Method for producing at least one recess in a material by means of electromagnetic radiation and subsequent etching process
A method for creating at least one recess, in particular an aperture, in a transparent or transmissive material, includes: selectively modifying the material along a beam axis by electromagnetic radiation; and creating the at least one recess by one or more etching steps, using different etching rates in a modified region and in non-modified regions. The electromagnetic radiation produces modifications having different characteristics in the material along the beam axis such that the etching process in the material is heterogeneous and the etching rates differ from one another in regions modified with different characteristics under unchanged etching conditions.
1. A method for creating at least one recess, in particular an aperture, in a transparent or transmissive material, comprising:
selectively modifying the material along a beam axis by a beam of electromagnetic radiation; and
creating the at least one recess by one or more etching steps, using different etching rates in a modified region and in non-modified regions,
wherein the beam of electromagnetic radiation produces modifications in different regions along the beam axis having different characteristics in the material such that an etching process in the material is heterogeneous and etching rates in the different regions along the beam axis differ from one another under unchanged etching conditions,
wherein the different characteristics of the modifications are achieved by varying at least one parameter of the beam of electromagnetic radiation across the different regions along the beam axis, the at least one parameter comprising at least one of a pulse energy, a beam shape, or an intensity.
2. The method according to claim 1 , wherein the different characteristics of the modifications are achieved by varying the beam shape of the beam of electromagnetic radiation across the different regions along the beam axis by phase modulation.
3. The method according to claim 1 , wherein a cycle of modification and etching treatment of the material is performed several times.
4. The method according to claim 1 , wherein the one or more etching steps comprise a plurality of etching steps with different etching conditions.
5. The method according to claim 1 , wherein the material comprising a plate-shaped material, and
wherein a surface of the plate-shaped material is covered with an etching resist at least in sections and is thereby protected from the etching attack in one or more subsequent etching processes.
6. The method according to claim 1 , wherein by selecting the at least one parameter of the beam of electromagnetic radiation, an opening angle is adjusted to less than 5° and/or a diameter of the recess is adjusted.
7. The method according to claim 1 , wherein by varying the at least one parameter of the beam of electromagnetic radiation across the different regions along the beam axis, a difference between a first opening angle in a first region and a second opening angle in a second region due to the modifications having different characteristics is more than 10°.
8. The method according to claim 1 , wherein the different characteristics of the modifications are achieved by using a plurality of electromagnetic radiation pulses having at least one different parameter.
9. The method according to claim 1 , wherein the different characteristics of the modifications are achieved by using a single electromagnetic radiation pulse having a varying power profile along a laser propagation direction.