Electric magnetic shielding structure in packages

1. A method comprising:

encapsulating a device die in an encapsulating material;

forming a metal shield to enclose the device die therein, wherein the forming the metal shield comprises:

forming a first portion over the encapsulating material;

forming a second portion under the encapsulating material; and

forming a plurality of through-vias penetrating through the encapsulating material, wherein the plurality of through-vias electrically connects the first portion to the second portion of the metal shield, and wherein the device die and the metal shield are in a package, and wherein the plurality of through-vias comprises four corner through-vias, each at a corner of the package;

attaching four solder regions to electrically coupling to the metal shield, wherein each of the four solder regions is aligned to one of the four corner through-vias; and

forming an additional plurality of through-vias, each being between and aligned to two of the corner through-vias, and the additional plurality of through-vias is encapsulated in the encapsulating material, and is electrically coupled to the metal shield.

2. The method of claim 1 , wherein the forming the first portion of the metal shield comprises forming a metal ring, with each side-portion of the metal ring adjacent to and parallel to a respective edge of the package.

3. The method of claim 2 , wherein the forming the first portion of the metal shield further comprises forming a metal ring extension encircled by the metal ring, wherein the metal ring extension is connected to the metal ring.

4. The method of claim 1 further comprising electrically grounding the metal shield.

5. The method of claim 4 , wherein the electrically grounding the metal shield is achieved by electrically connecting the metal shield through a plurality of solder regions, each located at a corner of the package.

6. The method of claim 1 , wherein the plurality of through-vias are fully separated from each other, and wherein the plurality of through-vias are not connected by any conductive feature that is formed in the encapsulant.

7. A method comprising:

applying a patterned photo resist over a carrier;

plating a first plurality of conductive posts in the patterned photo resist;

removing the patterned photo resist;

encapsulating the first plurality of conductive posts and a device die in an encapsulating material;

planarizing the first plurality of conductive posts, the device die, and the encapsulating material;

forming a first plurality of conductive features; and

forming a second plurality of conductive features, wherein the first plurality of conductive features and the second plurality of conductive features are on opposite sides of the encapsulating material, and the forming the second plurality of conductive features comprises:

forming a conductive ring electrically coupling to the first plurality of conductive posts; and

simultaneously forming a plurality of redistribution lines electrically decoupled from the conductive ring, wherein the plurality of redistribution lines is encircled by the conductive ring, with the device die, the first plurality of conductive features, and the second plurality of conductive features being in a package; and

electrically grounding the conductive ring by connecting the conductive ring to an electrical ground through a plurality of solder regions, wherein each of the plurality of solder regions is vertically aligned to one of the first plurality of conductive posts that is at one of corners of the package .

8. The method of claim 7 further comprising forming a second plurality of conductive posts, each being between and aligned to two of the first plurality of conductive posts, and the second plurality of conductive posts is encapsulated in the encapsulating material, and is electrically coupled to the conductive ring.

9. The method of claim 7 , wherein the first plurality of conductive posts are formed to be physically separated from each other by the encapsulating material.

10. The method of claim 7 further comprising, when the conductive ring is formed, forming ring extensions in the conductive ring, wherein the ring extensions are electrically connected to the conductive ring.

11. The method of claim 10 further comprising, when the first plurality of conductive features are formed, forming additional ring extensions electrically connecting to the first plurality of conductive posts.

12. A method comprising:

forming plurality of conductive posts;

encapsulating the plurality of conductive posts and a device die in an encapsulating material;

forming a metal ring over the encapsulating material, wherein the metal ring is electrically connected to the plurality of conductive posts, and wherein the metal ring comprises a plurality of stacked redistribution lines, each forming a ring, with upper ones of the plurality of stacked redistribution lines connecting to respective lower ones of the plurality of stacked redistribution lines; and

forming a solder region electrically connecting to the metal ring and the plurality of conductive posts.

13. The method of claim 12 further comprising electrically grounding the conductive ring through the solder region.

14. The method of claim 12 further comprising forming a first metal ring extension at a same level as, and physically connecting to, the metal ring, wherein the first metal ring extension is a terminal feature that is configured not to have currents flowing through.

15. The method of claim 12 further comprising forming a second metal ring extension on an opposite side of the encapsulating material than the metal ring, wherein the second metal ring extension is electrically connected to the metal ring, and the second metal ring extension is a terminal feature that is configured not to have currents flowing through.

16. The method of claim 12 , wherein the plurality of conductive posts comprise a plurality of corner conductive posts, each joined to a corner of the metal ring, and the method further comprises:

forming a plurality of corner solder regions electrically connected to the metal ring, wherein each of the plurality of corner solder regions is overlapped by and vertically aligned to one of the corner conductive posts.

17. The method of claim 12 further comprising:

before the encapsulating, attaching the device die over a carrier through a die-attach film, wherein the plurality of conductive posts are formed over the carrier through plating; and

after the encapsulating, de-bonding the carrier from the device die and the encapsulating material.

18. The method of claim 12 further comprising forming a plurality of signal redistribution lines in same layers as the metal ring, wherein the plurality of signal redistribution lines are encircled by the metal ring.

19. The method of claim 12 , wherein the metal ring is overlying the device die, wherein each of the plurality of conductive posts comprises a sidewall that forms a full ring, and wherein the full ring comprises a top end higher than a top surface of the device die.

20. The method of claim 19 , wherein the full ring further comprises a bottom end coplanar with a bottom surface of the encapsulating material.