Solid imaging element, control method for solid imaging element, and electronic apparatus

1. A solid imaging element, comprising:

a light reception element configured to output an electric signal in accordance with incident light;

a detection unit configured to:

detect whether a change quantity of the electric signal output from the light reception element has exceeded a threshold; and

output a detection signal expressing a detection result of the detection;

a temperature measurement unit configured to measure temperature; and

a setting unit configured to set the threshold based on the temperature measured by the temperature measurement unit.

2. The solid imaging element according to claim 1 , wherein the setting unit is further configured to set the threshold based on the temperature and the electric signal output from the light reception element.

3. The solid imaging element according to claim 2 , wherein the setting unit is further configured to set the threshold using a value based on a total of values of the electric signals output from at least two light reception elements.

4. The solid imaging element according to claim 2 , wherein the setting unit is further configured to set the threshold using a table in which the temperature, the value of the electric signal, and the threshold are associated with each other.

5. The solid imaging element according to claim 1 , wherein

the detection unit is further configured to detect whether the change quantity in a direction where a value of the electric signal decreases has exceeded a first threshold in that direction, and whether the change quantity in a direction where the value of the electric signal increases has exceeded a second threshold in that direction, and

the setting unit is further configured to:

set the first threshold based on the temperature and the value of the electric signal using a first table in which the temperature, the value of the electric signal, and the first threshold are associated with each other, and

set the second threshold based on the temperature and the value of the electric signal using a second table in which the temperature, the value of the electric signal, and the second threshold are associated with each other.

6. The solid imaging element according to claim 1 , wherein the setting unit is further configured to set the threshold using a table in which the temperature and the threshold are associated with each other.

7. The solid imaging element according to claim 1 , wherein a plurality of the temperature measurement units are dispersedly disposed between an outer periphery of a substrate where the light reception element is disposed and a region of the substrate where the light reception element is disposed.

8. The solid imaging element according to claim 7 , wherein four of the temperature measurement units are respectively disposed at sides each including one vertex of the substrate that does not overlap.

9. The solid imaging element according to claim 1 , further comprising:

a first substrate; and

a second substrate that is stacked on the first substrate, wherein

the light reception element and a sensing unit, that senses the temperature, of the temperature measurement unit are disposed on the first substrate, and

at least a part of the detection unit and at least a part of the setting unit are disposed on the second substrate.

10. The solid imaging element according to claim 1 , further comprising:

a first substrate; and

a second substrate that is stacked on the first substrate, wherein

the light reception element is disposed on the first substrate, and

the temperature measurement unit, at least a part of the detection unit, and

at least a part of the setting unit are disposed on the second substrate.

11. The solid imaging element according to claim 10 , wherein a plurality of the temperature measurement units are dispersedly disposed between an outer periphery of the second substrate and a region of the second substrate where at least a part of the detection unit and at least a part of the setting unit are disposed.

12. The solid imaging element according to claim 10 , wherein four temperature measurement units are respectively disposed at sides of the second substrate each including one vertex that does not overlap.

13. A control method for a solid imaging element, comprising:

in the solid imaging element that comprises a light reception element, a detection unit, a temperature measurement unit, and a setting unit:

outputting, by the light reception element, an electric signal in accordance with incident light;

detecting, by the detection unit, whether a change quantity of the electric signal output from the light reception element has exceeded a threshold;

outputting, by the detection unit, detection signal expressing a detection result of the detection;

measuring, by the temperature measurement unit, a temperature; and

setting, by the setting unit, the threshold based on the temperature measured by the temperature measurement unit.

14. An electronic apparatus, comprising:

a solid imaging element including:

a light reception element configured to output an electric signal in accordance with incident light,

a detection unit configured to:

detect whether a change quantity of the electric signal output from the light reception element has exceeded a threshold; and

output a detection signal expressing a detection result of the detection,

a temperature measurement unit configured to measure temperature, and

a setting unit configured to set the threshold based on the temperature measured by the temperature measurement unit; and

a storage unit configured to store the detection signal output from the detection unit.