Wiring circuit board assembly sheet and producing method thereof

1. A wiring circuit board assembly sheet, comprising:

a product region and a margin region which partition the wiring circuit board assembly sheet;

wherein in the product region, a plurality of wiring circuit boards serve as products and are disposed in alignment, and the margin region surrounds the product region, with the margin region having a first area adjacent to the product region and a second area located at the opposite side of the product region with respect to the first area,

wherein the wiring circuit board assembly sheet includes a first dummy wiring circuit board and a second dummy wiring circuit board disposed in at least a portion of the first area and smaller than a wiring circuit board of the plurality of wiring circuit boards; and wherein the second dummy wiring circuit board is smaller than the first dummy wiring circuit board.

2. The wiring circuit board assembly sheet according to claim 1 , wherein

the first dummy wiring circuit board and the second dummy wiring circuit board are disposed in the entire first area.

3. The wiring circuit board assembly sheet according to claim 1 , wherein

the wiring circuit board includes a wiring made of a conductive layer; and

the first dummy wiring circuit board and the second dummy wiring circuit board each include a dummy wiring made of the conductive layer.

4. The wiring circuit board assembly sheet according to claim 3 , wherein

the wiring circuit board assembly sheet has a long shape,

has both end portions in a width direction perpendicular to a longitudinal direction and included in the second area, and

includes a conductive end portion disposed at both end portions in the width direction and made of the conductive layer.

5. The wiring circuit board assembly sheet according to claim 1 , wherein

the wiring circuit board includes a support substrate made of a metal-based layer, and

the first dummy wiring circuit board and the second dummy wiring circuit board each include a dummy support substrate made of the metal-based layer.

6. The wiring circuit board assembly sheet according to claim 5 , wherein

the wiring circuit board assembly sheet has a long shape,

has both end portions in a width direction perpendicular to a longitudinal direction and included in the second area, and

includes a metal-based end portion disposed at both end portions in the width direction and made of the metal-based layer.

7. A wiring circuit board assembly sheet, comprising:

a product region and a margin region which partition the wiring circuit board assembly sheet;

wherein in the product region, a plurality of wiring circuit boards serve as products and are disposed in alignment, and the margin region surrounds the product region, with the margin region having a first area adjacent to the product region and a second area located at the opposite side of the product region with respect to the first area, wherein

a wiring circuit board of the plurality of wiring circuit boards includes a wiring made of a conductive layer; and

the wiring circuit board assembly sheet has a long shape,

has both end portions in a width direction perpendicular to a longitudinal direction and included in the margin region, and

includes a conductive end portion disposed at both end portions in the width direction and made of the conductive layer;

wherein the wiring circuit board assembly sheet includes a first dummy wiring circuit board and a second dummy wiring circuit board disposed in at least a portion of the first area and smaller than the wiring circuit board; and

wherein the second dummy wiring circuit board is smaller than the first dummy wiring circuit board.

8. A wiring circuit board assembly sheet, comprising:

a product region and a margin region which partition the wiring circuit board assembly sheet;

wherein in the product region, a plurality of wiring circuit boards serve as products and are disposed in alignment, and the margin region surrounds the product region, with the margin region having a first area adjacent to the product region and a second area located at the opposite side of the product region with respect to the first area, wherein

a wiring circuit board of the plurality of wiring circuit boards includes a support substrate made of a metal-based layer; and

the wiring circuit board assembly sheet has a long shape,

has both end portions in a width direction perpendicular to a longitudinal direction and included in the margin region, and

includes a metal-based end portion disposed at both end portions in the width direction and made of the metal-based layer;

wherein the wiring circuit board assembly sheet includes a first dummy wiring circuit board and a second dummy wiring circuit board disposed in at least a portion of the first area and smaller than the wiring circuit board; and

wherein the second dummy wiring circuit board is smaller than the first dummy wiring circuit board.

9. A method for producing a wiring circuit board assembly sheet, the wiring circuit board assembly sheet according to claim 3 comprising:

a first step of disposing a first etching resist on a conductive layer so as to correspond to a wiring and a dummy wiring, and

a second step of etching the conductive layer exposed from the first etching resist to form the wiring and the dummy wiring.

10. The method for producing a wiring circuit board assembly sheet according to claim 9 , wherein

the conductive layer is conveyed along a conveyance direction in the second step and has

both end portions in a width direction perpendicular to the conveyance direction and included in the second area, and

in the first step, the first etching resist is formed so as to cover one surface in a thickness direction of both end portions in the width direction of the conductive layer and protrude from both end portions in the width direction of the conductive layer toward both outer sides in the width direction.

11. A method for producing a wiring circuit board assembly sheet, the wiring circuit board assembly sheet according to claim 5 comprising:

a third step of disposing a second etching resist on a metal-based layer so as to correspond to a support substrate and a dummy support substrate, and

a fourth step of etching the metal-based layer exposed from the second etching resist to form the support substrate and the dummy support substrate.

12. The method for producing a wiring circuit board assembly sheet according to claim 11 , wherein

the metal-based layer is conveyed along a conveyance direction in the fourth step and has both end portions in a width direction perpendicular to the conveyance direction and included in the second area, and

in the third step, the second etching resist is formed so as to cover one surface in a thickness direction of both end portions in the width direction of the metal-based layer and protrude from both end portions in the width direction of the metal-based layer toward both outer sides in the width direction.

13. A wiring circuit board assembly sheet comprising:

a product region and a margin region which partition the wiring circuit board assembly sheet;

wherein in the product region, a plurality of wiring circuit boards serve as products and are disposed in alignment, and the margin region surrounds the product region, with the margin region having a first area adjacent to the product region and a second area located at the opposite side of the product region with respect to the first area,

the wiring circuit board assembly sheet includes a first dummy wiring circuit board disposed at both sides in a longitudinal direction and both sides in a width direction of the product region, and a second dummy wiring circuit board disposed at an obliquely outer side of the product region.

14. A wiring circuit board assembly sheet, comprising:

a product region and a margin region which partition the wiring circuit board assembly sheet;

wherein in the product region, a plurality of wiring circuit boards serve as products and are disposed in alignment, and the margin region surrounds the product region, with the margin region having a first area adjacent to the product region and a second area located at the opposite side of the produce region with respect to the first area, wherein

a wiring circuit board of the plurality of wiring circuit boards includes a wiring made of a conductive layer; and

the wiring circuit board assembly sheet has a long shape, has both end portions in a width direction perpendicular to a longitudinal direction and included in the margin region, and includes a conductive end portion disposed at both end portions in the width direction and made of the conductive layer;

wherein the wiring circuit board assembly sheet includes a first dummy wiring circuit board disposed at both sides in a longitudinal direction and both sides in a width direction of the product region, and a second dummy wiring circuit board disposed at an obliquely outer side of the product region.

15. A wiring circuit board assembly sheet, comprising:

a product region and a margin region which partition the wiring circuit board assembly sheet;

wherein in the product region, a plurality of wiring circuit boards serve as products and are disposed in alignment, and the margin region surrounds the product region, with the margin region having a first area adjacent to the product region and a second area located at the opposite side of the produce region with respect to the first area, wherein

a wiring circuit board of the plurality of wiring circuit boards includes a support substrate made of a metal-based layer; and

the wiring circuit board assembly sheet has a long shape,

has both end portions in a width direction perpendicular to a longitudinal direction and included in the margin region, and

includes a metal-based end portion disposed at both end portions in the width direction and made of the metal-based layer;

wherein the wiring circuit board assembly sheet includes a first dummy wiring circuit board disposed at both sides in a longitudinal direction and both sides in a width direction of the product region, and a second dummy wiring circuit board disposed at an obliquely outer side of the product region.