Component carrier with embedded component and horizontally elongated via

1. A component carrier, comprising:

a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;

a component embedded in the stack, wherein the component comprises at least one pad on a main surface of the component; and

a via formed in at least one of the at least one electrically insulating layer structure along a horizontal path having a length being larger than a horizontal width,

wherein the via is configured as a thermal via and is at least partially filled with a thermally conductive filling; and

wherein the via directly contacts the at least one pad,

wherein the component carrier comprises an electrically conductive trace having oblong filled layer vias, wherein the electrically conductive trace is connected with a vertically extending land pad.

2. The component carrier according to claim 1 , wherein the via is at least partially filled with an electrically conductive filling which electrically contacts the embedded component.

3. The component carrier according to claim 1 , wherein the via is not filled with an electrically conductive filling.

4. The component carrier according to claim 1 , wherein the via is a laser via formed by laser drilling.

5. The component carrier according to claim 1 , wherein the via has tapering sidewalls in a depth direction.

6. The component carrier according to claim 1 , wherein the via is formed with vertical sidewalls in a depth direction.

7. The component carrier according to claim 1 , wherein the via is substantially bathtub shaped.

8. The component carrier according to claim 1 , wherein the component is connected with or contacted by a plurality of vias each formed in at least one of the at least one electrically insulating layer structure along a horizontal path having a length being larger than a horizontal width.

9. The component carrier according to claim 8 , wherein each via is at least partially filled with an electrically conductive filling.

10. The component carrier according to claim 1 , comprising at least one of the following features:

wherein a plurality of vias is provided in a vertically stacked arrangement, each via formed in at least one of the at least one electrically insulating layer structure along a horizontal path having a length being larger than a horizontal width, wherein each via is at least partially filled with an electrically conductive filling;

wherein the via is configured for thermally conducting heat out of the component carrier;

wherein the via is configured for electrically conducting current and/or signals within the component carrier;

wherein the via is formed as a sequence of frustoconical holes in adjacent surface portions of at least one of the at least one electrically insulating layer structure to thereby form connected circular recesses constituting the via;

wherein the via has a shape of an oblong slot with straight shape along its length;

wherein the via has a curved shape;

wherein a ratio between length and width of the via is in a range between 1.5 and 5;

wherein a ratio between a depth and the width of the via is in a range between 10% and 90%;

wherein, in a plan view, the via has an outline defined by a plurality of longitudinally arranged overlapping circular recesses;

wherein the thermal via is electrically inactive.

11. The component carrier according to claim 1 , comprising at least one of the following features:

the component is selected from a group consisting of an electronic component, an electrically non-conductive and/or electrically conductive inlay, an active electronic component, a passive electronic component, an electronic chip, a storage device, a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a voltage converter, a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, an actuator, a microelectromechanical system, a microprocessor, a capacitor, a resistor, an inductance, an accumulator, a switch, a camera, an antenna, a magnetic element, a further component carrier, and a logic chip;

wherein the at least one electrically conductive layer structure comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten;

wherein the at least one electrically insulating layer structure comprises at least one of the group consisting of reinforced or non-reinforced resin, epoxy resin or bismaleimide-triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based build-up film, polytetrafluoroethylene, a ceramic, and a metal oxide;

wherein the component carrier is shaped as a plate;

wherein the component carrier is configured as one of the group consisting of a printed circuit board, a substrate, and an interposer;

wherein the component carrier is configured as a laminate-type component carrier.

12. A method of manufacturing a component carrier, the method comprising:

providing a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;

embedding a component in the stack, wherein the component comprises at least one pad on a main surface of the component; and

forming a via in at least one of the at least one electrically insulating layer structure along a horizontal path having a length being larger than a horizontal width,

wherein the via is configured as a thermal via and is at least partially filled with a thermally conductive filling; and

wherein the via directly contacts the at least one pad,

wherein the component carrier comprises an electrically conductive trace having oblong filled layer vias, wherein the electrically conductive trace is connected with a vertically extending land pad.

13. The method according to claim 12 , wherein the method comprises forming the via by laser drilling.

14. The method according to claim 12 , wherein the method comprises using the via for thermally conducting heat out of the component carrier.

15. The method according to claim 12 , wherein the method comprises using the via for conducting electric current and/or signals within the component carrier.

16. The method according to claim 12 , wherein the method comprises forming the via by:

opening an electrically conductive layer structure above an electrically insulating layer structure of the stack by etching a window in the electrically conductive layer structure and subsequently removing exposed material of the electrically insulating layer structure by laser processing.

17. The method according to claim 12 , wherein the method comprises forming the via by:

operating a laser source for continuously emitting a laser beam, and

moving the laser beam relative to the electrically insulating layer structure during forming the via.

18. The method according to claim 12 , wherein the method comprises forming the via by:

operating a laser source for moving with respect to the electrically insulating layer structure only between emitting different laser shots in overlapping, surface portions of the electrically insulating layer structure, and

operating the laser source to be stationary with respect to the electrically insulating layer structure during each individual laser shot.

19. The method according to claim 12 , wherein the method comprises electrically and/or thermally contacting or connecting the embedded component by the via.