Backplane connector with improved shielding effect

1. A backplane connector comprising a wafer, the wafer comprising:

a plurality of conductive terminals, each of the conductive terminals comprises a contact portion, a tail portion and a connection portion connecting the contact portion and the tail portion;

an insulating frame fixed with the connection portions of the conductive terminals, and the contact portions and the tail portions extending beyond the insulating frame;

a first metal shield located on one side of the insulating frame; and

a second metal shield located on the other side of the insulating frame;

wherein the conductive terminals comprise differential signal terminals, a first ground terminal and a second ground terminal, and the differential signal terminals are located between the first ground terminal and the second ground terminal;

wherein the insulating frame comprises a plurality of first posts and a plurality of second posts;

wherein the first metal shield comprises a plurality of first mounting holes to position the first posts; and

wherein the second metal shield comprises a plurality of second mounting holes to position the second posts.

2. The backplane connector according to claim 1 , wherein the insulating frame defines a hollow portion in which the connection portions of the conductive terminals are partially exposed.

3. The backplane connector according to claim 2 , wherein the insulating frame is frame-shaped, the insulating frame comprises a front wall adjacent to the contact portions of the conductive terminals, a bottom wall adjacent to the tail portions of the conductive terminals, a rear wall opposite to the front wall, and a top wall opposite to the bottom wall; and wherein the first posts and the second posts are provided on the front wall.

4. The backplane connector according to claim 3 , wherein the insulating frame comprises a plurality of connecting walls protruding into the hollow portion, and the first posts and the second posts are also provided on the connecting walls.

5. The backplane connector according to claim 1 , wherein each of the differential signal terminals comprises a narrowed portion embedded in the insulating frame.

6. The backplane connector according to claim 1 , wherein the connection portions of the differential signal terminals, the connection portion of the first ground terminal, and the connection portion of the second ground terminal are coplanar.

7. The backplane connector according to claim 1 , wherein the first metal shield comprises a first main body portion, the first main body portion comprises a first rib protruding toward the first ground terminal and a second rib protruding toward the second ground terminal;

wherein the second metal shield comprises a second main body portion, the second main body portion comprises a third rib protruding toward the first ground terminal and a fourth rib protruding toward the second ground terminal; and

wherein the first rib and the third rib are in contact with opposite side surfaces of the connection portion of the first ground terminal, respectively; the second rib and the fourth rib are in contact with opposite side surfaces of the connection portion of the second ground terminal, respectively; and the first main body portion, the second main body portion, the first ground terminal and the second ground terminal jointly form a shielding cavity enclosing the connection portions of the differential signal terminals.

8. The backplane connector according to claim 7 , wherein the connection portion of the first ground terminal comprises a first tab portion protruding into the shielding cavity, the connection portion of the second ground terminal comprises a second tab portion protruding into the shielding cavity, and the connection portions of the differential signal terminals are located between the first tab portion and the second tab portion.

9. The backplane connector according to claim 7 , wherein the first metal shield comprises a first extension portion located on one side of the contact portions of the conductive terminals, the first extension portion comprises a first bulge protruding toward the first ground terminal and a second bulge protruding toward the second ground terminal;

wherein the second metal shield comprises a second extension portion located on the other side of the contact portions of the conductive terminals, the second extension portion comprises a third bulge protruding toward the first ground terminal and a fourth bulge protruding toward the second ground terminal; and

wherein the first bulge and the third bulge are in contact with opposite side surfaces of the contact portion of the first ground terminal, respectively; the second bulge and the fourth bulge are in contact with opposite side surfaces of the contact portion of the second ground terminal, respectively; and the first extension portion, the second extension portion, the first ground terminal and the second ground terminal jointly form a shielding space enclosing the contact portions of the differential signal terminals.

10. The backplane connector according to claim 7 , wherein the wafer comprises an insulating block sleeved on the contact portions of the differential signal terminals, and a metal shell sleeved on the insulating block; and wherein the metal shell is in contact with the first metal shield and the second metal shield.

11. The backplane connector according to claim 7 , wherein surfaces of the first rib, the second rib, the third rib and the fourth rib are soldered to the first ground terminal and the second ground terminal via at least one of spot soldering, laser soldering and ultrasonic soldering.