Redistribution plate
A single-layer redistribution plate functioning as a space translator between a device under testing (“DUT”) and a testing PCB may comprise a hard ceramic plate. A DUT side of the plate may have pads configured to interface with a device under testing. Both sides of the plate may comprise traces, vias, and pads to fan out the DUT pad pattern so that the plate side opposite the DUT side has spatially translated pads configured to interface with the pads on a testing PCB. Fabricating a redistribution plate may comprise calibrating and aligning, laser milling vias, laser milling trenches and pads, copper plating, grinding and polishing, removing residual copper, and coating the copper surfaces.
1. An apparatus comprising a circuit board substrate having a first side and a second side, wherein:
the first side comprises a DUT pad and a DUT via;
the greatest dimension of the DUT pad is less than 40 um;
the greatest dimension of the DUT via is less than 40 um;
the DUT pad is conductively connected by a first trace on the first side of the circuit board to a first via that goes through the circuit board and is conductively connected to a first test pad on the second side of the circuit board;
the DUT via is conductively connected through the circuit board to a second trace on the second side of the circuit board, and the second trace is conductively connected to a second test pad on the second side of the circuit board;
the area of the first test pad is at least twice the area of the DUT pad; and
the area of the second test pad is at least twice the area of the DUT via.