Electronic device using interposer in printed circuit board
An electronic device includes a processor and a printed circuit board on which the processor is mounted. The printed circuit board includes a first circuit board, a first interposer formed on a first portion of the first circuit board, a second interposer formed on a second portion of the first circuit board that is adjacent to the first portion, a second circuit board coupled to the first interposer, and a third circuit board coupled to the second interposer.
1. An electronic device comprising:
a processor;
a printed circuit board on which the processor is mounted;
a display device; and
a display power integrated circuit configured to supply electric power to the display device,
wherein the printed circuit board includes:
a first circuit board;
a first interposer formed on a first portion of the first circuit board;
a second interposer formed on a second portion of the first circuit board, the second portion being adjacent to the first portion;
a second circuit board coupled to the first interposer; and
a third circuit board coupled to the second interposer,
wherein the first interposer and the second interposer are disposed on a same surface of the first circuit board,
wherein the display power integrated circuit is mounted on a first surface of the third circuit board, the first surface being configured to face the first circuit board, and
wherein a connector connected to the display power integrated circuit is mounted on a second surface of the third circuit board, the second surface being opposite to the first surface of the third circuit board.
2. The electronic device of claim 1 , wherein the printed circuit board has a shape in which the second portion protrudes from part of a side surface of the first portion.
3. The electronic device of claim 1 , wherein the first circuit board is formed in an “L” shape,
wherein the second circuit board is disposed over the first portion of the first circuit board, and
wherein third circuit board is disposed over the second portion of the first circuit board and is spaced apart from the second circuit board.
4. The electronic device of claim 1 , wherein the first portion, the first interposer, and the second circuit board form one shielding space.
5. The electronic device of claim 1 , wherein the second portion, the second interposer, and the third circuit board form one shielding space.
6. The electronic device of claim 1 , further comprising:
a power management integrated circuit,
wherein the power management integrated circuit is mounted on the first portion.
7. The electronic device of claim 1 , further comprising:
a communication integrated circuit,
wherein the communication integrated circuit is mounted on one surface of the second circuit board.
8. The electronic device of claim 7 , wherein the communication integrated circuit is mounted on a first surface of the second circuit board, the first surface being configured to face the first circuit board, and
wherein a connector connected to the communication integrated circuit is mounted on a second surface of the second circuit board, the second surface being opposite to the first surface.
9. The electronic device of claim 8 , further comprising:
a sub-printed circuit board,
wherein the communication integrated circuit is connected to the sub-printed circuit board through a flexible printed circuit board (FPCB) connected to the connector.
10. The electronic device of claim 1 , further comprising:
a camera power integrated circuit,
wherein the camera power integrated circuit is mounted on the second portion.
11. The electronic device of claim 1 , further comprising:
a sub-printed circuit board,
wherein the display power integrated circuit is connected to the sub-printed circuit board through an FPCB connected to the connector.
12. The electronic device of claim 1 , further comprising:
a battery,
wherein the battery is connected to the third circuit board through an FPCB.
13. The electronic device of claim 1 , further comprising:
an antenna module,
wherein the antenna module is connected to the second circuit board through an FPCB.
14. The electronic device of claim 1 , wherein the first circuit board has a larger area than at least one of the second circuit board and the third circuit board.
15. The electronic device of claim 1 , wherein the first portion of the first circuit board overlaps the second circuit board and does not overlap the third circuit board, and
wherein the second portion of the first circuit board overlaps the third circuit board and does not overlap the second circuit board.
16. The electronic device of claim 1 , wherein the first interposer is formed in a first closed curve shape, and
wherein the second interposer is formed in a second closed curve shape.
17. The electronic device of claim 16 , wherein the second closed curve shape is different from the first closed curve shape.
18. The electronic device of claim 1 , wherein the first circuit board is spaced apart from at least one of the second circuit board and the third circuit board in a first direction,
wherein the second circuit board and the third circuit board are spaced apart from each other in a second direction different from the first direction, and
wherein the first interposer and the second interposer are spaced apart from each other in the second direction.