Perpendicular exchange bias with antiferromagnet for spin orbit coupling based memory
An apparatus is provided which comprises: a magnetic junction including: a first structure comprising a magnet with an unfixed perpendicular magnetic anisotropy (PMA) relative to an x-y plane of a device; a second structure comprising one of a dielectric or metal; a third structure comprising a magnet with fixed PMA, wherein the third structure has an anisotropy axis perpendicular to the plane of the device, and wherein the third structure is adjacent to the second structure such that the second structure is between the first and third structures; a fourth structure comprising an antiferromagnetic (AFM) material, the fourth structure adjacent to the third structure; a fifth structure comprising a magnet with PMA, the fifth structure adjacent to the fourth structure; and an interconnect adjacent to the first structure, the interconnect comprising spin orbit material.
1. An apparatus comprising:
a magnetic junction comprising:
a first structure comprising a magnet with an unfixed perpendicular magnetic anisotropy (PMA) relative to a plane of the magnet;
a second structure comprising one of a dielectric or metal;
a third structure comprising a magnet with fixed PMA, wherein the third structure has an anisotropy axis perpendicular to the plane, and wherein the third structure is adjacent to the second structure such that the second structure is between the first and third structures;
a fourth structure comprising an antiferromagnetic (AFM) material, the fourth structure adjacent to the third structure; and
a fifth structure comprising a magnet with PMA, the fifth structure adjacent to the fourth structure; and
an interconnect adjacent to the first structure, the interconnect comprising spin orbit material.
2. The apparatus of claim 1 , wherein the magnetic junction comprises a sixth structure between the first and second structures, wherein the sixth structure comprises one or more of Ru, Os, Hs, or Fe.
3. The apparatus of claim 1 , wherein the magnetic junction comprises a sixth structure between the second and third structures, wherein the sixth structure comprises one or more of Ru, Os, Hs, or Fe.
4. The apparatus of claim 1 , wherein the AFM material comprises one of Cr, La, Cu, Tm, Zn, Cl, F, K, N, Ir, Pt, Mn, Pd, Bi, Fe, or O.
5. The apparatus of claim 1 , wherein the AFM material is a quasi-two-dimensional triangular AFM comprising Ni (1-x) M x Ga 2 S 4 , where ‘M’ comprises one of Mn, Fe, Co or Zn.
6. The apparatus of claim 1 , wherein the fourth structure comprises one or more of Co, Fe, Ni, Mn, Ga, or Ge.
7. The apparatus of claim 1 , wherein:
the first and/or third structures comprises a stack comprising a first material and a second material different from the first material;
the first material comprises one of Co, Ni, Fe, or Heusler alloy;
the Heusler alloy comprises one or more of Co, Cu, Fe, Ga, Ge, In, Mn, Al, In, Sb, Si, Sn, Ni, Pd, Ru, or V;
the second material comprises one of: Pt, Pd, Jr, Ru, or Ni; and
the first material has a thickness in a range of 0.6 nm to 2 nm, and the second material has a thickness in a range of 0.1 nm to 3 nm.
8. The apparatus of claim 1 , wherein the dielectric comprises Mg and O.
9. The apparatus of claim 1 , wherein the first and/or the third structures comprises a super lattice comprising a first material and a second material, wherein the first material comprises one of Co, Ni, Fe, or Heusler alloy, and wherein the second material comprises one of Pt, Pd, Jr, Ru, or Ni.
10. The apparatus of claim 1 , wherein the first and/or third structures comprises a stack of three materials comprising a first material adjacent to the interconnect, a second material adjacent to the first material but not in contact with the interconnect, and third material adjacent to the second material and the second structure, wherein the first material comprises one or more of Co, Ni, Fe, or Heusler alloy, wherein the second material comprises Ru, and wherein the third material comprises one or more of Co, Ni, Fe, or Heusler alloy.
11. The apparatus of claim 1 , wherein:
the spin orbit material comprises one or more of β-Tantalum (β-Ta), Ta, β-Tungsten (β-W), W, Platinum (Pt), Copper (Cu) doped with elements including one of Iridium, Bismuth or elements of 3d, 4d, 5d and 4f, 5f periodic groups, Ti, S, W, Mo, Se, B, Sb, Re, La, C, P, La, As, Sc, O, Bi, Ga, Al, Y, In, Ce, Pr, Nd, F, Jr, Mn, Pd, or Fe; or
the spin orbit material comprises one of a 2D material or a 3D material.
12. The apparatus of claim 1 , wherein the spin orbit material comprises materials that exhibit Rashba-Bychkov effect.
13. The apparatus of claim 1 , wherein the interconnect comprises a layer comprising AFM material.
14. The apparatus of claim 1 , wherein the magnetic junction is one of a spin valve or a magnetic tunneling junction (MTJ).
15. An apparatus comprising:
a magnetic junction comprising a magnet with an unfixed perpendicular magnetic anisotropy (PMA) relative to a plane of the magnet;
an interconnect adjacent to the magnet of the magnetic junction, wherein the interconnect comprises a spin orbit material; and
a structure adjacent to the interconnect such that the magnetic junction and structure are on opposite surfaces of the interconnect, wherein the structure comprises a magnet with PMA.
16. The apparatus of claim 15 , wherein the structure is a first structure, wherein the apparatus comprises a second structure comprising an antiferromagnetic (AFM) material, and wherein the second structure is adjacent to a fixed magnet of the magnetic junction.
17. The apparatus of claim 16 , wherein the AFM material comprises one of Cr, La, Cu, Tm, Zn, Cl, F, K, N, Ir, Pt, Mn, Pd, Bi, Fe, or O.
18. The apparatus of claim 15 , wherein:
the spin orbit material comprises one or more of β-Tantalum (β-Ta), Ta, β-Tungsten (β-W), W, Platinum (Pt), Copper (Cu) doped with elements including one of Iridium, Bismuth or elements of 3d, 4d, 5d and 4f, 5f periodic groups, Ti, S, W, Mo, Se, B, Sb, Re, La, C, P, La, As, Sc, O, Bi, Ga, Al, Y, In, Ce, Pr, Nd, F, Ir, Mn, Pd, or Fe; or
the spin orbit material comprises one of a 2D material or a 3D material.
19. A system comprising:
a processor;
a memory coupled to the processor, the memory comprising:
a magnetic junction comprising a magnet with an unfixed perpendicular magnetic anisotropy (PMA) relative to a plane of the magnet;
an interconnect adjacent to the magnet of the magnetic junction, wherein the interconnect comprises a spin orbit material; and
a structure adjacent to the interconnect such that the magnetic junction and structure are on opposite surfaces of the interconnect, wherein the structure comprises a magnet with PMA; and
a wireless interface to allow the processor to communicate with another device.
20. The system of claim 19 , wherein the structure is a first structure, wherein the apparatus comprises a second structure comprising an antiferromagnetic (AFM) material, and wherein the second structure is adjacent to a fixed magnet of the magnetic junction.