IP Library › Granted Patent US 11,500,329
Granted Patent B2
US 11,500,329 · App. 17/341,211 · Granted Nov 15, 2022

Cartridge and manufacturing method of cartridge

Inventors: Akira Suzuki (Kanagawa, JP); Kaori Noguchi (Shizuoka, JP); Yasunori Toriyama (Shizuoka, JP)
Assignee: Canon Kabushiki Kaisha
G03G21/1878B41J2/1753B41J2/17559G03G15/0863G03G2215/0855
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Quick Facts
Patent No.
US 11,500,329
App. No.
17/341,211
Granted
Nov 15, 2022
Kind
B2
Abstract

A cartridge detachably attachable to an apparatus body of an image forming apparatus that forms an image on a recording medium in which a memory unit is fixed by an inexpensive adhesive member that can control adhesion force. The cartridge includes: a memory; and a memory support member that supports the memory. The memory has a semiconductor device storing information related to a cartridge, a sealing material that protects the semiconductor device, and a cartridge electrical contact configured to be electrically connectable to a body electrical contact of the image forming apparatus body for transferring information on the semiconductor device to the image forming apparatus body. The sealing material and the memory support member contain the same type of a thermoplastic resin, the sealing material and the memory support member have bonding faces, and at least parts of the bonding faces are welded and fixed by a solvent.

Claims (33)

1. A cartridge provided in a detachably attachable manner to an apparatus body of an image forming apparatus that forms an image on a recording medium, the cartridge comprising:

a memory; and

a memory support member that supports the memory,

wherein

the memory has:

a semiconductor device that stores information related to a cartridge,

a sealing material that protects the semiconductor device, the sealing material containing an inorganic filler and an epoxy resin, and

a cartridge electrical contact configured to be electrically connectable to a body electrical contact of the apparatus body in order to transfer information on the semiconductor device to the image forming apparatus body,

the sealing material and the memory support member contain the same type of a thermoplastic resin,

the sealing material and the memory support member have bonding faces, and

at least parts of the bonding faces are welded and fixed by a solvent.

2. The cartridge according to claim 1 , wherein the thermoplastic resin is a styrene-based resin.

3. The cartridge according to claim 2 , wherein the styrene-based resin is polystyrene.

4. The cartridge according to claim 1 , wherein the solvent is a terpene-based solvent.

5. The cartridge according to claim 4 , wherein the terpene-based solvent is d-limonene.

6. The cartridge according to claim 1 , wherein a content of the thermoplastic resin contained in the sealing material is 2 to 40% by mass with respect to the mass of the sealing material.

7. The cartridge according to claim 6 ,

wherein a content of the inorganic filler is 40 to 95% by mass with respect to the mass of the sealing material, and

wherein a content of the epoxy resin is 3 to 30% by mass with respect to the mass of the sealing material.

8. The cartridge according to claim 1 , wherein the memory support member has a groove in a grounding face facing the sealing material.

9. The cartridge according to claim 1 , wherein the sealing material has a groove in an opposite face facing the memory support member.

10. A manufacturing method of a cartridge,

wherein

the cartridge is a cartridge provided in a detachably attachable manner to an apparatus body of an image forming apparatus that forms an image on a recording medium,

the cartridge has a memory and a memory support member that supports the memory,

the memory has

a semiconductor device that stores information related to a cartridge,

a sealing material that protects the semiconductor device, the sealing material containing an inorganic filler and an epoxy resin, and

a cartridge electrical contact configured to be electrically connectable to a body electrical contact of the apparatus body in order to transfer information on the semiconductor device to the image forming apparatus body,

the sealing material and the memory support member contain the same type of a thermoplastic resin, and

the sealing material and the memory support member have bonding faces,

the manufacturing method comprising:

welding and fixing the sealing material and the memory support member by using a solvent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2021
From: SUZUKI, AKIRA; NOGUCHI, KAORI; TORIYAMA, YASUNORI
To: CANON KABUSHIKI KAISHA
Reel/Frame 056783/0202 →
Priority Claims (1)
JP JP2020-100670 · Jun 10, 2020 · national
Continuity (1)
Related Publication 20210389722A1 · Dec 16, 2021