IP Library Granted Patent US 11,515,142
Granted Patent B2
US 11,515,142 · App. 17/014,484 · Granted Nov 29, 2022

Method of cleaning substrate processing apparatus, and substrate processing system

Inventors: Shogo Fukui (Koshi, JP); Pohan Huang (Hsin-chu, TW)
Assignee: TOKYO ELECTRON LIMITED
H01L21/02101B08B7/0021F26B5/005H01L21/02043
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Quick Facts
Patent No.
US 11,515,142
App. No.
17/014,484
Granted
Nov 29, 2022
Kind
B2
Abstract

There is provided a method of cleaning a substrate processing apparatus in which a drying process of drying a substrate whose surface is wet with a liquid is performed by bring the substrate into contact with a supercritical fluid, the method including: diffusing a first cleaning fluid in an interior of the substrate processing apparatus, the first cleaning fluid being obtained by mixing the supercritical fluid with a solvent containing polar molecules and having a lower boiling point than a boiling point of the liquid; and discharging the first cleaning fluid from the interior of the substrate processing apparatus, that occurs after the diffusing the first cleaning fluid.

Claims (44)

1. A method of cleaning a substrate processing apparatus in which a drying process of drying a substrate whose surface was wet with a liquid has been performed by bringing the substrate into contact with a supercritical fluid, the method comprising:

diffusing, after the drying process, a first cleaning fluid in an interior of the substrate processing apparatus such that a residue of the liquid in the interior of the substrate processing apparatus after the drying process is dissolved in the first cleaning fluid, the first cleaning fluid being obtained by mixing the supercritical fluid with a solvent containing polar molecules and having a lower boiling point than a boiling point of the liquid; and

discharging the first cleaning fluid from the interior of the substrate processing apparatus, that occurs after the diffusing the first cleaning fluid.

2. The method of claim 1 , wherein the liquid contains the polar molecules and the supercritical fluid contains non-polar molecules.

3. The method of claim 1 , wherein the diffusing the first cleaning fluid includes:

mixing the supercritical fluid with the solvent to obtain the first cleaning fluid outside the substrate processing apparatus; and

supplying the first cleaning fluid from outside the substrate processing apparatus to the interior of the substrate processing apparatus.

4. The method of claim 1 , wherein the diffusing the first cleaning fluid comprises:

loading a jig on which the solvent is collected into the substrate processing apparatus; and

vaporizing the solvent on the loaded jig in the interior of the substrate processing apparatus while supplying the supercritical fluid into the substrate processing apparatus.

5. The method of claim 1 , wherein the liquid includes isopropyl alcohol, and the solvent includes ethanol, methanol, or acetone, or any combination thereof.

6. The method of claim 1 , further comprising:

diffusing a second cleaning fluid in the interior of the substrate processing apparatus, the second cleaning fluid being obtained by mixing the supercritical fluid with a chelating agent-containing solution; and

discharging the second cleaning fluid from the interior of the substrate processing apparatus, that occurs after the diffusing the second cleaning fluid.

7. The method of claim 1 , further comprising:

diffusing an additional supercritical fluid in the interior of the substrate processing apparatus, that occurs between the diffusing the first cleaning fluid and the discharging the first cleaning fluid,

wherein the discharging the first cleaning fluid further includes discharging the additional supercritical fluid from the interior of the substrate processing apparatus.

8. The method of claim 2 , wherein the diffusing the first cleaning fluid includes:

mixing the supercritical fluid with the solvent to obtain the first cleaning fluid outside the substrate processing apparatus; and

supplying the first cleaning fluid from outside the substrate processing apparatus to the interior of the substrate processing apparatus.

9. The method of claim 2 , wherein the diffusing the first cleaning fluid further comprises:

loading a jig on which the solvent is collected into the substrate processing apparatus; and

vaporizing the solvent on the loaded jig in the interior of the substrate processing apparatus while supplying the supercritical fluid into the substrate processing apparatus.

10. The method of claim 2 , wherein the liquid includes isopropyl alcohol, and the solvent includes ethanol, methanol, or acetone, or any combination thereof.

11. The method of claim 2 , further comprising:

diffusing a second cleaning fluid in the interior of the substrate processing apparatus, the second cleaning fluid being obtained by mixing the supercritical fluid with a chelating agent-containing solution; and

discharging the second cleaning fluid from the interior of the substrate processing apparatus, that occurs after the diffusing the second cleaning fluid.

12. The method of claim 2 , further comprising:

diffusing an additional supercritical fluid in the interior of the substrate processing apparatus, that occurs between the diffusing the first cleaning fluid and the discharging the first cleaning fluid,

wherein the discharging the first cleaning fluid further includes discharging the additional supercritical fluid from the interior of the substrate processing apparatus.

13. The method of claim 3 , wherein the liquid includes isopropyl alcohol, and the solvent includes ethanol, methanol, or acetone, or any combination thereof.

14. The method of claim 3 , further comprising:

diffusing a second cleaning fluid in the interior of the substrate processing apparatus, the second cleaning fluid being obtained by mixing the supercritical fluid with a chelating agent-containing solution; and

discharging the second cleaning fluid from the interior of the substrate processing apparatus, that occurs after the diffusing the second cleaning fluid.

15. The method of claim 3 , further comprising:

diffusing an additional supercritical fluid in the interior of the substrate processing apparatus, that occurs between the diffusing the first cleaning fluid and the discharging the first cleaning fluid,

wherein the discharging the first cleaning fluid further includes discharging the additional supercritical fluid from the interior of the substrate processing apparatus.

16. The method of claim 4 , wherein the liquid includes isopropyl alcohol, and the solvent includes ethanol, methanol, or acetone, or any combination thereof.

17. The method of claim 4 , further comprising:

diffusing a second cleaning fluid in the interior of the substrate processing apparatus, the second cleaning fluid being obtained by mixing the supercritical fluid with a chelating agent-containing solution; and

discharging the second cleaning fluid from the interior of the substrate processing apparatus, that occurs after the diffusing the second cleaning fluid.

18. The method of claim 4 , further comprising:

diffusing an additional supercritical fluid in the interior of the substrate processing apparatus, that occurs between the diffusing the first cleaning fluid and the discharging the first cleaning fluid,

wherein the discharging the first cleaning fluid further includes discharging the additional supercritical fluid from the interior of the substrate processing apparatus.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2020
From: FUKUI, SHOGO; HUANG, POHAN
To: TOKYO ELECTRON LIMITED
Reel/Frame 053734/0059 →
Priority Claims (1)
JP JP2019-166627 · Sep 12, 2019 · national
Continuity (1)
Related Publication 20210082691A1 · Mar 18, 2021