Separation of contributions to metrology data
A method including: computing a value of a first variable of a pattern of, or for, a substrate processed by a patterning process by combining a fingerprint of the first variable on the substrate and a certain value of the first variable; and determining a value of a second variable of the pattern based at least in part on the computed value of the first variable.
1. A method comprising:
determining, by a first computer model evaluated on a hardware computer system, a first contribution of a first processing variable to metrology data of a pattern on a substrate;
obtaining a second contribution of a second processing variable to the metrology data, the second contribution not modeled to the metrology data of the pattern and extracted, separately from other contributions of other processing variables to metrology data, from actual measured values of the metrology data by removal of one or more contributions of one or more other processing variables to metrology data from the actual measured values;
obtaining, by a second computer model evaluated on the hardware computer, estimated, simulated metrology data by combining the first contribution and the second contribution; and
physically configuring or controlling a manufacturing, metrology or inspection process or device based on the obtained simulated metrology data and/or providing a signal being, or computed from, the obtained simulated metrology data to a manufacturing, metrology or inspection tool or system to bring about control or configuration of a manufacturing, metrology or inspection process performed using the respective manufacturing, metrology or inspection tool or system.
2. The method of claim 1 , wherein the metrology data represents: a critical dimension (CD), a critical dimension uniformity (CDU), a sidewall angle, an edge position, overlay, focus, pattern shift, or a combination selected therefrom.
3. The method of claim 1 , wherein the metrology data comprise a statistic of a group of patterns.
4. The method of claim 1 , wherein the second processing variable is a characteristic of a process downstream to exposure of the substrate.
5. The method of claim 4 , wherein the process is development of a resist layer on the substrate.
6. The method of claim 4 , wherein the process is etching of the substrate.
7. The method of claim 1 , wherein the second processing variable is a characteristic of the substrate.
8. The method of claim 1 , wherein the second processing variable is a characteristic of a resist layer on the substrate.
9. The method of claim 1 , wherein a value of the second processing variable is unknown.
10. The method of claim 1 , wherein combining the first contribution and the second contribution comprises adding the first contribution and the second contribution, or convoluting the first contribution and the second contribution.
11. A method comprising:
determining, by a first computer model evaluated on a hardware computer system, a first contribution of a processing variable to metrology data pertaining to a pattern;
computing a value of a first variable of the pattern of, or for, a substrate processed by a patterning process by combining:
a fingerprint of the first variable on the substrate, the fingerprint derived from the first contribution of the processing variable to metrology data pertaining to the pattern and a second contribution of a processing variable to metrology data pertaining to the pattern, the second contribution not modeled to metrology data pertaining to the pattern and extracted, separately from other contributions of other processing variables to metrology data, from actual measured values of the metrology data by removal of one or more contributions of one or more other processing variables to metrology data from the actual measured values, and a certain value of the first variable;
determining, by a second computer model evaluated on the hardware computer system, a value of a second variable of the pattern based at least in part on the computed value of the first variable; and
physically configuring or controlling a manufacturing, metrology or inspection process or device based on the obtained simulated metrology data and/or providing a signal being, or computed from, the obtained simulated metrology data to a manufacturing, metrology or inspection tool or system to bring about control or configuration of a manufacturing, metrology or inspection process performed using the respective manufacturing, metrology or inspection tool or system.
12. The method of claim 11 , wherein the first variable and/or the second variable is related to a metrology target on a substrate.
13. The method of claim 11 , further comprising predicting whether there is a defect following a process downstream to transfer of the pattern onto the substrate based on the second variable of the pattern.
14. The method of claim 13 , wherein responsive to a prediction of a defect at the pattern following the process downstream to transfer of the pattern onto the substrate, adjusting a variable of the patterning process for the substrate or another substrate.
15. A computer program product comprising a non-transitory computer readable medium having instructions therein, the instructions when executed by a computer system, configured to cause the computer system to at least:
determine, by a computer model, a first contribution of a first processing variable to metrology data of a pattern on a substrate;
obtain a second contribution of a second processing variable to the metrology data, the second contribution not modeled to the metrology data of the pattern and extracted, separately from one or more other contributions of one or more other processing variables to metrology data, from actual measured values of the metrology data;
obtain estimated, simulated metrology data by combining the first contribution and the second contribution; and
cause physical configuration or control of a manufacturing, metrology or inspection process or device based on the obtained simulated metrology data and/or provide a signal being, or computed from, the obtained simulated metrology data to a manufacturing, metrology or inspection tool or system to bring about control or configuration of a manufacturing, metrology or inspection process performed using the respective manufacturing, metrology or inspection tool or system.
16. The computer program product of claim 15 , wherein the metrology data represents: a critical dimension (CD), a critical dimension uniformity (CDU), a sidewall angle, an edge position, overlay, focus, pattern shift, or a combination selected therefrom.
17. The computer program product of claim 15 , wherein the second processing variable is a characteristic of a process downstream to exposure of the substrate.
18. The computer program product of claim 15 , wherein the second processing variable is a characteristic of the substrate.
19. The computer program product of claim 15 , wherein the second processing variable is a characteristic of a resist layer on the substrate.
20. The computer program product of claim 15 , wherein the instructions configured to combine the first contribution and the second contribution are configured to add the first contribution and the second contribution, or convolute the first contribution and the second contribution.
21. A computer program product comprising a non-transitory computer readable medium having instructions recorded thereon, the instructions when executed by a computer system, configured to cause the computer system to at least:
determine, by a first computer model, a first contribution of a processing variable to metrology data pertaining to a pattern;
compute a value of a first variable of the pattern of, or for, a substrate processed by a patterning process by combining:
a fingerprint of the first variable on the substrate, the fingerprint derived from the first contribution of the processing variable to metrology data pertaining to the pattern and a second contribution of a processing variable to metrology data pertaining to the pattern, the second contribution not modeled to metrology data pertaining to the pattern and extracted, separately from one or more other contributions of one or more other processing variables to metrology data, from actual measured values of the metrology data, and a certain value of the first variable;
determine, by a second computer model, a value of a second variable of the pattern based at least in part on the computed value of the first variable; and
cause physical control or configuration of a manufacturing, metrology or inspection process or device based on the obtained simulated metrology data and/or provide a signal being, or computed from, the obtained simulated metrology data to a manufacturing, metrology or inspection tool or system to bring about control or configuration of a manufacturing, metrology or inspection process performed using the respective manufacturing, metrology or inspection tool or system.