive component, (B) an epoxy resin, (C) an imidazole and (D) a solvent. An amount of (C) the imidazole in the conductive paste is 0.1 to 1.0% by weight based on 100% by weight of the conductive paste excluding (D) the solvent.

Claims (11)

1. A conductive paste for forming a solar cell, wherein the conductive paste comprises (A) a conductive component, (B) an epoxy resin, (C) an imidazole, (D) a solvent, and (E) a phenol resin,

wherein an amount of (C) the imidazole in the conductive paste is 0.1 to 1.0% by weight based on 100% by weight of the conductive paste excluding (D) the solvent,

wherein (C) the imidazole contains at least one imidazole selected from imidazoles of the following formula (1) and formula (2):

and

wherein (B) the epoxy resin comprises a bisphenol F type epoxy resin, a biphenyl type epoxy resin and a bisphenol A type epoxy resin.

2. The conductive paste according to claim 1 , wherein (D) the solvent comprises ethyl diglycol monophenyl ether or diethylene glycol monobutyl ether.

3. The conductive paste according to claim 1 , which further comprises (F) a coupling agent.

4. The conductive paste according to claim 1 , wherein (D) the solvent comprises diethylene glycol monobutyl ether acetate.

5. The conductive paste according to claim 1 , wherein (A) the conductive component comprises conductive particles of at least one selected from silver, copper, nickel, aluminum, zinc and tin.

6. The conductive paste according to claim 1 , wherein (A) the conductive component contained in the conductive paste is 75 to 98% by weight based on the whole conductive paste.

7. The conductive paste according to claim 1 , wherein (E) the phenol resin contained in the conductive paste is 1.56 to 1.76% by weight based on the total weight of (A) the conductive component, (B) the epoxy resin, (C) the imidazole, (E) the phenol resin and (F) a coupling agent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 1, 2020
From: KOBAYASHI, KENJI; MURAMATSU, KAZUO; TANABE, HIDEO
To: NAMICS CORPORATION
Reel/Frame 052800/0800 →
Priority Claims (1)
JP JP2017-234123 · Dec 6, 2017 · national
Continuity (1)
Related Publication 20210155819A1 · May 27, 2021