Granted Patent
S1
US 1,146,848 · App. 29/958,433 · Granted Sep 8, 2026
Light-emitting diode package
Inventors:
Joseph M. Favale, Jr. (Cary, NC); Robert David Schmidt (Wake Forest, NC); Christopher P. Hussell (Raleigh, NC); JuZuo Sheng (Huizhou, CN); Chak Hau Charles Pang (Fanling, HK)
Assignee:
CreeLED, Inc.
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Claims (1)
The ornamental design for a light-emitting diode package, as shown and described.
Assignments (2)
PATENT SECURITY AGREEMENT
Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Aug 20, 2024
From: FAVALE, JOSEPH M., JR.; SCHMIDT, ROBERT DAVID; HUSSELL, CHRISTOPHER P.; SHENG, JUZUO; PANG, CHAK HAU CHARLES
To: CREELED, INC.
Reel/Frame 068336/0142 →
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