Arrays including a resin film and a patterned polymer layer

1. A method, comprising:

forming a patterned hydrophobic polymer layer on a cross-linked epoxy polyhedral oligomeric silsesquioxane (POSS) resin film on a support surface, thereby exposing discrete areas of the cross-linked epoxy POSS resin film;

applying a polymer coating to form an attached coating portion on the exposed discrete areas and an unattached coating portion on the patterned hydrophobic layer; and

washing the unattached coating portion off of the patterned hydrophobic layer.

2. The method as defined in claim 1 , further comprising forming the cross-linked epoxy POSS resin film on the support surface, the forming involving:

mixing an epoxy silane and at least one epoxy POSS monomeric unit in the presence of a photoacid generator and optionally a sensitizer to form a resin precursor;

depositing the resin precursor on the support surface; and

curing the resin precursor to form the cross-linked epoxy POSS resin film.

3. The method as defined in claim 2 , wherein the mixing and depositing occur at the same time.

4. The method as defined in claim 2 , wherein the epoxy silane is an epoxy silane bound to the support surface.

5. The method as defined in claim 1 , further comprising forming the cross-linked epoxy POSS resin film on the support surface, the forming involving:

mixing an epoxy silane, epoxycyclohexylalkyl POSS, and glycidyl POSS in the presence of a photoacid generator and optionally a sensitizer to form a resin precursor;

depositing the resin precursor on the support surface; and

curing the resin precursor to form the cross-linked epoxy POSS resin film.

6. The method as defined in claim 1 , wherein prior to forming the patterned hydrophobic polymer layer, the method further comprises:

exposing the cross-linked epoxy POSS resin film to plasma ashing or a chemical treatment to introduce —OH groups to the cross-linked epoxy POSS resin film; and

attaching functional groups to at least some of the —OH groups, the functional groups being selected from the group consisting of:

wherein n ranges from 1 to 20, and

wherein - - - represents an alkylsilane, a poly(ethylene glycol)-silane, an alkyl, or a polyethylene glycol chain.

7. The method as defined in claim 1 , further comprising forming the cross-linked epoxy POSS resin film on the support surface, the forming involving:

mixing, in the presence of a photoacid generator and optionally a sensitizer, an epoxy silane, epoxycyclohexylalkyl POSS, glycidyl POSS, and a POSS core including at least one epoxy functional group and a non-epoxy functional group to form a resin precursor;

depositing the resin precursor on the support surface; and

curing the resin precursor to form the cross-linked epoxy POSS resin film.

8. The method as defined in claim 1 , wherein washing involves sonication in water.

9. The method as defined in claim 1 , wherein forming the patterned hydrophobic polymer layer involves:

i) depositing a hydrophobic polymer on the cross-linked epoxy POSS resin film; and patterning the deposited hydrophobic polymer using at least one of nanoimprint lithography and photolithography; or

ii) depositing the hydrophobic polymer in a pattern on the cross-linked epoxy POSS resin film using at least one of inkjet printing and microcontact printing.

10. The method as defined in claim 1 , further comprising grafting an amplification primer to the attached coating portion.

11. A method, comprising:

forming a cross-linked epoxy POSS resin film on a support surface, where the forming involves mixing a support-bound epoxy silane with one or more epoxy-functionalized POSS reagents in the presence of a photoacid generator and optionally a sensitizer to form a support-bound resin precursor;

curing the resin precursor to form a support-bound cross-linked epoxy POSS resin film; and

forming a hydrophobic polymer layer on the cross-linked, support-bound epoxy POSS resin film, wherein the hydrophobic polymer layer is patterned to expose the cross-linked, support-bound epoxy POSS resin film in discrete areas or wells while remaining on the cross-linked, support-bound epoxy POSS resin film in interstitial areas of the cross-linked, support-bound epoxy POSS resin film between the discrete areas or wells.

12. The method as defined in claim 11 , wherein the one or more epoxy-functionalized POSS reagents comprise an epoxycyclohexylalkyl POSS and a glycidyl POSS.

13. The method as defined in claim 11 , further comprising reacting the support surface with an epoxy silane to form the support-bound epoxy silane.