IP Library › Granted Patent US 11,533,040
Granted Patent B2
US 11,533,040 · App. 16/205,268 · Granted Dec 20, 2022

Elastic wave device

Inventors: Masayuki Morita (Nagaokakyo, JP); Hideki Iwamoto (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H03H9/14541H03H3/08H03H9/02543H03H9/02559H03H9/02574H03H9/02834H03H9/02866H03H9/14538H03H9/25H03H9/6489H01L41/0477H01L41/29
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Quick Facts
Patent No.
US 11,533,040
App. No.
16/205,268
Granted
Dec 20, 2022
Kind
B2
Abstract

An elastic wave device includes a piezoelectric film, a high acoustic velocity member, a low acoustic velocity film located between the piezoelectric film and the high acoustic velocity member and through which an elastic wave propagates at a lower acoustic velocity than an elastic wave that propagates through the piezoelectric film, and an interdigital transducer electrode including electrode fingers separated from each other and disposed side by side in a first direction. At least one of the electrode fingers includes a first metal layer including first and second main body portions. A recessed portion is located in a central region in the first direction of the electrode finger and is recessed in the thickness direction of the piezoelectric film. A protrusion portion protrudes from at least a portion of the first main body portion in the first direction.

Claims (35)

1. An elastic wave device comprising:

a piezoelectric film;

a high acoustic velocity member through which an elastic wave propagates at an acoustic velocity higher than an acoustic velocity of an elastic wave that propagates through the piezoelectric film;

a low acoustic velocity film disposed between the piezoelectric film and the high acoustic velocity member and through which an elastic wave propagates at an acoustic velocity lower than the acoustic velocity of the elastic wave that propagates through the piezoelectric film; and

an interdigital transducer electrode disposed on a principal surface of the piezoelectric film; wherein

the interdigital transducer electrode includes a plurality of electrode fingers that are separated from each other and that are disposed side by side in a first direction;

at least one of the plurality of electrode fingers includes a first metal layer;

the first metal layer includes:

a first main body portion disposed directly or indirectly on the principal surface of the piezoelectric film; and

a second main body portion disposed on the first main body portion; and

the second main body portion includes:

a recessed portion located in a central region in the first direction of the at least one of the plurality of electrode fingers and that is recessed in a thickness direction of the piezoelectric film; and

a protrusion portion that protrudes from at least a portion of the first main body portion in the first direction.

2. The elastic wave device according to claim 1 , wherein the first main body portion is tapered such that a width of the first main body portion in the first direction decreases with increasing proximity to the second main body portion from a base end facing the piezoelectric film in the thickness direction of the piezoelectric film.

3. The elastic wave device according to claim 1 , wherein the at least one of the plurality of electrode fingers includes at least two layers including the first metal layer.

4. The elastic wave device according to claim 3 , wherein

the at least one of the plurality of electrode fingers further includes:

a close contact layer disposed on the principal surface of the piezoelectric film; and

the first metal layer is an Al-based layer disposed opposite to the piezoelectric film with the close contact layer interposed therebetween.

5. The elastic wave device according to claim 4 , wherein the at least one of the plurality of electrode fingers further includes a Ti layer disposed on the Al-based layer.

6. The elastic wave device according to claim 1 , wherein the high acoustic velocity member includes a high acoustic velocity support substrate.

7. The elastic wave device according to claim 1 , further comprising:

a support substrate; wherein

the high acoustic velocity member includes:

a high acoustic velocity film disposed on the support substrate.

8. The elastic wave device according to claim 1 , wherein the piezoelectric film is made of one of LiTaO 3 , LiNbO 3 , ZnO, AlN, or PZT.

9. The elastic wave device according to claim 1 , wherein the low acoustic velocity film includes at least one material selected from a group consisting of silicon oxide, glass, silicon oxynitride, tantalum oxide, and a compound in which fluorine, carbon, or boron is added to silicon oxide.

10. The elastic wave device according to claim 6 , wherein the high acoustic velocity support substrate includes at least one material selected from a group consisting of silicon, aluminum nitride, aluminum oxide, silicon carbide, silicon nitride, sapphire, lithium tantalate, lithium niobate, quartz, alumina, zirconia, cordierite, mullite, steatite, forsterite, and magnesia diamond.

11. The elastic wave device according to claim 7 , wherein the support substrate includes at least one material selected from a group consisting of sapphire, lithium tantalate, lithium niobate, quartz, alumina, magnesia, silicon nitride, aluminum nitride, silicon carbide, zirconia, cordierite, mullite, steatite, forsterite, glass, silicon, gallium nitride, and resin.

12. The elastic wave device according to claim 7 , wherein the high acoustic velocity film includes at least one material selected from a group consisting of diamond-like carbon, aluminum nitride, aluminum oxide, silicon carbide, silicon nitride, silicon, sapphire, lithium tantalate, lithium niobate, quartz, alumina, zirconia, cordierite, mullite, steatite, forsterite, and magnesia diamond.

13. The elastic wave device according to claim 1 , wherein the protrusion portion is triangular or substantially triangular.

14. The elastic wave device according to claim 1 , wherein the protrusion portion is tabular or substantially tabular.

15. The elastic wave device according to claim 1 , wherein a film thickness of the low acoustic velocity film is about 2.0λ or less, where λ is a wavelength of an elastic wave propagating in the elastic wave device.

16. The elastic wave device according to claim 1 , wherein a film thickness of the piezoelectric film is about 3.5λ or less, where λ is a wavelength of an elastic wave propagating in the elastic wave device.

17. The elastic wave device according to claim 1 , wherein the first main body portion is rectangular or substantially rectangular such that a width of a base end and a width of a top end of the first main body portion in the first direction are the same or substantially the same.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2018
From: MORITA, MASAYUKI; IWAMOTO, HIDEKI
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 047632/0489 →
Priority Claims (1)
JP JP2017-248387 · Dec 25, 2017 · national
Continuity (1)
Related Publication 20190199320A1 · Jun 27, 2019