Composite oxide semiconductor and transistor
A novel material and a transistor including the novel material are provided. One embodiment of the present invention is a composite oxide including at least two regions. One of the regions includes In, Zn and an element M1 (the element M1 is one or more of Al, Ga, Si, B, Y, Ti, Fe, Ni, Ge, Zr, Mo, La, Ce, Nd, Hf, Ta, W, Mg, V, Be, and Cu) and the other of the regions includes In, Zn, and an element M2 (the element M2 is one or more of Al, Ga, Si, B, Y, Ti, Fe, Ni, Ge, Zr, Mo, La, Ce, Nd, Hf, Ta, W, Mg, V, Be, and Cu). In an analysis of the composite oxide by energy dispersive X-ray spectroscopy, the detected concentration of the element M1 in a first region is less than the detected concentration of the element M2 in a second region, and a surrounding portion of the first region is unclear in an observed mapping image of the energy dispersive X-ray spectroscopy.
1. A transistor comprising:
a metal oxide film; and
a gate electrode provided in a region overlapping with the metal oxide film,
wherein the metal oxide film is a single layer and comprises a first region and a second region aligned in a direction intersecting with a thickness direction of the metal oxide film,
wherein the first region comprises In, Ga, and Zn,
wherein the second region comprises In, Ga, and Zn,
wherein the first region has a higher In concentration than the second region in an analysis of the metal oxide film by energy dispersive X-ray spectroscopy, and
wherein the second region has a higher Ga concentration than the first region in an analysis of the metal oxide film by energy dispersive X-ray spectroscopy.
2. A transistor comprising:
a metal oxide film; and
a gate electrode provided in a region overlapping with the metal oxide film,
wherein the metal oxide film is a single layer and comprises a first region and a second region aligned in a direction intersecting with a thickness direction of the metal oxide film,
wherein the first region comprises In, Ga, and Zn,
wherein the second region comprises In, Ga, and Zn,
wherein an In ratio in the first region is higher than a Ga ratio and a Zn ratio in an analysis of the metal oxide film by energy dispersive X-ray spectroscopy, and
wherein a Ga ratio in the second region is higher than an In ratio and a Zn ratio in an analysis of the metal oxide film by energy dispersive X-ray spectroscopy.
3. A transistor comprising:
a metal oxide film; and
a gate electrode provided in a region overlapping with the metal oxide film,
wherein the metal oxide film is a single layer and comprises a first region and a second region aligned in a direction intersecting with a thickness direction of the metal oxide film,
wherein the first region comprises In, Ga, and Zn,
wherein the second region comprises In, Ga, and Zn,
wherein an In ratio in the first region is higher than a Ga ratio and a Zn ratio in an analysis of the metal oxide film by energy dispersive X-ray spectroscopy,
wherein a Ga ratio in the second region is higher than an In ratio and a Zn ratio in an analysis of the metal oxide film by energy dispersive X-ray spectroscopy, and
wherein the metal oxide film is microcrystalline.
4. The transistor according to claim 1 , wherein the metal oxide film is a non-single-crystal film.
5. The transistor according to claim 2 , wherein the metal oxide film is a non-single-crystal film.
6. The transistor according to claim 1 , wherein a size of a micrograin in the metal oxide film is greater than or equal to 0.5 nm and less than or equal to 3 nm.
7. The transistor according to claim 2 , wherein a size of a micrograin in the metal oxide film is greater than or equal to 0.5 nm and less than or equal to 3 nm.
8. The transistor according to claim 3 , wherein a size of a micrograin in the metal oxide film is greater than or equal to 0.5 nm and less than or equal to 3 nm.
9. The transistor according to claim 1 , wherein a size of one of the two regions and a size of the other of the two regions are each greater than or equal to 0.5 nm and less than or equal to 10 nm.
10. The transistor according to claim 2 , wherein a size of one of the two regions and a size of the other of the two regions are each greater than or equal to 0.5 nm and less than or equal to 10 nm.
11. The transistor according to claim 3 , wherein a size of one of the two regions and a size of the other of the two regions are each greater than or equal to 0.5 nm and less than or equal to 10 nm.