Incandescent bulb-type LED lamp having heat dissipation function
This application relates to an incandescent bulb-type LED lamp having a heat dissipation function. In one aspect, the LED lamp includes a globe forming an external shape of the lamp, and an LED module supported by a stem in which a gas injection portion is formed and installed inside the globe. The LED lamp may also include a power supply unit for supplying power to the LED module, and a base bonded to one side of the globe and connected to a socket to supply commercial power to the power supply unit. The LED lamp may further include a heat conduction member filled in an internal space formed by an inner surface of the base and a printed circuit board (PCB) of the power supply unit and configured to dissipate heat generated from the LED module and the power supply unit to the outside through the base.
1. An incandescent bulb-type LED lamp having a heat dissipation function, the incandescent bulb-type LED lamp comprising:
a globe forming an external shape of the lamp;
an LED module supported by a stem in which a gas injection portion is formed and installed inside the globe;
a power supply unit configured to supply power to the LED module;
a base bonded to one side of the globe and connected to a socket to supply commercial power to the power supply unit; and
a heat conduction member filled in an internal space formed by an inner surface of the base and a printed circuit board (PCB) of the power supply unit, the heat conduction member configured to dissipate heat generated from the LED module and the power supply unit to the outside through the base,
wherein the heat conduction member is injected through an opening formed in an upper portion of the base after the base is bonded to the globe.
2. An incandescent bulb-type LED lamp having a heat dissipation function, the incandescent bulb-type LED lamp comprising:
a globe forming an external shape of the lamp;
an LED module supported by a stem in which a gas injection portion is formed and installed inside the globe;
a power supply unit configured to supply power to the LED module;
a base bonded to one side of the globe and connected to a socket to supply commercial power to the power supply unit; and
a heat conduction member filled in an internal space formed by an inner surface of the base and a printed circuit board (PCB) of the power supply unit, the heat conduction member configured to dissipate heat generated from the LED module and the power supply unit to the outside through the base,
wherein the heat conduction member is made of heat dissipating silicon.
3. An incandescent bulb-type LED lamp having a heat dissipation function, the incandescent bulb-type LED lamp comprising:
a globe forming an external shape of the lamp;
an LED module supported by a stem in which a gas injection portion is formed and installed inside the globe;
a power supply unit configured to supply power to the LED module;
a base bonded to one side of the globe and connected to a socket to supply commercial power to the power supply unit; and
a heat conduction member filled in an internal space formed by an inner surface of the base and a printed circuit board (PCB) of the power supply unit, the heat conduction member configured to dissipate heat generated from the LED module and the power supply unit to the outside through the base,
wherein the PCB of the power supply unit is formed with a gas injection hole into which the gas injection portion is inserted, and
wherein a sealing member is inserted between the gas injection portion and the gas injection hole of the PCB.
4. The incandescent bulb-type LED lamp of claim 1 , further comprising an insulating sheet supporting a + wire and a − wire between the power supply unit and a bonding surface,
wherein a hole into which the gas injection portion is inserted is formed in the center of the insulating sheet, and one or more cut-out lines are formed in predetermined directions from the hole such that a cut-out plate is attached to an outer surface of the gas injection portion while the gas injection portion is inserted into the hole.