Semiconductor light emitting device with contact electrode having irregular top surface
A semiconductor light emitting device includes a first semiconductor layer, an active layer disposed on the first semiconductor layer to emit ultraviolet light, a second semiconductor layer disposed on the active layer, and a first electrode disposed on the first semiconductor layer and being in Ohmic contact with a portion of the first semiconductor layer, the first electrode including a contact electrode including aluminum (Al) and at least one other material and having a first region adjacent to the first semiconductor layer and a second region, with each region having an Al composition ratio defined by the amount of Al relative to the amount of the at least one other material. The Al composition ratio of the first region is greater than the Al composition ratio of the second region, and a metal layer disposed on the contact electrode.
1. A semiconductor light emitting device comprising:
a first semiconductor layer;
an active layer disposed on the first semiconductor layer to emit ultraviolet light;
a second semiconductor layer disposed on the active layer; and
a first electrode disposed on the first semiconductor layer and including a plurality of metal layers, with one of the plurality of metal layers comprising a contact electrode having a relatively planar lower surface and an irregular top surface, the lower surface being disposed on and directly contacting the first semiconductor layer so as to be in Ohmic contact with the first semiconductor layer.
2. The device of claim 1 , wherein:
the contact electrode is disposed on and in Ohmic contact with only a portion of the first semiconductor layer,
at least one of the other metal layers of the plurality of the metal layers is electrically connected to the contact electrode, and
at least a part of the at least one of the other metal layers is disposed on and in contact with the first semiconductor layer.
3. The device of claim 2 , wherein the contact electrode has a width shorter than a width over which the other metal layers and the first semiconductor layer are in contact with each other.
4. The device of claim 2 , wherein the other metal layers surround the contact electrode.
5. The device of claim 2 , wherein the other metal layers comprise:
a reflective layer to reflect light; and
a barrier layer disposed on the reflective layer to prevent diffusion of metal atoms or metal ions from the reflective layer.
6. The device of claim 1 , further comprising a second electrode disposed on and directly contacting with the first semiconductor layer so as to be[ing] in Ohmic contact with the second semiconductor layer.
7. The device of claim 6 , further comprising:
a first bump electrically connected to the first electrode and disposed on the first electrode; and
a second bump electrically connected to the second electrode and disposed on the second electrode.