Direct transfer of semiconductor devices from a substrate

1. A method of transferring semiconductor devices, comprising:

loading a wafer tape into a first frame, the wafer tape having a first side and a second side, a first semiconductor device die being disposed on the first side of the wafer tape;

loading a substrate into a second frame, the substrate including a second semiconductor device die onto which the first semiconductor device die is to be transferred;

arranging at least one of the first frame or the second frame such that a surface of the substrate is adjacent to the first side of the wafer tape;

orienting a needle to a position adjacent to the second side of the wafer tape, the needle extending in a direction toward the wafer tape; and

activating a needle actuator connected to the needle to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die.

2. The method of claim 1 , further comprising inducing a bond between the first semiconductor device die and the second semiconductor device die such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die.

3. The method of claim 2 , wherein inducing the bond between the first semiconductor device die and the second semiconductor device die includes:

with an energy-emitting device disposed adjacent to the substrate, inducing the bond such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die.

4. The method of claim 1 , further comprising:

sensing, with a first optical sensor, a position of the first semiconductor device die with respect to a die transfer location on the substrate; and

sensing, with a second optical sensor, a position of the die transfer location on the substrate.

5. The method of claim 1 , further comprising performing at least one of:

orienting the first frame such that the first semiconductor device die on the wafer tape is aligned with a die transfer location on the substrate, and

orienting the second frame such that the die transfer location on the substrate is aligned with the first semiconductor device die,

wherein the performing is performed with a controller communicatively coupled to the first frame and the second frame.

6. The method of claim 1 , wherein:

the activating moves the needle to press on the second side of the wafer tape to cause a deflection of the wafer tape localized at the first semiconductor device die, and

the needle actuator is configured to apply the needle to cause pressure between the first semiconductor device die and the second semiconductor device die on the substrate.

7. The method of claim 1 , further comprising:

loading transfer process data into a controller communicatively coupled with the first frame, the second frame, and the needle actuator; and

determining a position of the first semiconductor device die relative to a die transfer location on the substrate to provide the controller with alignment information,

wherein the controller is configured to control the arranging, the orienting, and the activating, based at least in part on the transfer process data.