IP Library › Granted Patent US 11,538,635
Granted Patent B2
US 11,538,635 · App. 17/010,408 · Granted Dec 27, 2022

Multilayered capacitor and board for mounting the same

Inventors: Hyo Joong Kim (Suwon-si, KR); Dong Su Cho (Suwon-si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01G4/30H01G2/065H01G4/012H01G4/12
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Quick Facts
Patent No.
US 11,538,635
App. No.
17/010,408
Granted
Dec 27, 2022
Kind
B2
Abstract

A multilayer capacitor includes a body including a plurality of dielectric layers, an active region and upper and lower cover regions; first and second internal electrodes disposed with the dielectric layer interposed therebetween in the active region to be alternately exposed through both end surfaces of the body; and first and second external electrodes disposed on both ends of the body and connected to the first and second internal electrodes, respectively. The body further includes a buffer layer including first and second dummy electrodes disposed on a lower surface of the lower cover region to be spaced apart from each other in a length direction of the body, and a groove is recessed in a lower surface of the buffer layer.

Claims (44)

1. A multilayer capacitor, comprising:

a body comprising a plurality of dielectric layers laminated therein, an active region and upper and lower cover regions;

first and second internal electrodes disposed with the dielectric layer interposed therebetween in the active region to be alternately exposed through both end surfaces of the body; and

first and second external electrodes disposed on both ends of the body and connected to the first and second internal electrodes, respectively,

wherein the body further comprises a buffer layer comprising first and second dummy electrodes disposed on a lower surface of the lower cover region to be spaced apart from each other in a length direction of the body, and

a groove is recessed in a lower surface of the buffer layer so as to overlap at least one of the first dummy electrodes or the second dummy electrodes in the length direction.

2. The multilayer capacitor of claim 1 ,

wherein the groove extends from one side surface of the body to the other side surface of the body in a width direction of the body.

3. The multilayer capacitor of claim 1 , wherein the first and second dummy electrodes are disposed on a single dielectric layer to face each other in the length direction.

4. The multilayer capacitor of claim 3 , wherein the first and second dummy electrodes are exposed through both end surfaces of the body and are connected to the first and second external electrodes.

5. The multilayer capacitor of claim 1 , wherein the groove is disposed between the first and second dummy electrodes.

6. The multilayer capacitor of claim 1 , wherein a thickness of the lower cover region is greater than a distance between the first and second internal electrodes in the active region.

7. The multilayer capacitor of claim 1 , wherein a plurality of the grooves are disposed on the lower surface of the buffer layer.

8. The multilayer capacitor of claim 7 , wherein each of the plurality of the grooves extends from one side surface to the other side surface in a width direction of the body.

9. The multilayer capacitor of claim 7 , wherein the buffer layer further comprises a third dummy electrode disposed between the first and second dummy electrodes.

10. The multilayer capacitor of claim 9 , wherein the first to third dummy electrodes are spaced apart from each other on a single dielectric layer in the length direction of the body.

11. The multilayer capacitor of claim 9 , wherein the first and second dummy electrodes are exposed through both end surfaces of the body and are connected to the first and second electrodes.

12. The multilayer capacitor of claim 9 , wherein one of the plurality of the grooves is disposed between the first and third dummy electrodes and another of the plurality of the grooves is disposed between the second and third dummy electrodes.

13. The multilayer capacitor of claim 1 , wherein the groove is intersected by a line connecting the first and second dummy electrodes.

14. A board for mounting a multilayer capacitor, comprising:

a board comprising first and second electrode pads on one surface thereof; and

the multilayer capacitor of claim 1 ,

wherein the first and second electrodes of the multilayer capacitor are mounted to be connected to the first and second electrodes pads, respectively.

15. A multilayer capacitor, comprising:

a body comprising a plurality of dielectric layers laminated therein, an active region and upper and lower cover regions;

first and second internal electrodes disposed with the dielectric layer interposed therebetween in the active region to be alternately exposed through both end surfaces of the body; and

first and second external electrodes disposed on both ends of the body and connected to the first and second internal electrodes, respectively,

wherein the body further comprises a buffer layer comprising first and second dummy electrodes disposed on a lower surface of the lower cover region to be spaced apart from each other in a length direction of the body,

a groove is recessed in a lower surface of the buffer layer and extends in a width direction of the body, the groove having a length greater than a length of the first or second dummy electrode in the length direction, and

a thickness of the lower cover region, devoid of any electrode, is greater than a distance between the first and second internal electrodes in the active region.

16. The multilayer capacitor of claim 15 ,

wherein the groove extends from one side surface of the body to the other side surface of the body in the width direction.

17. The multilayer capacitor of claim 15 , wherein the groove overlaps at least one of the first dummy electrodes or the second dummy electrodes in the length direction.

18. The multilayer capacitor of claim 15 , wherein the groove is disposed between the first and second dummy electrodes.

19. The multilayer capacitor of claim 15 , wherein a plurality of the grooves are disposed on the lower surface of the buffer layer.

20. The multilayer capacitor of claim 15 , wherein the groove is intersected by a line connecting the first and second dummy electrodes.

21. A multilayer capacitor, comprising:

a body comprising a plurality of dielectric layers laminated therein, an active region and upper and lower cover regions;

first and second internal electrodes disposed with the dielectric layer interposed therebetween in the active region to be alternately exposed through both end surfaces of the body; and

first and second external electrodes disposed on both ends of the body and connected to the first and second internal electrodes, respectively,

wherein the body further comprises a buffer layer comprising first and second dummy electrodes disposed on a lower surface of the lower cover region to be spaced apart from each other in a length direction of the body,

a groove is recessed in a lower surface of the buffer layer,

a thickness of the lower cover region, devoid of any electrode, is greater than a distance between the first and second internal electrodes in the active region, and

the groove is intersected by a line connecting the first and second dummy electrodes.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2020
From: KIM, HYO JOONG; CHO, DONG SU
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 053677/0636 →
Priority Claims (1)
KR 10-2020-0047201 · Apr 20, 2020 · national
Continuity (1)
Related Publication 20210327647A1 · Oct 21, 2021
Cited By (1)
US 12,603,229