IP Library › Granted Patent US 11,496,680
Granted Patent B2
US 11,496,680 · App. 16/612,014 · Granted Nov 8, 2022

Imaging unit

Inventor: Masashi Nakata (Kanagawa, JP)
Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
H04N5/23238G02B7/021G03B30/00H01L27/1469H01L27/14627H01L27/14632H01L27/14634H01L27/14685H04N5/23229H04N5/247A61B1/041G02B13/0045
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,496,680
App. No.
16/612,014
Granted
Nov 8, 2022
Kind
B2
Abstract

Provided is an imaging unit that includes two or more imaging devices that are different from each other in imaging direction, and a substrate formed with each of the imaging devices. The substrate has a coupler formed between the imaging devices. The imaging unit including the plurality of imaging devices is able to yield a high-quality image when capturing an image of a wide range.

Claims (24)

1. An imaging unit, comprising:

a logic circuit board;

a single substrate on the logic circuit board, wherein

the single substrate includes a first surface and a second surface opposite to the first surface, and

the logic circuit board is in contact with the second surface of the single substrate;

at least two imaging devices, wherein

each of the at least two imaging devices is on the first surface of the single substrate, and

an imaging direction of a first imaging device of the at least two imaging devices is different from an imaging direction of a second imaging device of the at least two imaging devices; and

a coupler between the first imaging device and the second imaging device, wherein the coupler comprises a recess between the first imaging device and the second imaging device.

2. The imaging unit according to claim 1 , wherein the coupler is non-linear.

3. The imaging unit according to claim 2 , wherein the coupler is curved.

4. The imaging unit according to claim 1 , further comprising an output section configured to:

bundle outputs from the at least two imaging devices; and

output the bundled outputs.

5. The imaging unit according to claim 1 , further comprising an image combiner configured to:

align outputs from the at least two imaging devices; and

merge the aligned outputs.

6. The imaging unit according to claim 1 , further comprising at least two sensors configured to recognize a direction of movement of a respective imaging device of the at least two imaging devices.

7. The imaging unit according to claim 6 , further comprising an image combiner configured to:

align outputs from the at least two imaging devices; and

merge, based on outputs from the at least two sensors, the aligned outputs.

8. The imaging unit according to claim 1 , further comprising a structure that includes the at least two imaging devices stacked on the single substrate.

9. The imaging unit according to claim 1 , wherein each of the at least two imaging devices has pixels in a quadrilateral shape.

10. The imaging unit according to claim 1 , wherein each of the at least two imaging devices has pixels in a circular shape.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 8, 2019
From: NAKATA, MASASHI
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 050973/0200 →
Priority Claims (1)
JP JP2017-125092 · Jun 27, 2017 · national
Continuity (1)
Related Publication 20210144299A1 · May 13, 2021