Electronic component package

1. An electronic component package comprising:

a housing including a flow path disposed on one surface thereof; and

an inlet and an outlet disposed in the housing,

wherein the flow path includes a first region connected to the inlet and a second region connected to the outlet, wherein the first region includes a tapered portion connected to the inlet,

wherein the first region includes a guide within the tapered portion,

wherein the guide is a continuous structure that includes:

a first end portion which faces the inlet;

a second end portion disposed opposite to the first end portion; and

a bent portion disposed between the first end portion and the second end portion of the continuous structure,

wherein, as a distance from the inlet increases, the tapered portion becomes bent so that a distance from the second region to the tapered portion increases,

wherein an inner sidewall of the tapered portion intersects a central axis of the inlet at an intersection point of the inner sidewall, the intersection point of the inner sidewall intersects another axis perpendicular to the central axis, and the another axis intersects the guide between the first end portion and the second end portion, wherein the central axis of the inlet intersects the second end portion of the guide,

wherein a width of the bent portion of the guide is wider than a width of the first end portion of the guide, and the width of the bent portion of the guide is wider than a width of the second end portion of the guide,

wherein the first end portion of the guide bisects the tapered portion in a width direction of the tapered portion, and,

wherein a width of the tapered portion increases as a distance from the inlet increases.

2. The electronic component package of claim 1 , wherein the guide extends toward the second region.

3. The electronic component package of claim 1 , further comprising a plurality of electronic components disposed on another surface of the housing.

4. The electronic component package of claim 3 , wherein the electronic components include at least one of a switch, a transformer, and a diode.

5. The electronic component package of claim 3 , further comprising:

a first cover which covers the another surface; and

a second cover which covers the one surface.

6. The electronic component package of claim 3 , further comprising a plurality of radiation fins formed to protrude from the another surface,

wherein the radiation fins are disposed in a region which overlaps a region in which the electronic components are mounted.