IP Library › Granted Patent US 11,501,955
Granted Patent B2
US 11,501,955 · App. 17/164,703 · Granted Nov 15, 2022

Modular high-frequency source with integrated gas distribution

Inventors: Hanh Nguyen (San Jose, CA); Thai Cheng Chua (Cupertino, CA); Philip Allan Kraus (San Jose, CA)
Assignee: Applied Materials, Inc.
H01J37/3244H01J37/32082H01J2237/334H01J2237/335H01J2237/3321
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Quick Facts
Patent No.
US 11,501,955
App. No.
17/164,703
Granted
Nov 15, 2022
Kind
B2
Abstract

Embodiments described herein include an applicator frame for a processing chamber. In an embodiment, the applicator frame comprises a first major surface of the applicator frame and a second major surface of the applicator frame opposite the first major surface. In an embodiment, the applicator frame further comprises a through hole, wherein the through hole extends entirely through the applicator frame. In an embodiment, the applicator frame also comprises a lateral channel embedded in the applicator frame. In an embodiment the lateral channel intersects the through hole.

Claims (30)

1. A processing tool comprising:

a processing chamber;

a chuck for supporting a substrate in the processing chamber;

an applicator frame forming a portion of the processing chamber, wherein the applicator frame comprises:

a first major surface;

a second major surface opposite the first major surface;

a plurality of through holes, wherein the through holes extend entirely through the applicator frame; and

a plurality of lateral channels embedded in the applicator frame, wherein one or more of the lateral channels intersect at least one of the through holes; and

a modular high-frequency emission source, comprising:

a plurality of high-frequency emission modules, wherein each high-frequency emission module comprises:

an oscillator module;

an amplification module, wherein the amplification module is coupled to the oscillator module; and

an applicator, wherein the applicator is coupled to the amplification module, and wherein the applicator seals one end of one of the through holes in the applicator frame.

2. The processing tool of claim 1 , wherein each of the applicators seal one of the openings through the applicator frame by compressing a sealing ring.

3. The processing tool of claim 2 , wherein the applicator frame further comprises:

a plurality of recesses, wherein each recess is substantially concentric with one of the openings, and wherein the seal ring rests on a step surface defined by one of the recesses.

4. The processing tool of claim 1 , wherein the plurality of lateral channels are fluidically coupled to one or more gas sources.

5. The processing tool of claim 1 , wherein the applicator frame is a sidewall of the processing chamber or a lid of the processing chamber.

6. The processing tool of claim 1 , wherein the applicator frame comprises an electrically grounded layer.

7. The processing tool of claim 1 , further comprising a gas distribution plate proximate to the second major surface of the applicator frame.

8. A gas distribution assembly, comprising:

an applicator frame, wherein the applicator frame comprises:

a first major surface;

a second major surface opposite the first major surface;

a plurality of through holes, wherein the through holes extend entirely through the applicator frame; and

a plurality of lateral channels embedded in the applicator frame, wherein the lateral channels intersect at least one of the through holes; and

a plurality of applicators, wherein each applicator seals a first end of one of the plurality of through holes.

9. The gas distribution assembly of claim 8 , wherein each of the applicators seal one of the openings through the applicator frame by compressing a sealing ring.

10. The gas distribution assembly of claim 9 , wherein the applicator frame further comprises:

a plurality of recesses, wherein each recess is substantially concentric with one of the openings, and wherein the seal ring rests on a step surface defined by one of the recesses.

Continuity (2)
Division 15958562 · Apr 20, 2018
Related Publication 20210183621A1 · Jun 17, 2021