Method of fabricating flexible OLED display panel and flexible OLED display panel
A method of fabricating a flexible organic light-emitting diode (OLED) display panel, the method comprising the steps of: step S 1 , providing a rigid substrate on which a flexible base is formed; step S 2 , forming a thin film transistor array layer on the flexible base; step S 3 , forming an OLED display unit on the thin film transistor array layer; step S 4 , forming an encapsulation layer on the OLED display unit; step S 5 , forming a protective layer on the encapsulation layer, wherein the protective layer is adhered to a surface of the encapsulation layer away from the OLED display unit by a thermal sensitive adhesive; step S 6 , peeling off the rigid substrate, and completing a support film to be attached under the flexible base; step S 7 , removing the protective layer; and step S 8 , forming a protective cover on the encapsulation layer.
1. A method of fabricating a flexible organic light-emitting diode (OLED) display panel, the method comprising the steps of:
step S 1 , providing a rigid substrate on which a flexible base is formed;
step S 2 , forming a thin film transistor array layer on the flexible base;
step S 3 , forming an OLED display unit on the thin film transistor array layer;
step S 4 , forming an encapsulation layer on the OLED display unit;
step S 5 , forming a protective layer on the encapsulation layer, wherein the protective layer is adhered to a surface of the encapsulation layer away from the OLED display unit by a thermal sensitive adhesive, wherein the protective layer comprises the thermal sensitive adhesive, the thermal sensitive adhesive is coated on a surface of the encapsulation layer away from the OLED display unit, and the protective layer is formed on the thermal sensitive adhesive;
step S 6 , peeling off the rigid substrate, and completing a support film to be attached under the flexible base;
step S 7 , removing the protective layer; and
step S 8 , forming a protective cover on the encapsulation layer.
2. The method of fabricating a flexible OLED display panel of claim 1 , wherein the step of removing the protective layer employs heating or cooling the protective layer.
3. The method of fabricating a flexible OLED display panel of claim 2 , wherein the step of removing the protective layer comprises providing a heater to heat the protective layer.
4. The method of fabricating a flexible OLED display panel of claim 3 , wherein the heater temperature ranges from 30° C. to 85° C.
5. The method of fabricating a flexible OLED display panel of claim 2 , wherein the step of removing the protective layer comprises providing a refrigerator to cool the protective layer.
6. The method of fabricating a flexible OLED display panel of claim 5 , wherein the refrigerator temperature ranges from −40° C. to −20° C.
7. The method of fabricating a flexible OLED display panel of claim 1 , wherein a material of the flexible base is selected from one of polyimide, polycarbonate, polyether sulfone, polyethylene terephthalate, polyethylene naphthalate, polyaryl component, or glass fiber reinforced plastic.
8. A method of fabricating a flexible organic light-emitting diode (OLED) display panel, the method comprising the steps of:
step S 1 , providing a rigid substrate on which a flexible base is formed;
step S 2 , forming a thin film transistor array layer on the flexible base;
step S 3 , forming an OLED display unit on the thin film transistor array layer;
step S 4 , forming an encapsulation layer on the OLED display unit;
step S 5 , forming a protective layer on the encapsulation layer, wherein the protective layer is adhered to a surface of the encapsulation layer away from the OLED display unit by a thermal sensitive adhesive, and the protective layer comprises the thermal sensitive adhesive, wherein the protective layer comprises the thermal sensitive adhesive, the thermal sensitive adhesive is coated on a surface of the encapsulation layer away from the OLED display unit, and the protective layer is formed on the thermal sensitive adhesive;
step S 6 , peeling off the rigid substrate, and completing a support film to be attached under the flexible base;
step S 7 , removing the protective layer, which employs heating or cooling the protective layer; and
step S 8 , forming a protective cover on the encapsulation layer.
9. The method of fabricating a flexible OLED display panel of claim 8 , wherein the step S 7 comprises providing a heater to heat the protective layer.
10. The method of fabricating a flexible OLED display panel of claim 9 , wherein the heater temperature ranges from 30° C. to 85° C.
11. The method of fabricating a flexible OLED display panel of claim 8 , wherein the step S 7 comprises providing a refrigerator to cool the protective layer.
12. The method of fabricating a flexible OLED display panel of claim 11 , wherein the refrigerator temperature ranges from −40° C. to −20° C.
13. The method of fabricating the flexible OLED display panel of claim 1 , wherein the encapsulation layer comprises silicon oxide and/or silicon, a resin film, an alternately stacked structure of at least one organic film and at least one inorganic film.