Method of material transfer
A method for transferring an atomically thin layer comprising providing a target substrate and a donor substrate on which a first atomically thin layer has been formed. The method further comprises disposing an adhesion layer at the donor substrate or at the target substrate. The method further comprises bringing the target substrate and the donor substrate together. Further, the method comprises bonding together the donor substrate, the adhesion layer and the target substrate and removing the donor substrate.
1. A method for transferring an atomically thin layer, the method comprising: providing a target substrate; providing a donor substrate on which a first atomically thin layer has been formed; disposing an adhesion layer at the donor substrate or at the target substrate; forming an assembly comprising said adhesion layer and at least one structure, said assembly being formed at the donor substrate and/or at the target substrate; bringing together the target substrate and the donor substrate such that at least a portion of said first atomically thin layer is arranged against said at least one structure, and said adhesion layer is arranged against said target substrate; bonding together the donor substrate, the assembly and the target substrate; and removing said donor substrate.
2. The method of claim 1 , wherein said at least one structure comprises at least one cavity in said adhesion layer, and wherein after removal of said donor substrate, a portion of said first atomically thin material is suspended over said at least one cavity.
3. The method of claim 1 , wherein said at least one structure comprises at least one metal structure.
4. The method of claim 1 , wherein said at least one structure comprises at least one dielectric structure.
5. The method of claim 1 , wherein said at least one structure comprises at least one protrusion of said target substrate through said adhesion layer.
6. The method of claim 1 , wherein said at least one structure comprises a second atomically thin layer.
7. The method of claim 6 , wherein said structure comprising said second atomically thin layer further comprises a further layer covering at least a portion of said second atomically thin layer, and wherein said further layer is in contact with said adhesion layer.
8. The method of claim 1 , wherein said adhesion layer comprises a layer of an adhesive material covered by a thin compliant material.
9. The method of claim 1 , wherein said atomically thin layer comprises one of graphene, hexagonal boron nitride or a transition metal di-chalcogenide.
10. The method of claim 1 , wherein, during said bringing the target substrate and the donor substrate together, said adhesion layer is incompressible, or at least substantially incompressible, with a viscosity below 10000 cPs.
11. The method of claim 1 , wherein bonding together the donor substrate, the assembly and the target substrate comprises applying heat.
12. The method of 1 , wherein bonding together the donor substrate, the assembly and the target substrate comprises applying pressure.
13. The method of claim 1 , wherein removing said donor substrate comprises etching said donor substrate or detaching by intercalation of components at the interface between said donor substrate and said atomically thin layer.
14. The method of claim 1 , further comprising:
providing a second donor substrate on which a second atomically thin layer has been formed;
bringing the target substrate and the second donor substrate together such that at least a portion of said second atomically thin layer is in contact with said first atomically thin layer;
bonding said second atomically thin layer to said first atomically thin layer; and
removing said second donor substrate.