IP Library › Granted Patent US 11,469,256
Granted Patent B2
US 11,469,256 · App. 16/831,144 · Granted Oct 11, 2022

Array substrate, display panel and display device

Inventors: Ling Han (Beijing, CN); Tao Ma (Beijing, CN); Chengshao Yang (Beijing, CN); Qingmeng Wu (Beijing, CN)
Assignees: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.; BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
H01L27/124G02F1/136H01L23/60
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Quick Facts
Patent No.
US 11,469,256
App. No.
16/831,144
Granted
Oct 11, 2022
Kind
B2
Abstract

An array substrate includes a base substrate and a GND trace. The GND trace is disposed along an edge of the substrate, and the GND trace includes a plurality of conductive line segments separated from each other and a connection structure disposed on a side of the GND trace away from the base substrate. The connection structure electrically connects the conductive line segments.

Claims (53)

1. An array substrate comprising:

a base substrate;

a ground (GND) trace disposed along edges of the substrate, the GND trace comprising a plurality of conductive line segments separated from each other;

a connection structure disposed on a side of the GND trace away from the base substrate, wherein the connection structure electrically connects the conductive line segments;

a first insulating layer disposed on a side of the GND trace away from the base substrate; and

a first electrode layer disposed on a side of the first insulating layer away from the base substrate;

wherein the connection structure is disposed on a side of the first electrode layer away from the base substrate, the connection structure electrically connecting two adjacent conductive line segments, and

the connection structure comprises:

a first via hole disposed on the first insulating layer, wherein an orthographic projection of the first via hole on the base substrate covers an orthographic projection of an interval between two adjacent conductive line segments on the base substrate;

a second insulating layer disposed on a side of the first electrode layer away from the base substrate, wherein a second via hole is disposed on the second insulating layer, and an orthographic projection of the second via hole on the base substrate covers an orthographic projection of the interval between two adjacent conductive line segments on the base substrate; and

a first connection portion disposed on a side of the second insulating layer away from the base substrate, wherein the first connection portion electrically connects two adjacent conductive line segments through the second via hole and the first via hole.

2. The array substrate according to claim 1 , further comprising:

a cell test (CT) pad disposed on the base substrate and disposed on the same layer as the GND trace;

wherein the connection structure further comprises:

a fourth via hole disposed on the first insulating layer, a fifth via hole disposed the first electrode layer, the fifth via hole being in communication with the fourth via hole, and a third via hole being disposed on the second insulating layer;

a second connection portion disposed in the fourth via hole and the fifth via hole to electrically connect the CT pad and the first electrode layer; and

a third connection portion disposed on a side of the second insulating layer away from the base substrate, and the third connection portion being electrically connected to the second connection portion through the third via hole.

3. The array substrate according to claim 2 , wherein the third connection portion and the first connection portion are disposed on a same layer as a common electrode of a display area.

4. The array substrate according to claim 1 , wherein the first electrode layer is disposed on a same layer as a pixel electrode of the display area.

5. The array substrate according to claim 1 , wherein four intervals are disposed on the GND traces.

6. The array substrate according to claim 5 , wherein the four intervals are disposed at four corners of the GND trace in one-to-one correspondence.

7. The array substrate according to claim 1 , wherein an opening portion is disposed on the GND trace.

8. The array substrate according to claim 7 , wherein the opening portion is disposed on a date pad (DP) side of the array substrate.

9. The array substrate according to claim 1 , wherein the interval between two adjacent conductive line segments has a length larger than 5 mm, and smaller than or equal to 10 mm.

10. A display panel comprising an array substrate, the array substrate comprising:

a base substrate;

a ground (GND) trace disposed along an edge of the substrate, the GND trace comprising a plurality of conductive line segments separated from each other;

a connection structure disposed on a side of the GND trace away from the base substrate, the connection structure electrically connecting the conductive line segments;

a first insulating layer disposed on a side of the GND trace away from the base substrate; and

a first electrode layer disposed on a side of the first insulating layer away from the base substrate;

wherein the connection structure is disposed on a side of the first electrode layer away from the base substrate, the connection structure electrically connecting two adjacent conductive line segments, and

the connection structure comprises:

a first via hole disposed on the first insulating layer, wherein an orthographic projection of the first via hole on the base substrate covers an orthographic projection of an interval between two adjacent conductive line segments on the base substrate;

a second insulating layer disposed on a side of the first electrode layer away from the base substrate, wherein a second via hole is disposed on the second insulating layer, and an orthographic projection of the second via hole on the base substrate covers an orthographic projection of the interval between two adjacent conductive line segments on the base substrate; and

a first connection portion disposed on a side of the second insulating layer away from the base substrate, wherein the first connection portion electrically connects two adjacent conductive line segments through the second via hole and the first via hole.

11. The display panel according to claim 10 , wherein the array substrate further comprises:

a cell test (CT) pad disposed on the base substrate and disposed on the same layer as the GND trace;

wherein the connection structure further comprises:

a fourth via hole disposed on the first insulating layer, a fifth via hole disposed the first electrode layer, the fifth via hole being in communication with the fourth via hole, and a third via hole being disposed on the second insulating layer;

a second connection portion disposed in the fourth via hole and the fifth via hole to electrically connect the CT pad and the first electrode layer; and

a third connection portion disposed on a side of the second insulating layer away from the base substrate, the third connection portion being electrically connected to the second connection portion through the third via hole.

12. The display panel according to claim 11 , wherein the third connection portion and the first connection portion are disposed on the same layer as a common electrode of a display area.

13. A display device comprising a display panel, the display panel comprising an array substrate, and the array substrate comprising:

a base substrate;

a ground (GND) trace disposed along an edge of the substrate, the GND trace comprising a plurality of conductive line segments separated from each other;

a connection structure disposed on a side of the GND trace away from the base substrate, the connection structure electrically connecting the conductive line segments;

a first insulating layer disposed on a side of the GND trace away from the base substrate; and

a first electrode layer disposed on a side of the first insulating layer away from the base substrate;

wherein the connection structure is disposed on a side of the first electrode layer away from the base substrate, the connection structure electrically connecting two adjacent conductive line segments, and

the connection structure comprises:

a first via hole disposed on the first insulating layer, wherein an orthographic projection of the first via hole on the base substrate covers an orthographic projection of an interval between two adjacent conductive line segments on the base substrate;

a second insulating layer disposed on a side of the first electrode layer away from the base substrate, wherein a second via hole is disposed on the second insulating layer, and an orthographic projection of the second via hole on the base substrate covers an orthographic projection of the interval between two adjacent conductive line segments on the base substrate; and

a first connection portion disposed on a side of the second insulating layer away from the base substrate, wherein the first connection portion electrically connects two adjacent conductive line segments through the second via hole and the first via hole.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 28, 2022
From: BOE TECHNOLOGY GROUP CO., LTD.
To: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
Reel/Frame 060653/0894 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2020
From: HAN, LING; MA, TAO; YANG, CHENGSHAO; WU, QINGMENG
To: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 053170/0386 →
Priority Claims (1)
CN 201921986690.7 · Nov 15, 2019 · national
Continuity (1)
Related Publication 20210151469A1 · May 20, 2021