Display device and manufacturing method thereof
A display device includes a bending area at which the display device is bendable; an organic light emitting element disposed on the substrate; an encapsulation layer covering an upper surface and a side surface of the organic light emitting element; and a bending area protection layer covering the bending area of the substrate. The upper surface of the encapsulation layer includes a nano structure defined by nano sized protrusions and depressions of the upper surface, and along the substrate, and the bending area is disposed separated from the encapsulation layer.
1. A manufacturing method of a display device, comprising:
providing a substrate including a bending area at which the display device is bendable;
providing an encapsulation layer covering each of an upper surface and a side surface of the organic light emitting element, on the substrate;
providing both an upper protection layer on the encapsulation layer covering each of the upper surface and the side surface of the organic light emitting element, and a bending area protection layer on the bending area of the substrate; and
removing the upper protection layer from the encapsulation layer covering each of the upper surface and the side surface of the organic light emitting element,
wherein the providing both the upper protection layer and the bending area protection layer comprises respectively applying an ultraviolet ray curable material to the encapsulation layer and to the bending area of the substrate and curing the ultraviolet ray curable material, to form the upper protection layer and the bending area protection layer spaced apart from each other along the substrate.
2. The manufacturing method of claim 1 , wherein the ultraviolet ray curable material includes at least one among a polymer including acrylate, polyurethane, and an acrylate material including SiO.
3. The manufacturing method of claim 2 , wherein the providing both the upper protection layer and the bending area protection layer provides:
the upper protection layer having a maximum thickness of about 100 micrometers to about 150 micrometers, and
the bending area protection layer having a maximum thickness of about 50 micrometers to about 150 micrometers.
4. The manufacturing method of claim 3 , wherein the providing the upper protection layer comprises providing an individual layer of the ultraviolet ray curable material having a thickness of about 10 micrometers to about 20 micrometers and curing the individual layer, multiple times, to provide the upper protection layer having the maximum thickness of about 100 micrometers to about 150 micrometers.
5. The manufacturing method of claim 1 , further comprising forming an adhesive supporting layer which is between the substrate and the upper protection layer and with which the substrate is attached to the upper protection layer.
6. The manufacturing method of claim 5 , wherein the adhesive supporting layer includes at least one among a resin including an acryl material, a butyl rubber, a vinyl acetate resin, an ethylene vinyl acetate resin, a natural rubber, a nitrile, a siliceous resin, a silicon rubber, and a styrene block polymer.