Resist underlayer composition, and method of forming patterns using the composition

1. A resist underlayer composition, comprising:

a solvent; and

a polymer that includes a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2,

wherein, in Chemical Formula 1,

A is a substituted or unsubstituted C1 to C30 alkylene group, a substituted or unsubstituted C1 to C30 heteroalkylene group, a substituted or unsubstituted C3 to C30 cyclo alkylene group, a substituted or unsubstituted C2 to C30 heterocyclo alkylene group, a substituted or unsubstituted C6 to C30 arylene group, a substituted or unsubstituted C2 to C30 heteroarylene group, or a combination thereof,

X is a group including an electrophile having, at a terminal end thereof, an epoxy group, a C1 to C6 alkoxy group, R—(C═O)—, in which R is hydrogen or a C1 to C10 alkyl group, R′O—(C═O)—, in which R′ is a C1 to C10 alkyl group, or a halogen,

Y and Y′ are each independently a single bond, oxygen, carbonyl, —(CH 2 )O—, —(CH 2 )S—, —(CH 2 )NH—, or a combination thereof,

R 2 to R 9 are independently hydrogen, a hydroxy group, a halogen, a substituted or unsubstituted C1 to C10 alkoxy group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heteroaryl group, or a combination thereof,

a, b, c, and d are independently an integer of 0 to 100, a sum of a and b being 1 to 99, and a sum of c and d being 1 to 99, and

is a linking point,

wherein, in Chemical Formula 2, R 1 is a substituted or unsubstituted C1 to C30 alkylene group, a substituted or unsubstituted C1 to C30 heteroalkylene group, a substituted or unsubstituted C3 to C30 cycloalkylene group, a substituted or unsubstituted C6 to C30 arylene group, a substituted or unsubstituted C2 to C30 heteroarylene group, —((C m H 2m )O) n —, in which m and n are each independently an integer of 1 to 10, or a combination thereof,

E is a group including a nucleophile, and

is a linking point.

2. The resist underlayer composition as claimed in claim 1 , wherein in Chemical Formula 2, the moiety

is a moiety represented by Chemical Formula 2-I:

wherein, in Chemical Formula 2-I,

G and G′ are each independently a group including a nucleophile,

m and n are each independently an integer of 0 to 10, and

* is a linking point.

3. The resist underlayer composition as claimed in claim 2 , wherein G and G′ each independently include a hydroxy group (—OH), an amino group (—NH 2 ), a carboxyl group (—COOH), an amide group (—CONH 2 ), or a thiol group (—SH).

4. The resist underlayer composition as claimed in claim 1 , wherein in Chemical Formula 1, A is a substituted or unsubstituted C1 to C30 heteroalkylene group, a substituted or unsubstituted C2 to C30 heterocycloalkylene group, a substituted or unsubstituted C2 to C30 heteroarylene group, or a combination thereof.

5. The resist underlayer composition as claimed in claim 4 , wherein X of Chemical Formula 1 is bonded to at least one of a heteroatom or a carbon atom of A.

6. The resist underlayer composition as claimed in claim 1 , wherein the moiety

of Chemical Formula 1 is a moiety represented by one of Chemical Formulae 1-a to 1-c:

wherein, in Chemical Formulae 1-a to 1-c, X is defined the same as X of Chemical Formula 1.

7. The resist underlayer composition as claimed in claim 1 ,

wherein X is a group represented by Chemical Formula 1-II:

*—(CH 2 ) o -(Q) p -(CH 2 ) q —R a   [Chemical Formula 1-II]

wherein, in Chemical Formula 1-II,

o, p, and q are each independently an integer of 0 to 10,

Q is —O—, —S—, —(C═O)—, —(C═O)O—, —CH 2 NH—, —CONH—, —NH—, or —(SO 2 )—, and

R a is a group including an electrophile having an epoxy group, a C1 to C6 alkoxy group, R—(C═O)—, in which R is hydrogen or a C1 to C10 alkyl group, R′O—(C═O)—, in which R′ is hydrogen or a C1 to C10 alkyl group, or a halogen.

8. The resist underlayer composition as claimed in claim 1 , wherein E includes a hydroxy group (—OH), an amino group (—NH 2 ), a carboxyl group (—COOH), an amide group (—CONH 2 ), or a thiol group (—SH).

9. The resist underlayer composition as claimed in claim 1 , wherein the polymer includes a structural unit represented by one of Chemical Formula 3 to Chemical Formula 11:

10. The resist underlayer composition as claimed in claim 1 , wherein the polymer has a weight average molecular weight of about 1,000 to about 100,000.

11. The resist underlayer composition as claimed in claim 1 , wherein the polymer is included in an amount of about 0.1 wt % to about 50 wt %, based on a total weight of the resist underlayer composition.

12. The resist underlayer composition as claimed in claim 1 , further comprising an acryl resin, an epoxy resin, a novolac resin, a glycoluril resin, or a melamine resin.

13. The resist underlayer composition as claimed in claim 1 , further comprising a surfactant, a thermal acid generator, a plasticizer, or a combination thereof.

14. A method of forming patterns, the method comprising:

forming an etching subject layer on a substrate,

coating the resist underlayer composition as claimed in claim 1 on the etching subject layer to form a resist underlayer,

forming a photoresist pattern on the resist underlayer, and

sequentially etching the resist underlayer and the etching subject layer using the photoresist pattern as an etching mask.

15. The method as claimed in claim 14 , wherein forming the photoresist pattern includes:

forming a photoresist layer on the resist underlayer,

exposing the photoresist layer, and

developing the photoresist layer.

16. The method as claimed in claim 14 , wherein forming the resist underlayer further includes heat-treating the coated resist underlayer composition at a temperature of about 100° C. to about 500° C.

17. A resist underlayer composition, comprising:

a solvent; and

a polymer that includes a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2,

wherein, in Chemical Formula 1,

A is a substituted or unsubstituted C1 to C30 alkylene group, a substituted or unsubstituted C1 to C30 heteroalkylene group, a substituted or unsubstituted C3 to C30 cyclo alkylene group, a substituted or unsubstituted C2 to C30 heterocyclo alkylene group, a substituted or unsubstituted C6 to C30 arylene group, a substituted or unsubstituted C2 to C30 heteroarylene group, or a combination thereof,

X is a group including an electrophile,

Y and Y′ are each independently a single bond, oxygen, carbonyl, —(CH 2 )O—, —(CH 2 )S—, —(CH 2 )NH—, or a combination thereof,

R 2 to R 9 are independently hydrogen, a hydroxy group, a halogen, a substituted or unsubstituted C1 to C10 alkoxy group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heteroaryl group, or a combination thereof,

a, b, c, and d are independently an integer of 0 to 100, a sum of a and b being 1 to 99, and a sum of c and d being 1 to 99, and

is a linking point,

wherein, in Chemical Formula 2, R 1 is a substituted or unsubstituted C1 to C30 alkylene group, a substituted or unsubstituted C1 to C30 heteroalkylene group, a substituted or unsubstituted C3 to C30 cycloalkylene group, a substituted or unsubstituted C6 to C30 arylene group, a substituted or unsubstituted C2 to C30 heteroarylene group, —((C m H 2m )O) n —, in which m and n are each independently an integer of 1 to 10, or a combination thereof,

E includes an amino group (—NH 2 ), a carboxyl group (—COOH), an amide group (—CONH 2 ), or a thiol group (—SH), and

is a linking point.