IP Library › Granted Patent US 11,520,369
Granted Patent B2
US 11,520,369 · App. 16/781,976 · Granted Dec 6, 2022

Clock instantaneous temperature-rate-of-change measurement

Inventors: Robert Dale Thrasher (Irvine, CA); Jordan Cookman (San Jose, CA); Duong Hoang (San Diego, CA)
Assignee: QUALCOMM Incorporated
G06F1/08G01K13/00G01R19/225G01R21/00G01R21/02G01R23/02G01R5/22G01R19/03G01R21/04
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Quick Facts
Patent No.
US 11,520,369
App. No.
16/781,976
Granted
Dec 6, 2022
Kind
B2
Abstract

Techniques described herein address these and other issues by utilizing two or more sensors to take temperature measurements from which a temperature-differential or instantaneous temperature rate-of-change, can be determined. In turn, this can be used to make a highly accurate model of the relationship between the temperature, temperature-differential, and clock circuitry frequency, to accurately estimate the frequency rate-of-change for frequency correction/compensation.

Claims (65)

1. A system for determining a frequency rate-of-change of clock circuitry, the system comprising:

an assembly of electrical components on a substrate, the assembly of electrical components comprising:

the clock circuitry;

a heat source; and

a plurality of thermal sensors, wherein:

a first thermal sensor of the plurality of thermal sensors is on the substrate on a proximal side of the clock circuitry, relative to the heat source; and

a second thermal sensor of the plurality of thermal sensors is on the substrate on a distal side of the clock circuitry, relative to the heat source; and

a processing unit communicatively coupled with the first thermal sensor, the second thermal sensor, and the clock circuitry, wherein the processing unit is configured to:

determine a temperature-differential based on temperature measurements from each of the first thermal sensor and the second thermal sensor; and

determine a frequency rate-of-change of the clock circuitry, based at least in part on the determined temperature-differential.

2. The system of claim 1 , wherein the processing unit is further configured to:

determine a frequency of the clock circuitry, based at least in part on the determined temperature-differential; and

responsive to determining the frequency of the clock circuitry, output information indicative of the determined frequency.

3. The system of claim 1 , wherein the clock circuitry comprises a crystal oscillator (XO) circuit.

4. The system of claim 1 , wherein the assembly of electrical components further comprises a second heat source, and wherein the plurality of thermal sensors comprises more than two thermal sensors.

5. The system of claim 1 , wherein the heat source comprises a Power Management Integrated Circuit (PMIC).

6. The system of claim 1 , wherein the clock circuitry comprises an integrated circuit coupled to the substrate.

7. The system of claim 1 , wherein the clock circuitry, the heat source, the first thermal sensor, and the second thermal sensor are substantially aligned along a common axis.

8. The system of claim 1 , wherein determining the frequency rate-of-change of the clock circuitry comprises using a model having a set of parameters, and wherein the processing unit is further configured to determine the set of parameters based on:

a plurality of additional temperature measurements from each of the first thermal sensor and the second thermal sensor, and

a frequency reference.

9. The system of claim 8 , wherein the processing unit is configured to determine the set of parameters using an Extended Common Filter (EKF).

10. The system of claim 8 , wherein the frequency reference comprises a frequency estimator of a Global Navigation Satellite System (GNSS) or a Wireless Wide Area Network (WWAN).

11. A method of determining a clock frequency rate-of-change of clock circuitry, the method comprising:

obtaining a temperature measurement from each of a first thermal sensor and a second thermal sensor, wherein:

the first thermal sensor is on a substrate on a proximal side of the clock circuitry, relative to a heat source; and

the second thermal sensor is on the substrate on a distal side of the clock circuitry, relative to the heat source;

determining a temperature-differential based on the temperature measurement from each of the first thermal sensor and the second thermal sensor; and

determining a frequency rate-of-change of the clock circuitry based at least in part on the determined temperature-differential.

12. The method of claim 11 , further comprising:

determining a frequency of the clock circuitry, based at least in part on the determined temperature-differential; and

responsive to determining the frequency of the clock circuitry, outputting information indicative of the determined frequency.

13. The method of claim 11 , wherein the clock circuitry comprises a crystal oscillator (XO) circuit.

14. The method of claim 11 , wherein the heat source comprises a Power Management Integrated Circuit (PMIC).

15. The method of claim 11 , wherein the clock circuitry comprises an integrated circuit coupled to the substrate.

16. The method of claim 11 , wherein the clock circuitry, the heat source, the first thermal sensor, and the second thermal sensor are substantially aligned along a common axis.

17. The method of claim 11 , wherein determining the frequency rate-of-change of the clock circuitry comprises using a model having a set of parameters, and wherein the method further comprises determining the set of parameters based on:

a plurality of additional temperature measurements from each of the first thermal sensor and the second thermal sensor, and

a frequency reference.

18. The method of claim 17 , further comprising determining the set of parameters using an Extended Common Filter (EKF).

19. The method of claim 17 , wherein the frequency reference comprises a frequency estimator of a Global Navigation Satellite System (GNSS) or a Wireless Wide Area Network (WWAN).

20. A device comprising:

means for obtaining a temperature measurement from each of a first thermal sensing means and a second thermal sensing means, wherein:

the first thermal sensing means is on a substrate on a proximal side of clock circuitry, relative to a heat source; and

the second thermal sensing means is on the substrate on a distal side of the clock circuitry, relative to the heat source;

means for determining a temperature-differential based on the temperature measurement from each of the first thermal sensing means and the second thermal sensing means; and

means for determining a frequency rate-of-change of the clock circuitry based at least in part on the determined temperature-differential.

21. The device of claim 20 , further comprising:

means for determining a frequency of the clock circuitry, based at least in part on the determined temperature-differential; and

means for outputting information indicative of the determined frequency in response to determining the frequency of the clock circuitry.

22. The device of claim 20 , wherein the clock circuitry comprises a crystal oscillator (XO) circuit.

23. The device of claim 20 , wherein the heat source comprises a Power Management Integrated Circuit (PMIC).

24. The device of claim 20 , wherein the clock circuitry, the heat source, the first thermal sensing means, and the second thermal sensing means are substantially aligned along a common axis.

25. The device of claim 20 , wherein the means for determining the frequency rate-of-change of the clock circuitry comprises means for using a model having a set of parameters, and wherein the device further comprises means for determining the set of parameters based on:

a plurality of additional temperature measurements from each of the first thermal sensing means and the second thermal sensing means, and

a frequency reference.

26. A non-transitory computer-readable medium having instructions embedded thereon that, when executed by one or more processing units, cause the one or more processing units to:

obtain a temperature measurement from each of a first thermal sensor and a second thermal sensor, wherein:

the first thermal sensor is on a substrate on a proximal side of clock circuitry, relative to a heat source; and

the second thermal sensor is on the substrate on a distal side of the clock circuitry, relative to the heat source;

determine a temperature-differential based on the temperature measurement from each of the first thermal sensor and the second thermal sensor; and

determine a frequency rate-of-change of the clock circuitry based at least in part on the determined temperature-differential.

27. The non-transitory computer-readable medium of claim 26 , wherein the instructions, when executed by the one or more processing units, further cause the one or more processing units to:

determine a frequency of the clock circuitry, based at least in part on the determined temperature-differential; and

output information indicative of the determined frequency in response to determining the frequency of the clock circuitry.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2020
From: THRASHER, ROBERT DALE; COOKMAN, JORDAN; HOANG, DUONG
To: QUALCOMM INCORPORATED
Reel/Frame 052899/0591 →
Continuity (1)
Related Publication 20210240217A1 · Aug 5, 2021