Assembly of flexible and integrated module packages with leadframes

1. A packaged component having a first surface and an opposite second surface, the packaged component comprising:

a first element having a first surface and an opposite second surface, wherein the first element comprises a portion of a lead-frame, wherein the lead-frame is part of a lead-frame panel which includes a plurality of pockets, wherein most of a peripheral region of an individual pocket includes a plurality of leads that extend from the lead-frame panel towards the individual pocket;

a second element having a first surface and an opposite second surface, wherein the second element is a semiconductor base chip; and

a third element electrically connecting a portion of the first element to a portion of the second element,

wherein the second surface of the first element is adjacent to the second surface of the packaged component;

wherein the second surface of the first element and the second surface of the second element are substantially co-planar;

wherein the second surface of the second element is adjacent to the second surface of the packaged component; and

wherein a first distance measured in a direction normal to the first surface of the first element to the second surface of the first element is greater than or equal to a second distance from a plane through the second surface of the first element to a plane through the second surface of the second element.

2. The packaged component of claim 1 ,

wherein the second surface of the first element and the second surface of the second element form portions of the second surface of the packaged component.

3. The packaged component of claim 1 ,

wherein the second element is a semiconductor base chip.

4. The packaged component of claim 1 , comprising:

a fourth element mounted on the first surface of the second element and electrically connected to one or more portions of the first surface of the second element.

5. The packaged component of claim 4 ,

wherein the fourth element is electrically connected to the one or more portions of the first surface of the second element through one or more respectively corresponding electrically-conductive structures.

6. The packaged component of claim 1 , comprising:

an encapsulating element covering portions of the first element, the second element, and the third element.

7. The packaged component of claim 1 ,

wherein the third element electrically connects a portion of the first surface of the first element to a portion of the first surface of the second element.

8. A packaged component having a first surface and an opposite second surface, the packaged component comprising:

a first electrically-conductive element having a first surface and an opposite second surface, wherein the first electrically-conductive element comprises a portion of a lead-frame, wherein the lead-frame is part of a lead-frame panel which includes a plurality of pockets, wherein most of a peripheral region of an individual pocket includes a plurality of leads that extend from the lead-frame panel towards the individual pocket;

a semiconductor element having a first surface and an opposite second surface; and

a second electrically-conductive element connecting the first electrically-conductive element to the semiconductor element;

wherein the second surface of the first electrically-conductive element and the second surface of the semiconductor element are substantially co-planar; and

wherein a first distance from the second surface of the first electrically-conductive element to the first surface of the first electrically-conductive element is greater than or equal to a second distance from a plane through the second surface of the first electrically-conductive element to a plane through the second surface of the semiconductor element, wherein the first distance is measured in a direction normal to the first surface of the first electrically-conductive element to the second surface of the first electrically-conductive element.

9. The packaged component of claim 8 ,

wherein the second surface of the first electrically-conductive element is adjacent to the second surface of the packaged component; and

wherein the second surface of the semiconductor element is adjacent to the second surface of the packaged component.

10. The packaged component of claim 8 ,

wherein the second surface of the first electrically-conductive element and the second surface of the semiconductor element form portions of the second surface of the packaged component.

11. The packaged component of claim 8 , wherein the semiconductor element is a first semiconductor element, the packaged component comprising:

a second semiconductor element mounted on the first surface of the first semiconductor element and electrically connected to one or more portions of the first surface of the first semiconductor element.

12. The packaged component of claim 11 ,

wherein the second semiconductor element is electrically connected to the one or more portions of the first surface of the first semiconductor element through one or more respectively corresponding electrically-conductive structures.

13. The packaged component of claim 12 , comprising:

an encapsulating element covering portions of the first electrically-conductive element, the semiconductor element, and the second electrically-conductive element.

14. A system comprising a power source and a component coupled to the power source, the component including:

a first element having a first surface and an opposite second surface, wherein the first element comprises a portion of a lead-frame, wherein the lead-frame is part of a lead-frame panel which includes a plurality of pockets, wherein most of a peripheral region of an individual pocket includes a plurality of leads that extend from the lead-frame panel towards the individual pocket;

a second element having a first surface and an opposite second surface; and

a third element electrically connecting a portion of the first element to a portion of the second element,

wherein the second surface of the first element is adjacent to a second surface of the component;

wherein the second surface of the first element and the second surface of the second element are substantially co-planar;

wherein the second surface of the second element is adjacent to the second surface of the component, and

wherein a first distance measured in a direction normal to the first surface of the first element to the second surface of the first element is greater than or equal to a second distance from a plane through the second surface of the first element to a plane through the second surface of the second element.

15. The system of claim 14 , wherein the second surface of the first element and the second surface of the second element form portions of the second surface of the component.

16. The system of claim 14 , comprising:

an encapsulating element covering portions of the first element, the second element, and the third element,

wherein the second element is a semiconductor base chip; and

wherein the third element electrically connects a portion of the first surface of the first element to a portion of the first surface of the second element.

17. The system of claim 14 , comprising:

a fourth element mounted on the first surface of the second element and electrically connected to one or more portions of the first surface of the second element,

wherein the fourth element is electrically connected to the one or more portions of the first surface of the second element through one or more respectively corresponding electrically-conductive structures.

18. The packaged component of claim 4 , wherein:

a central region of the individual pocket corresponds with a hole for chip attachment;

the second element is positioned in the hole;

the second element comprises a programmable interposer which includes an integrated circuit;

the plurality of leads in the individual pocket are not in contact with the second element; and

the fourth element is connected face-to-face with the second element.

19. The packaged component of claim 18 , wherein:

the plurality of leads has different sizes, shapes and/or pitches;

the second element is connected to at least one lead of the plurality of leads via a bonding wire; and

the bonding wire is encapsulated in a molding compound such that most of a top surface of the fourth element is free from the molding compound.

20. The packaged component of claim 1 comprises a layer of adhesive between a bottom surface of the lead-frame panel and a carrier.