Method of fabricating three-dimensional semiconductor memory device
Methods of fabricating a three-dimensional semiconductor memory device are provided. A method may include forming a mold structure on a substrate including channel regions and a non-channel region between the channel regions, and forming, on the mold structure, a multilayered mask layer including a first mask layer, an etch stop layer, and a second mask layer that are sequentially stacked. The multilayered mask layer may include mask holes exposing the mold structure in the channel regions, dummy mask holes exposing the first mask layer in the non-channel region, and buffer spacers covering sidewalls of the second mask layer exposed by the mask holes and the dummy mask holes. The method may include etching the mold structure using the multilayered mask layer as an etch mask to form channel holes in the channel regions.
1. A three-dimensional (3D) semiconductor memory device comprising:
a substrate including channel regions and a non-channel region between the channel regions;
a stack structure comprising a plurality of electrodes and a plurality of insulation layers alternately stacked on the substrate alternately stacked on the substrate;
a plurality of vertical structures penetrating the stack structure on the channel regions; and
a common source plug penetrating the stack structure on the non-channel region,
wherein an upper surface of an uppermost insulation layer of the plurality of insulation layers has a recessed portion in the non-channel region, and
wherein the recessed portion is adjacent to the common source plug.
2. The 3D semiconductor memory device of claim 1 , wherein a bottom surface of the recessed portion is spaced apart from a top surface of an uppermost electrode of the plurality of electrodes.
3. The 3D semiconductor memory device of claim 1 , further comprising
an insulation spacer between a sidewall of the common source plug and the stack structure.
4. The 3D semiconductor memory device of claim 1 , further comprising a portion of a vertical insulation pattern and a portion of an upper semiconductor pattern provided in a portion of the recessed portion.
5. The 3D semiconductor memory device of claim 4 , wherein the portion of the vertical insulation pattern covers a sidewall of the recessed portion, and
wherein the portion of the upper semiconductor pattern covers the portion of the vertical insulation pattern and a bottom surface of the recessed portion.
6. The 3D semiconductor memory device of claim 4 , wherein each of the plurality of vertical structures comprises a vertical semiconductor pattern and the vertical insulation pattern surrounding a sidewall of the vertical semiconductor pattern.
7. The 3D semiconductor memory device of claim 6 , wherein the vertical insulation pattern includes a charge storage layer.
8. A three-dimensional (3D) semiconductor memory device, comprising:
a substrate including channel regions and a non-channel region between the channel regions;
a stack structure comprising a plurality of electrodes and a plurality of insulation layers alternately stacked on the substrate alternately stacked on the substrate; and
a plurality of vertical structures penetrating the stack structure on the channel regions;
wherein an upper surface of an uppermost insulation layer of the plurality of insulation layers has a recessed portion, in the non-channel region, and
wherein a depth of the recessed portion is less than a thickness of the uppermost insulation layer in a direction vertical to a top surface of the substrate.
9. The 3D semiconductor memory device of claim 8 , wherein the uppermost insulation layer is disposed on a top surface of an uppermost electrode of the plurality of electrodes, and
wherein a bottom surface of the recessed portion is vertically spaced apart from the top surface of the uppermost electrode.
10. The 3D semiconductor memory device of claim 8 , further comprising
a common source plug penetrating the stack structure on the non-channel region; and
an insulation spacer between a sidewall of the common source plug and the stack structure,
wherein the recessed portion is adjacent to the insulation spacer.
11. The 3D semiconductor memory device of claim 10 , wherein and the common source plug extends parallel to the stack structure in a first direction.
12. The 3D semiconductor memory device of claim 8 , wherein each of the vertical structures comprises a vertical semiconductor pattern and a vertical insulation layer surrounding a sidewall of the vertical semiconductor pattern, and
wherein a portion of the vertical semiconductor pattern and a portion of the vertical insulation layer are disposed in the recessed portion.