Method of manufacturing a waveguide comprising stacking dielectric layers having aligned metallized channels formed therein to form the waveguide

1. A method of manufacturing a waveguide, the method comprising:

forming a first channel in a first layer of first dielectric material, the first channel comprising one or more first channel walls;

forming a second channel in a second layer of second dielectric material, the second channel comprising one or more second channel walls;

depositing electrically conductive material on the one or more first channel walls of the first channel;

depositing electrically conductive material on the one or more second channel walls of the second channel;

arranging the first layer adjacent to the second layer to form a stack with the first channel axially aligned with and facing the second channel; and

heating the stack so that the conductive material on the one or more first channel walls of the first channel and the conductive material on the one or more second channel walls of the second channel connect to form the waveguide,

wherein the first dielectric material and the second dielectric material comprise ceramic material.

2. The method of claim 1 , wherein forming the first channel comprises—

boring a hole extending from a top surface of the first layer to the first channel; and

depositing electrically conductive material in the hole or on a surface of the hole so that the electrically conductive material in the hole forms a via during the heating of the stack.

3. The method of claim 2 , further comprising connecting a circuit component on the top surface of the first layer to the via.

4. The method of claim 1 , further comprising electrically connecting a first end of the waveguide to a circuit component on a top surface of the first layer.

5. The method of claim 4 , further comprising electrically connecting a second end of the waveguide to an antenna.

6. The method of claim 5 , wherein the antenna is positioned on the top surface of the first layer.

7. The method of claim 1 , wherein forming the first channel comprises—

metallizing a portion of a first sheet of the first dielectric material;

laminating a second sheet of the first dielectric material on the first sheet of the first dielectric material so that the metallized portion of the first sheet is between the first sheet and the second sheet to form the first dielectric layer; and

removing a portion of the second sheet along a first axis to expose the metallized portion of the first sheet and to form the first channel, wherein the one or more first channel walls of the first channel comprise one or more side walls extending from the metallized portion of the first sheet.

8. The method of claim 7 , wherein forming the second channel comprises—

metallizing a portion of a third sheet of the second dielectric material;

laminating a fourth sheet of the second dielectric material on the third sheet of the second dielectric material so that the metallized portion of the third sheet is between the third sheet and the fourth sheet to form the second dielectric layer; and

removing a portion of the fourth sheet along a second axis to expose the metallized portion of the third sheet and to form the second channel, wherein the one or more second channel walls of the second channel comprise one or more side walls extending from the metallized portion of the third sheet.

9. The method of claim 8 , wherein removing the portion of the second sheet and removing the portion of the fourth sheet comprise machining the second sheet and the fourth sheet.

10. The method of claim 8 , wherein depositing the electrically conductive material on the one or more first channel walls and depositing the electrically conductive material on the one or more second channel walls comprise depositing electrically conductive material only on the one or more side walls of the first channel and on the one or more side walls of the second channel.

11. The method of claim 1 , further comprising—

metallizing an end of the waveguide; and

attaching a metal flange to the metallized end of the waveguide.

12. A method of manufacturing a buried waveguide, the method comprising:

metallizing a portion of a first sheet of first dielectric material;

laminating a second sheet of second dielectric material on the first sheet of first dielectric material so that the metallized portion of the first sheet is between the first sheet and the second sheet to form a first dielectric layer;

removing a portion of the second sheet along a first axis to expose the metallized portion of the first sheet and to form a first channel comprising one or more side walls extending from the metallized portion of the first sheet;

metallizing a portion of a third sheet of third dielectric material;

laminating a fourth sheet of fourth dielectric material on the third sheet of third dielectric material so that the metallized portion of the third sheet is between the third sheet and the fourth sheet to form a second dielectric layer;

removing a portion of the fourth sheet along a second axis to expose the metallized portion of the third sheet and to form a second channel comprising one or more side walls extending from the metallized portion of the third sheet;

depositing electrically conductive material on the one or more side walls of the first channel;

depositing electrically conductive material on the one or more side walls of the second channel;

depositing a secondary material in the first channel and in the second channel;

positioning the first dielectric layer adjacent to the second dielectric layer with the first channel facing the second channel so that the first axis is parallel to the second axis to form a stack; and

heating the stack so that the electrically conductive material in the first channel and the electrically conductive material in the second channel form the waveguide.

13. The method of claim 12 , further comprising—

boring a hole extending from a top surface of the first sheet to the metallized portion; and

depositing electrically conductive material in the hole.

14. The method of claim 12 , wherein the secondary material comprises a fifth dielectric material.