Solid-state image sensor including first and second unit pixel groups with different structures
To generate a value unique to a device in a more preferable mode. A solid-state image sensor includes a plurality of unit pixels disposed in a two-dimensional array, and a drive control unit that controls a first drive to output signals from the unit pixels included in a first unit pixel group of the plurality of unit pixels as an image signal, and a second drive to detect variations in respective signals from two or more of the unit pixels included in a second unit pixel group of the plurality of unit pixels, in which the first unit pixel group and the second unit pixel group have different structures from each other.
1. A solid-state image sensor comprising:
a plurality of unit pixels disposed in a two-dimensional array; and
a drive controller configured to control a first drive to output signals from the unit pixels included in a first unit pixel group of the plurality of unit pixels as an image signal, and a second drive to detect variations in respective signals from two or more of the unit pixels included in a second unit pixel group of the plurality of unit pixels, wherein
the first unit pixel group and the second unit pixel group have different structures from each other,
the first unit pixel group and the second unit pixel group are different in electrical characteristics of at least a part of elements among one or more elements that the unit pixels included therein have in common,
the unit pixels included in each of the first unit pixel group and the second unit pixel group have photoelectric conversion units in common,
the first unit pixel group and the second unit pixel group are different in electrical characteristics of the photoelectric conversion units that the unit pixels have,
the first unit pixel group and the second unit pixel group are different in electrical characteristics of a semiconductor forming the photoelectric conversion units that the unit pixels included therein have in common, and
the first unit pixel group and the second unit pixel group are different in implantation angles of impurities into the semiconductor.
2. The solid-state image sensor according to claim 1 , wherein
the area in which the plurality of unit pixels are disposed includes an effective pixel region that is not shielded from light, and a light-shielded region that is shielded from light,
the first unit pixel group is disposed in the effective pixel region, and
the second unit pixel group is disposed in the light-shielded region.
3. The solid-state image sensor according to claim 2 , wherein
the second unit pixel group and a third unit pixel group including optical black (OPB) pixels as the unit pixels are disposed in the light-shielded region, and
the second unit pixel group and the third unit pixel group are different in structures.
4. The solid-state image sensor according to claim 1 , wherein
the first unit pixel group and the second unit pixel group are different in circuit configurations of the unit pixels included therein.
5. The solid-state image sensor according to claim 4 , wherein
the unit pixels included in the first unit pixel group each have:
a capacitor that converts a charge to a voltage;
an initialization circuit that initializes a potential of the capacitor to a predetermined potential;
a transfer circuit that is interposed between the photoelectric conversion unit and the capacitor, and transfers charges generated in the photoelectric conversion unit to the capacitor;
an amplification circuit that amplifies and reads the potential of the capacitor; and
a selection circuit that controls transmission of output of the amplification circuit, and
the unit pixels included in the second unit pixel group does not have at least one of the transfer circuit, the capacitor, or the initialization circuit.
6. The solid-state image sensor according to claim 4 , wherein
the first unit pixel group and the second unit pixel group are different in a structure of at least a part of elements among one or more elements that the unit pixels included therein have in common.
7. The solid-state image sensor according to claim 6 , wherein
the first unit pixel group and the second unit pixel group are different in a structure of an impurity layer that covers the photoelectric conversion units that the unit pixels have.
8. The solid-state image sensor according to claim 7 , wherein
the first unit pixel group and the second unit pixel group are different in at least either of a shape and a size of the impurity layer.
9. The solid-state image sensor according to claim 6 , wherein
the unit pixels included in each of the first unit pixel group and the second unit pixel group have transistors in common, and
the first unit pixel group and the second unit pixel group are different in structures of the transistors that the unit pixels have.
10. The solid-state image sensor according to claim 9 , wherein
the first unit pixel group and the second unit pixel group are different in at least one of a shape, a size, or a number of gates of the transistors.
11. The solid-state image sensor according to claim 6 , wherein
the unit pixels included in each of the first unit pixel group and the second unit pixel group have capacitors in common, and
the first unit pixel group and the second unit pixel group are different in structures of the capacitors that the unit pixels have.
12. The solid-state image sensor according to claim 11 , wherein
the first unit pixel group and the second unit pixel group are different in at least one of a shape, a size, or a number of the capacitors.
13. The solid-state image sensor according to claim 1 , wherein
the first unit pixel group and the second unit pixel group are different in electrical connection relationships among the respective elements included therein.
14. The solid-state image sensor according to claim 13 , wherein
the first unit pixel group and the second unit pixel group are different in wiring patterns for applying a voltage to a gate of a transistor included in each of the unit pixels included in the first unit pixel group and the second unit pixel group.
15. The solid-state image sensor according to claim 1 , wherein
the first unit pixel group and the second unit pixel group are different in a structure of a semiconductor forming the photoelectric conversion units that the unit pixels included therein have in common.
16. The solid-state image sensor according to claim 1 , wherein
the first unit pixel group and the second unit pixel group are different in implantation energy of impurities into the semiconductor.
17. The solid-state image sensor according to claim 1 , wherein
the first unit pixel group and the second unit pixel group are different in amounts of impurities implanted into the semiconductor.
18. The solid-state image sensor according to claim 1 , wherein
the first unit pixel group and the second unit pixel group are different in distributions of impurities implanted into the semiconductor.
19. The solid-state image sensor according to claim 1 , wherein
the first unit pixel group and the second unit pixel group are different in electrical characteristics of an impurity layer that covers the photoelectric conversion units that the unit pixels have.
20. The solid-state image sensor according to claim 19 , wherein
the first unit pixel group and the second unit pixel group are different in concentrations of impurities contained in the impurity layer.
21. The solid-state image sensor according to claim 1 , wherein
the unit pixels included in each of the first unit pixel group and the second unit pixel group have transistors in common, and
the first unit pixel group and the second unit pixel group are different in electrical characteristics of the transistors that the unit pixels have.
22. A solid-state image sensor comprising:
a plurality of unit pixels disposed in a two-dimensional array; and
a drive controller configured to control a first drive to output signals from the unit pixels included in a first unit pixel group of the plurality of unit pixels as an image signal, and a second drive to detect variations in respective signals from two or more of the unit pixels included in a second unit pixel group of the plurality of unit pixels, wherein
the first unit pixel group and the second unit pixel group have different structures from each other,
the first unit pixel group and the second unit pixel group are different in electrical characteristics of at least a part of elements among one or more elements that the unit pixels included therein have in common,
the unit pixels included in each of the first unit pixel group and the second unit pixel group have transistors in common,
the first unit pixel group and the second unit pixel group are different in electrical characteristics of the transistors that the unit pixels have, and
the first unit pixel group and the second unit pixel group are different in thicknesses of gate insulating films of the transistors that the unit pixels included therein have in common.
23. The solid-state image sensor according to claim 22 , wherein
the first unit pixel group and the second unit pixel group are different in electrical characteristics of a semiconductor forming the transistors that the unit pixels included therein have in common.
24. The solid-state image sensor according to claim 22 , wherein
the unit pixels included in the first unit pixel group each have:
a photoelectric conversion unit;
a capacitor that converts a charge to a voltage;
an initialization circuit that initializes a potential of the capacitor to a predetermined potential;
a transfer circuit that is interposed between the photoelectric conversion unit and the capacitor, and transfers a charge generated in the photoelectric conversion unit to the capacitor;
an amplification circuit that amplifies and reads out the potential of the capacitor; and
a selection circuit that controls transmission of the output of the amplification circuit, and the transistor constitutes either the amplification circuit or the initialization circuit.
25. A solid-state image sensor comprising:
a plurality of unit pixels disposed in a two-dimensional array; and
a drive controller configured to control a first drive to output signals from the unit pixels included in a first unit pixel group of the plurality of unit pixels as an image signal, and a second drive to detect variations in respective signals from two or more of the unit pixels included in a second unit pixel group of the plurality of unit pixels, wherein
the first unit pixel group and the second unit pixel group have different structures from each other,
the first unit pixel group and the second unit pixel group are different in electrical characteristics of at least a part of elements among one or more elements that the unit pixels included therein have in common,
the unit pixels included in each of the first unit pixel group and the second unit pixel group have transistors in common,
the first unit pixel group and the second unit pixel group are different in electrical characteristics of the transistors that the unit pixels have, and
the first unit pixel group and the second unit pixel group are different in materials forming gate insulating films of the transistors that the unit pixels included therein have in common.
26. The solid-state image sensor according to claim 25 , wherein
the first unit pixel group and the second unit pixel group are different in electrical characteristics of a semiconductor forming the transistors that the unit pixels included therein have in common.
27. The solid-state image sensor according to claim 25 , wherein
the unit pixels included in the first unit pixel group each have:
a photoelectric conversion unit;
a capacitor that converts a charge to a voltage;
an initialization circuit that initializes a potential of the capacitor to a predetermined potential;
a transfer circuit that is interposed between the photoelectric conversion unit and the capacitor, and transfers a charge generated in the photoelectric conversion unit to the capacitor;
an amplification circuit that amplifies and reads out the potential of the capacitor; and
a selection circuit that controls transmission of the output of the amplification circuit, and the transistor constitutes either the amplification circuit or the initialization circuit.
28. A solid-state image sensor comprising:
a plurality of unit pixels disposed in a two-dimensional array; and
a drive controller configured to control a first drive to output signals from the unit pixels included in a first unit pixel group of the plurality of unit pixels as an image signal, and a second drive to detect variations in respective signals from two or more of the unit pixels included in a second unit pixel group of the plurality of unit pixels, wherein
the first unit pixel group and the second unit pixel group have different structures from each other,
the first unit pixel group and the second unit pixel group are different in electrical characteristics of at least a part of elements among one or more elements that the unit pixels included therein have in common,
the unit pixels included in each of the first unit pixel group and the second unit pixel group have transistors in common,
the first unit pixel group and the second unit pixel group are different in electrical characteristics of the transistors that the unit pixels have, and
the first unit pixel group and the second unit pixel group are different in stacked structures of gate insulating films of the transistors that the unit pixels included therein have in common.
29. The solid-state image sensor according to claim 28 , wherein
the first unit pixel group and the second unit pixel group are different in electrical characteristics of a semiconductor forming the transistors that the unit pixels included therein have in common.
30. The solid-state image sensor according to claim 28 , wherein
the unit pixels included in the first unit pixel group each have:
a photoelectric conversion unit;
a capacitor that converts a charge to a voltage;
an initialization circuit that initializes a potential of the capacitor to a predetermined potential;
a transfer circuit that is interposed between the photoelectric conversion unit and the capacitor, and transfers a charge generated in the photoelectric conversion unit to the capacitor;
an amplification circuit that amplifies and reads out the potential of the capacitor; and
a selection circuit that controls transmission of the output of the amplification circuit, and the transistor constitutes either the amplification circuit or the initialization circuit.