IP Library Granted Patent US 11,538,520
Granted Patent B1
US 11,538,520 · App. 17/482,491 · Granted Dec 27, 2022

Negative-capacitance ferroelectric transistor assisted resistive memory programming

Inventor: Kangguo Cheng (Schenectady, NY)
Assignee: International Business Machines Corporation
G11C13/0026G11C11/221G11C11/223G11C13/0028G11C2213/79
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Quick Facts
Patent No.
US 11,538,520
App. No.
17/482,491
Granted
Dec 27, 2022
Kind
B1
Abstract

A memory device is provided that includes at least one resistive memory cell, a negative capacitance field effect transistor (NC-FET) serving as a voltage amplifier, and a switch enable circuit connecting NC-FET to the memory cell. The NC-FET includes a regular FET having a metal gate terminal and a ferroelectric capacitor. The NC-FET gate terminal forms one plate of the ferroelectric (FE) capacitor. The ferroelectric capacitor includes a ferroelectric dielectric material deposited between a formed upper gate conductive contact and he metal gate terminal. To provide further flexibility, a metal layer can be deposited before the deposition of the ferroelectric material to form a MIM-like FE capacitor so that the capacitance of FE capacitance can be independently tuned by choosing the right height (H), width (W), and length (L) to achieve desired matching between |C FE | and C ox where C ox is the gate oxide capacitance and C FE is the ferroelectric capacitance.

Claims (40)

1. A memory device comprising:

at least one memory cell;

a negative capacitance field effect transistor (NC-FET); and

a switch circuit connecting a gate terminal of the NC-FET to the at least one memory cell.

2. The memory device of claim 1 , wherein the memory cell is a resistive memory (ReRAM) element.

3. The memory device of claim 1 , wherein the NC-FET comprises:

a metal-oxide semiconductor field effect transistor (MOSFET) having the gate terminal, the gate terminal comprising a metal material; and

a ferroelectric capacitor having a ferroelectric dielectric material layer in series with the gate terminal.

4. The memory device of claim 3 , wherein an electrode of the ferroelectric capacitor includes an electrode that electrically connects to the gate terminal of the NC-FET.

5. The memory device of claim 3 , wherein an electrode of the ferroelectric capacitor comprises the gate terminal of the NC-FET.

6. The memory device of claim 5 , wherein the NC-FET further comprises:

a layer of metal material formed between the ferroelectric dielectric material layer of the ferroelectric capacitor and the gate terminal of the NC-FET.

7. The memory device of claim 5 , wherein the switch circuit connecting the gate terminal of the NC-FET to the at least one memory cell is an enable FET.

8. A memory array comprising:

a plurality of memory cells, each memory cell storing a data value;

a negative capacitance field effect transistor (NC-FET); and

a switch circuit connecting a gate terminal of the NC-FET to the plurality of memory cells.

9. The memory array of claim 8 , wherein each memory cell is a resistive memory (ReRAM) element.

10. The memory array of claim 8 , wherein

a plurality of wordline conductors, each word line conductor configured to access said one or more memory cells along a row of said array;

a plurality of bitline conductors, each bitline conductor of said plurality associated with one or more memory cells along a column of said array;

a wordline conductor and one or more bitline conductors configured to enable access to said one or more memory cells along a row of said array, each accessed memory cell receiving signals for configuring said accessed memory cell to one of: store data in or output data from the accessed memory cell.

11. The memory array of claim 10 , wherein the switch circuit connecting the gate terminal of the NC-FET to the plurality of memory cells is an enable FET.

12. The memory array of claim 10 , wherein the NC-FET comprises:

a metal-oxide semiconductor field effect transistor (MOSFET) having a gate terminal comprising a metal, and

a ferroelectric capacitor having a ferroelectric dielectric material layer in series with the gate terminal.

13. The memory array of claim 12 , wherein an electrode of the ferroelectric capacitor comprises the gate terminal of the FET.

14. The memory array of claim 13 , wherein the NC-FET further comprises:

a layer of metal material formed between the ferroelectric dielectric material layer and the gate terminal of the NC-FET.

15. The memory array of claim 12 , wherein the switch circuit connecting the gate terminal of the NC-FET to the one or more memory cells is an enable FET.

16. A method of operating a memory device, the method comprising:

providing, on a substrate, at least one resistive memory cell configured to store data associated with a resistive state;

generating at a negative capacitance field effect transistor (NC-FET) an amplified voltage signal responsive to a received input voltage; and

conducting said amplified voltage signal from said NC-FET to said at least one resistive memory cell.

17. The method of claim 16 , comprising:

configuring the at least one memory cell into a low resistance state responsive to said amplified voltage.

18. The method of claim 16 , wherein said conducting said amplified voltage signal from said NC-FET to said at least one resistive memory cell comprises:

controlling a switch circuit to connect a gate terminal of the NC-FET to the at least one memory cell.

19. The method of claim 18 , wherein said switching circuit comprises a field effect transistor (FET), said switch circuit controlling comprising: providing a control signal to a gate of said FET to activate said FET to conduct said amplified voltage signal.

20. The method of claim 16 , wherein the received voltage is a nominal operating supply voltage.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2021
From: CHENG, KANGGUO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 057569/0927 →
Cited By (3)
US 12,230,358 US 12,349,364 US 12,733,412