IP Library › Granted Patent US 11,538,616
Granted Patent B2
US 11,538,616 · App. 16/399,534 · Granted Dec 27, 2022

Coil electronic component

Inventors: Kyung Lock Kim (Suwon-si, KR); Byeong Cheol Moon (Suwon-si, KR); Chang Hak Choi (Suwon-si, KR); Jeong Gu Yeo (Suwon-si, KR); Young Il Lee (Suwon-si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01F27/255H01F1/20H01F27/2804H01F27/29H01F27/32H01F41/041H01F41/12H01F2027/2809
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Quick Facts
Patent No.
US 11,538,616
App. No.
16/399,534
Granted
Dec 27, 2022
Kind
B2
Abstract

A coil electronic component includes a body, in which a coil portion is embedded, including a plurality of magnetic particles, and an external electrode connected to the coil portion. Among the plurality of magnetic particles, at least a portion of magnetic particles include a first layer, disposed on a surface of a magnetic particle among the magnetic particles, and a second layer disposed on a surface of the first layer. The first layer is an inorganic coating layer containing a phosphorus (P) component, and the second layer is an atomic layer deposition layer.

Claims (19)

1. A coil electronic component comprising:

a body, in which a coil portion is embedded, including a plurality of magnetic particles;

an external electrode connected to the coil portion,

wherein among the plurality of magnetic particles, at least a portion of magnetic particles include a first layer, disposed on a surface of a magnetic particle among the magnetic particles, a second layer disposed on a surface of the first layer, and a third layer disposed on a surface of the second layer,

the first and third layers are inorganic coating layers containing a phosphorus (P) component, and

the second layer includes an oxide having at least one of Al, Si, Ti, Zn, Hf, Ta, Nb, Sc, Y, Mg, B, or Ge.

2. The coil electronic component of claim 1 , wherein the first layer has a thickness of 10 to 15 nanometers.

3. The coil electronic component of claim 1 , wherein the second layer has a thickness of 10 to 15 nanometers.

4. The coil electronic component of claim 1 , wherein a sum of thicknesses of the first and second layers is 20 to 30 nanometers.

5. The coil electronic component of claim 1 , wherein the first and second layers are formed of different materials to each other.

6. The coil electronic component of claim 1 , wherein the third layer is formed of a same material as the first layer.

7. The coil electronic component of claim 1 , wherein the plurality of magnetic particles include a plurality of first particles and a plurality of second particles having sizes smaller than those of the first particles.

8. The coil electronic component of claim 7 , wherein the first particle is formed of an iron-based (Fe-based) alloy.

9. The coil electronic component of claim 7 , wherein the first particle has a diameter of 10 to 25 micrometers.

10. The coil electronic component of claim 7 , wherein the second particle is formed of pure iron.

11. The coil electronic component of claim 7 , wherein the second particle has a diameter of 5 micrometers or less.

12. The coil electronic component of claim 1 , wherein the second layer is an atomic layer deposition layer.

13. The coil electronic component of claim 1 , wherein the second layer includes a ceramic.

14. The coil electronic component of claim 1 , wherein the second layer does not contain the phosphorus (P) component.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 6, 2019
From: KIM, KYUNG LOCK; MOON, BYEONG CHEOL; CHOI, CHANG HAK; YEO, JEONG GU; LEE, YOUNG IL
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 049392/0636 →
Priority Claims (2)
KR 10-2018-0097772 · Aug 22, 2018 · national
KR 10-2018-0155329 · Dec 5, 2018 · national
Continuity (1)
Related Publication 20200066436A1 · Feb 27, 2020
Cited By (1)
US 12,667,886