Semiconductor devices, FinFET devices and methods of forming the same
Semiconductor devices, FinFET devices and methods of forming the same are disclosed. One of the semiconductor devices includes a substrate and a gate strip disposed over the substrate. The gate strip includes a high-k layer disposed over the substrate, an N-type work function metal layer disposed over the high-k layer, and a barrier layer disposed over the N-type work function metal layer. The barrier layer includes at least one first film containing TiAlN, TaAlN or AlN.
1. A semiconductor device, comprising:
a substrate; and
a gate strip disposed over the substrate and comprising:
a high-k layer disposed over the substrate;
an N-type work function metal layer disposed over the high-k layer; and
a barrier layer disposed over the N-type work function metal layer and comprising multiple first films, wherein the first films comprise TiAlN, TaAlN or AlN and have a gradient aluminum content that ranges from 10 at % to 90 at % and is gradually increased from a bottom surface of the barrier layer towards a top surface of the barrier layer, wherein the bottom surface of the barrier layer is close to the N-type work function metal layer and the top surface of the barrier layer is away from the N-type work function metal layer.
2. The semiconductor device of claim 1 , wherein one of the first films is in physical contact with the N-type work function metal layer.
3. The semiconductor device of claim 1 , wherein one of the first films is separated from the N-type work function metal layer.
4. The semiconductor device of claim 1 , wherein the barrier layer further comprises second films alternately stacked with the first films, and the second films contain TiN.
5. The semiconductor device of claim 1 , wherein an aluminum content of the first films ranges from 20 at % to 40 at %.
6. The semiconductor device of claim 1 , wherein an aluminum content of the first films ranges from 30 at % to 50 at %.
7. The semiconductor device of claim 1 , wherein the gate strip further comprises a P-type work function metal layer between the N-type work function metal layer and the high-k layer.
8. The semiconductor device of claim 1 , wherein the gate strip further comprise a metal filling layer over the barrier layer.
9. The semiconductor device of claim 1 , wherein the N-type work function metal layer comprises TiAl, TiAlC, TaAl, TaAlC or a combination thereof.
10. The semiconductor device of claim 1 , wherein the substrate has at least one fin extending in a first direction, and the gate strip is across the at least one fin and extends in a second direction different from the first direction.
11. The semiconductor device of claim 1 , wherein the substrate is a planar substrate without fins or a substrate with nanowires.
12. A semiconductor device, comprising:
a substrate; and
a gate strip disposed over the substrate and comprising:
a high-k layer disposed over the substrate;
a P-type work function metal layer disposed over the high-k layer; and
a barrier layer disposed over the P-type work function metal layer and comprising multiple first films, wherein the first films comprise TiAlN, TaAlN or AlN and have a gradient aluminum content ranging from 10 at % to 90 at %, wherein the barrier layer is separated from the P-type work function metal layer.
13. The semiconductor device of claim 12 , wherein the barrier layer comprises at least one TiN film between the first films.
14. The semiconductor device of claim 12 , wherein the barrier layer comprises three first films and two second films alternately stacked, and the second films contain TiN.
15. The semiconductor device of claim 12 , wherein the aluminum content of the first films is gradually increased from a bottom surface of the barrier layer towards a top surface of the barrier layer.
16. The semiconductor device of claim 12 , wherein the gate strip further comprises an N-type work function metal layer between the P-type work function metal layer and the high-k layer.
17. A semiconductor device, comprising:
a substrate having a first region and a second region;
a first gate strip disposed over the substrate in the first region and comprising:
a first high-k layer disposed over the substrate;
an N-type work function metal layer disposed over the first high-k layer; and
a first barrier layer disposed over the N-type work function metal layer and comprising TiAlN, TaAlN or AlN, wherein the first barrier layer is in physical contact with the N-type work function metal layer; and
a second gate strip disposed over the substrate in the second region and comprising:
a second high-k layer disposed over the substrate;
a P-type work function metal layer disposed over the second high-k layer; and
a second barrier layer disposed over the P-type work function metal layer and comprising multiple first films, wherein the first films comprise TiAlN, TaAlN or AlN and have a gradient aluminum content ranging from 10 at % to 90 at %, and the second barrier layer is separated from the P-type work function metal layer.
18. The semiconductor device of claim 17 , wherein the N-type work function metal layer comprises TiAl, TiAlC, TaAl, TaAlC or a combination thereof.
19. The semiconductor device of claim 17 , wherein the second barrier layer further comprises at least one TiN film between the first films.
20. The semiconductor device of claim 17 , wherein the second gate strip further comprises another N-type work function metal layer between the P-type work function metal layer and the second high-k layer.