Acoustic wave device including interdigital electrodes covered by silicon oxynitride film
An acoustic wave device includes a piezoelectric substrate, a pair of interleaved interdigital transducer electrodes disposed on the piezoelectric substrate, and a dielectric film including silicon oxynitride covering the pair of interleaved interdigital transducer electrodes. The dielectric film exhibits a temperature coefficient of velocity of substantially zero throughout an operating temperature range of the acoustic wave device of between −55° C. and 125° C.
1. An acoustic wave device comprising:
a piezoelectric substrate;
a pair of interleaved interdigital transducer electrodes disposed on the piezoelectric substrate; and
a dielectric film including silicon oxynitride and exhibiting an acoustic velocity of between about 7300 m/s and 8200 m/s covering the pair of interleaved interdigital transducer electrodes and exhibiting a temperature coefficient of velocity of substantially zero throughout an operating temperature range of the acoustic wave device of between −55° C. and 125° C.
2. The acoustic wave device of claim 1 further including a second dielectric film disposed between the dielectric film including silicon oxynitride and the pair of interleaved interdigital transducer electrodes.
3. The acoustic wave device of claim 2 wherein the second dielectric film exhibits a temperature coefficient of velocity having a sign opposite to a temperature coefficient of velocity of the piezoelectric substrate.
4. The acoustic wave device of claim 3 wherein the temperature coefficient of velocity of the second dielectric film is positive.
5. The acoustic wave device of claim 3 wherein the second dielectric film exhibits the temperature coefficient of velocity having the sign opposite to the temperature coefficient of velocity of the piezoelectric substrate throughout the operating temperature range of the acoustic wave device.
6. The acoustic wave device of claim 5 wherein the temperature coefficient of velocity of the second dielectric film is more negative than the temperature coefficient of velocity of the dielectric film including silicon oxynitride.
7. The acoustic wave device of claim 5 wherein the second dielectric film comprises silicon dioxide.
8. The acoustic wave device of claim 2 wherein the second dielectric film is in direct contact with the pair of interleaved interdigital transducer electrodes.
9. The acoustic wave device of claim 8 wherein the second dielectric film is in direct contact with the dielectric film including silicon oxynitride.
10. The acoustic wave device of claim 8 wherein the second dielectric film is in direct contact with the piezoelectric substrate.
11. The acoustic wave device of claim 1 wherein the acoustic wave device is one of a resonator and a filter.
12. The acoustic wave device of claim 11 wherein the acoustic wave device is one of a radio frequency resonator and a radio frequency filter.
13. The acoustic wave device of claim 1 included in an electronic device module.
14. The acoustic wave device of claim 13 wherein the electronic device module is a radio frequency device module.
15. The acoustic wave device of claim 14 included in an electronic device.
16. An acoustic wave device comprising:
a piezoelectric substrate;
a pair of interleaved interdigital transducer electrodes disposed on the piezoelectric substrate; and
a film of silicon oxynitride disposed directly on the pair of interleaved interdigital transducer electrodes and having a N/(N+O) ratio of less than or equal to 0.1, N being the atomic percentage of nitrogen in the dielectric film and O being the atomic percentage of oxygen in the dielectric film.
17. The acoustic wave device of claim 16 wherein the film of silicon oxynitride has a positive temperature coefficient of velocity.
18. A method of forming an acoustic wave device, the method comprising:
forming a pair of interleaved interdigital transducer electrodes on a piezoelectric substrate; and
depositing a dielectric film including silicon oxynitride over the pair of interleaved interdigital transducer electrodes, the dielectric film exhibiting an acoustic velocity of between about 7300 m/s and 8200 m/s and a temperature coefficient of velocity of substantially zero throughout an operating temperature range of the acoustic wave device of between −55° C. and 125° C.
19. The method of claim 18 further comprising forming a silicon dioxide film between the dielectric film and the pair of interleaved interdigital transducer electrodes.