High energy density capacitor system and method
A capacitor includes a first metal layer disposed on a wafer or substrate, a first polarized dielectric layer above the first metal layer and comprising a plurality of electrets formed by aligning molecular dipoles throughout a three-dimensional surface area of a polarizable dielectric material during polarization by applying a momentary electric field of positive or negative polarity, a second metal layer disposed on the first polarized dielectric layer to electrically isolate the first polarized dielectric layer, and a second polarized dielectric layer above the second metal layer, the second polarized dielectric layer comprising a plurality of electrets formed by aligning molecular dipoles throughout a three-dimensional surface area of a polarizable dielectric material during polarization by applying a second momentary electric field of opposing polarity. A plurality of alternating polarized dielectric layers and metal layers may be arranged in series to form a stack, with an internal passivation layer disposed between each stack.
1. A capacitor, comprising:
a wafer or substrate;
a first metal layer disposed on the wafer or substrate;
a first polarized dielectric layer above the first metal layer, the first polarized dielectric layer comprising a plurality of electrets formed by aligning molecular dipoles throughout a three-dimensional surface area of polarizable dielectric material during polarization by applying a momentary electric field of positive or negative polarity to the polarizable dielectric material;
a second metal layer disposed on the first polarized dielectric layer to electrically isolate the first polarized dielectric layer; and
a second polarized dielectric layer above the second metal layer, the second polarized dielectric layer comprising one or more electrets formed by aligning molecular dipoles throughout a three-dimensional surface area of polarizable dielectric material during polarization by applying a second momentary electric field of opposing polarity to the polarizable dielectric material.
2. The capacitor of claim 1 wherein the polarizable dielectric material comprises a high K dielectric material.
3. The capacitor of claim 2 wherein each layer of polarizable dielectric material is comprised of high K material in the K>1000 range.
4. The capacitor of claim 1 wherein the first and second momentary electric fields are applied using capacitive plates disposed above and below the wafer or substrate and applying a designated voltage.
5. The capacitor of claim 4 wherein the designated voltage is about 1500 volts DC or greater.
6. The capacitor of claim 1 further comprising:
a plurality of alternating polarized dielectric layers and metal layers arranged in series to form a stack; and
at least one internal passivation layer disposed between each stack.
7. The capacitor of claim 1 wherein the first and second polarized dielectric layers are arranged in parallel.
8. The capacitor of claim 1 wherein the first and second polarized dielectric layers are arranged in series.
9. The capacitor of claim 1 wherein each polarized dielectric material has a dielectric constant in the range of about 10 9 to about 10 12 after application of said momentary electric fields.
10. The capacitor of claim 1 wherein polarity of the first and second momentary electric fields is selected dependent upon whether the first and second layers of polarizable dielectric material are arranged in parallel or in series, and further dependent upon direction the first or second layer needed to be polarized.
11. The capacitor of claim 1 further comprising sequential layers of polarizable dielectric material deposited using semiconductor fabrication techniques.
12. The capacitor of claim 11 wherein the sequential layers of polarizable dielectric material are deposited using atomic layer deposition.