High speed solid state micromachining device

1. A micromachining device, comprising:

a laser;

a moveable stage;

a microprocessor controller; and

a solid-state laser beam scanner comprising a control unit and a variable frequency electromagnetic signal generator electrically coupled to a substrate plate assembly comprised of at least one of a substantially transparent and partially conductive substrate plate having at least one generally planar face thereon with a series of quantum dots affixed with said substantially transparent and partially conductive substrate plate, each of a quantum dot in said series of quantum dots being of an arbitrary size, and each said quantum dot possessing an inducible dipole moment, and each said quantum dot in electrical contact with said substantially transparent and partially conductive substrate plate;

wherein said microprocessor controller is electrically connected to said moveable stage, said laser and said control unit; and

wherein said control unit provides a signal to excite said series of quantum dots on said substantially transparent and partially conductive substrate plate assembly to affect the scanning and steering of a laser beam through said substantially transparent and partially conductive substrate plate assembly; and

wherein each said quantum dot has a core and a shell affixed onto said core and at least one of a ligand affixed to said shell.

2. The micromachining device of claim 1 further comprising:

at least one of a spacer, and

wherein said substrate plate assembly has multiple said substantially transparent and partially conductive substrate plates arranged in parallel layers; and

wherein at least one of said spacers resides between adjacent said substantially transparent and partially conductive substrate plates.

3. The micromachining device of claim 1 wherein said shell is selected from the group of compound semiconductors comprising InP, CdS, ZnSe, GaAs, InGaP, any compound semiconductor from the II-VI, III-V, I-VII vertical columns in the periodic table, and doped intrinsic semiconductors such as Si.

4. The micromachining device of claim 1 further comprising:

at least one transparent conductive path on at least one of said substantially transparent and partially conductive substrate plates;

wherein said wire is a wire bundle of smaller conductors connected to an interconnect header on at least one of said substantially transparent and partially conductive substrate plates, said smaller conductors comprising individual metallic traces providing electrical contact through metalized conductive vias to said transparent conductive path.

5. The micromachining device of claim 4 further comprising:

a dielectric material between said substantially transparent and partially conductive substrate plates.

6. The micromachining device of claim 1 further comprising a focusing lens between said substantially transparent and partially conductive substrate plate assembly and said stage.

7. A micromachining device, comprising:

a laser;

a moveable stage;

a controller;

a solid-state laser beam scanner comprised of a control unit comprising a variable frequency electromagnetic signal generator coupled to an optical signal generator that is optically coupled to a substrate plate assembly comprised of at least one of a substantially transparent and partially conductive substrate plate having at least one generally planar face thereon with a series of quantum dots affixed with said substantially transparent and partially conductive substrate plate, each of a quantum dot in said series of quantum dots being of an arbitrary size, and each said quantum dot possessing an inducible dipole moment, and each said quantum dot in electrical contact with said substantially transparent and partially conductive substrate plate;

wherein said controller is electrically connected to said moveable stage, said laser and said control unit; and

wherein said control unit provides an electromagnetic signal to said optical signal generator to initiate the transmission of an optical signal to said substantially transparent and partially conductive substrate plate assembly to excite said series of quantum dots on said substrate plate assembly to steer and scan a laser beam passed through said substrate plate assembly; and wherein said quantum dots have a core and a shell affixed onto said core and at least one of a ligand affixed to said shell.

8. The micromachining device of claim 7 further comprising at least one of a spacer, and

wherein said substrate plate assembly has multiple said substantially transparent and partially conductive substrate plates arranged in a configuration of parallel layers; and

wherein said spacer resides between adjacent said substantially transparent and partially conductive substrate plates.

9. The micromachining device of claim 8 wherein said shell is selected from the group of compound semiconductors comprising InP, CdS, ZnSe, GaAs, InGaP, any compound semiconductor from the II-VI, III-V, I-VII vertical columns in the periodic table, and doped intrinsic semiconductors such as Si.

10. The micromachining device of claim 9 further comprising:

a dielectric material between said substantially transparent and partially conductive substrate plates.

11. The micromachining device of claim 10 further comprising a focusing lens between said substantially transparent and partially conductive substrate plate assembly and said stage.