Power module package structure
A power module package structure includes, from top to bottom, a layer of power chips, an upper bonding layer, a thermally-conductive and electrically-insulating composite layer, and a heat dissipation layer. The thermally-conductive and electrically-insulating composite layer contains an insulating layer and an upper copper layer that is formed on the insulating layer. One or more layers of upper packaging materials are covered over the layer of power chips and the upper bonding layer and are in contact with an upper surface of the upper copper layer. One or more layers of lower packaging materials are in contact with the insulating layer and are in contact with sidewalls of the upper copper layer. The lower packaging material has a higher rigidity than the upper packaging material.
1. A power module package structure, comprising: a layer of power chips, an upper bonding layer, a thermally-conductive and electrically-insulating composite layer, and a heat dissipation layer; wherein the thermally-conductive and electrically-insulating composite layer is disposed on the heat dissipation layer, the upper bonding layer is disposed on the thermally-conductive and electrically-insulating composite layer, and the layer of power chips is disposed on the upper bonding layer; wherein the thermally-conductive and electrically-insulating composite layer contains an insulating layer and an upper copper layer that is formed on the insulating layer; wherein one or more layers of upper packaging materials are covered over the layer of power chips and the upper bonding layer and are in contact with an upper surface of the upper copper layer, and one or more layers of lower packaging materials are in contact with the insulating layer; wherein the lower packaging material has a higher rigidity than the upper packaging material; wherein the upper packaging material is made of a silicone-based material, the lower packaging material is made of a rigid resin, and the insulating layer is made of a ceramic material; wherein a thermal expansion coefficient of the upper copper layer is greater than that of the insulating layer such that they are mismatched; wherein the one or more layers of lower packaging materials wrap around the upper copper layer and the insulating layer, and are in contact with the heat dissipation layer, so as to avoid cracking caused by the mismatched thermal expansion coefficients of the upper copper layer and the insulating layer.
2. The power module package structure according to claim 1 , wherein a hardness of the lower packaging material is higher than that of the upper packaging material, a tensile strength of the lower packaging material is higher than that of the upper packaging material, and a compressibility of the lower packaging material is lower than that of the upper packaging material.
3. The power module package structure according to claim 1 , wherein the upper packaging material has a thickness of 5 mm to 20 mm.
4. The power module package structure according to claim 1 , wherein the lower packaging material has a thickness of 1 mm to 5 mm.
5. The power module package structure according to claim 1 , wherein the ceramic material is at least one selected from aluminum oxide, aluminum nitride and silicon nitride.
6. The power module package structure according to claim 1 , wherein the upper copper layer has a thickness of 0.1 mm to 4 mm.