IP Library › Granted Patent US 11,469,193
Granted Patent B2
US 11,469,193 · App. 16/983,771 · Granted Oct 11, 2022

Antenna module

Inventors: Doo Il Kim (Suwon-Si, KR); Dae Kwon Jung (Suwon-Si, KR); Young Sik Hur (Suwon-Si, KR); Yong Ho Baek (Suwon-Si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01L23/66H01L23/3114H01L23/5383H01L23/5386H01L23/5389H01L24/20H01L2223/6677H01L2224/214H01L2924/19105H01Q9/0407
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Quick Facts
Patent No.
US 11,469,193
App. No.
16/983,771
Granted
Oct 11, 2022
Kind
B2
Abstract

An antenna module includes a connection member including at least one wiring layer and at least one insulating layer, an antenna package including a plurality of antenna members transmitting or receiving a radio frequency (RF) signal and a plurality of feed vias respectively electrically connected to the plurality of antenna members at one end and respectively electrically connected to a wiring corresponding to the at least one wiring layer at the other end, and positioned on a first surface of the connection member, an integrated circuit (IC) disposed on a second surface of the connection member and electrically connected to the wiring corresponding to the at least one wiring layer to receive an intermediate frequency (IF) signal or baseband signal and transfer an RF signal or receive an RF signal and transfer an IF signal or baseband signal, and a filter filtering an IF signal or a baseband signal.

Claims (16)

1. An antenna module comprising:

a connection member including at least one wiring layer;

an antenna package including a plurality of antenna members and a plurality of feed vias respectively electrically connected to the plurality of antenna members at a first end and respectively electrically connected to the at least one wiring layer at a second end, and positioned on a first surface of the connection member;

an integrated circuit (IC) disposed on a second surface of the connection member and electrically connected to the at least one wiring layer;

a support member surrounding side surfaces of the IC on the second surface and including at least one core wiring layer inside the support member;

an encapsulant filling a space between the IC and the support member; and

a filter included in the at least one core wiring layer and electrically connected to the IC.

2. The antenna module of claim 1 , wherein the support member further includes a core via penetrating through the support member and electrically connected to the at least one wiring layer at one end.

3. The antenna module of claim 2 , wherein the filter is electrically connected to the core via of the support member.

4. The antenna module of claim 1 , wherein the support member further includes an upper core wiring layer disposed on a top of the support member and a lower core wiring layer disposed on a bottom of the support member,

the upper core wiring layer includes an upper ground pattern overlapping the filter, and

the lower core wiring layer includes a lower ground pattern overlapping the filter.

5. The antenna module of claim 1 , wherein the support member further includes an upper core insulating layer disposed on a top of the support member and a lower core insulating layer disposed on a bottom of the support member.

6. The antenna module of claim 5 , wherein the support member further includes an upper core wiring layer disposed on a top of the upper core insulating layer and a lower core wiring layer disposed on a bottom of the lower core insulating layer, and

the upper core wiring layer and the lower core wiring layer are electrically connected to each other.

7. The antenna module of claim 1 , wherein the support member further includes a core plating member disposed on a side surface of the support member in a direction toward the IC.

Priority Claims (1)
KR 10-2018-0028803 · Mar 12, 2018 · national
Continuity (2)
Continuation 16009732 · Jun 15, 2018
Related Publication 20200365536A1 · Nov 19, 2020