IP Library › Granted Patent US 11,517,992
Granted Patent B2
US 11,517,992 · App. 17/061,659 · Granted Dec 6, 2022

Assembly apparatus

Inventors: Yoichi Sato (Tokyo, JP); Marosuke Kikuchi (Tokyo, JP)
Assignee: SUBARU CORPORATION
B23Q15/06B64F5/10
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Quick Facts
Patent No.
US 11,517,992
App. No.
17/061,659
Granted
Dec 6, 2022
Kind
B2
Abstract

An assembly apparatus includes a retainer, a position measurement device, and a machining device. The retainer is configured to hold an assembly. The position measurement device is configured to measure a difference between an intended machining position and an actual machining position of a first coupling hole in a first assembly component. The first coupling hole is capable of being coupled to the assembly. The machining device is configured to form a second coupling hole capable of communicating with the first coupling hole in the assembly based on a reference position set on the assembly and the difference.

Claims (13)

1. An aircraft wing assembly apparatus for fastening a first assembly component to an assembly, the first assembly component including a first coupling hole through which a fastening member for the fastening is insertable, the assembly apparatus comprising:

a first retainer configured to hold the first assembly component in a first position when performing the fastening, the first retainer comprising a first portion that indicates a first reference position;

a second retainer configured to hold the assembly in a second position when performing the fastening, the second retainer comprising the second position when performing the fastening, the second retainer comprising a second reference portion that indicates a second reference position;

a drilling machine comprising a robot arm that holds a drilling tool and configured to form a second coupling hole through which the fastening member is insertable in the assembly by using the drilling tool; and

a laser scanner configured to measure a three-dimensional position of a three-dimensional object,

wherein the laser scanner is configured to:

store a first intended machining position of the first coupling hole and a second intended machining position of the second coupling hole, the first intended machining position is defined relative to the first reference position, the second intended machining position is defined relative to the second reference position;

in a state where the first assembly component is held by the first retainer, measure a three-dimensional position of the first reference portion and an actual machining position of the first coupling hole;

calculate a difference between the measured actual machining position of the first coupling hole and the stored first intended machining position of the first coupling hole, and

wherein the drilling machine is configured to:

determine a target position shifted from the stored second intended machining position of the second coupling hole by the calculated difference; and

in a state where the assembly is held by the second retainer, form the second coupling hole in the assembly by moving the drilling tool to the determined target position based on the measured relative position of the drilling tool and the measured three-dimensional position of the second reference portion.

2. The aircraft wing assembly apparatus according to claim 1 , wherein the laser scanner is positioned in a fixed position relative to a base of the robot arm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 2, 2020
From: SATO, YOICHI; KIKUCHI, MAROSUKE
To: SUBARU CORPORATION
Reel/Frame 053957/0318 →
Priority Claims (1)
JP JP2019-204051 · Nov 11, 2019 · national
Continuity (1)
Related Publication 20210138600A1 · May 13, 2021