Electronic package for integrated circuits and related methods
Electronic packages and related methods are disclosed. An example electronic package apparatus includes a substrate and an electronic component. A protective material is positioned on a first surface, a second surface and all side surfaces of the electronic component to encase the electronic component. An enclosure is coupled to the substrate to cover the protective material and the electronic component.
1. An electronic package comprising:
a substrate;
a first die electrically connected to the substrate;
a bulk acoustic wave (BAW) device attached to, and electrically connected to, the first die;
a protective material covering portions of a top surface of the first die, a top surface of the BAW device, and covering an entire area of a bottom surface of the first die, the bottom surface proximate to the substrate than the top surface;
a cavity filled with air covering portions of the protective material; and
an enclosure covering portions of the cavity.
2. The electronic package of claim 1 wherein the BAW device is electrically connected to the first die via a bond wire.
3. The electronic package of claim 1 , wherein the BAW device is sensitive to stress from the electronic package.
4. The electronic package of claim 1 further including containment mask contacting the substrate, wherein the cavity filled with air contacts a portion of the containment mask.
5. The electronic package of claim 4 , wherein the containment mask includes hydrophobic characteristics.
6. The electronic package of claim 4 , wherein the containment mask includes adhesive characteristic.
7. The electronic package of claim 4 , wherein the containment mask includes one of an epoxy based polymer material, a polyimide, a polyamide, a bismaleimide (BMI) resin, a polyamide-imide polymer, a hydrophobic polyimide, and a hydrophobic coating.
8. The electronic package of claim 1 , wherein the protective material is silicone.
9. The electronic package of claim 1 , wherein the protective material has Young's modulus of elasticity of between approximately 2 megapascal (MPa) and 6 megapascal (MPa).
10. The electronic package of claim 1 , wherein the BAW device is attached to the first die via a die attach material.
11. The electronic package of claim 1 , wherein the substrate includes electrical conductive pads.
12. The electronic package of claim 11 , wherein the electrical conductive pads include copper.
13. The electronic package of claim 1 , wherein the substrate includes a printed circuit board.
14. The electronic package of claim 1 , wherein the substrate includes Silicon.