Electronic panel, electronic panel test device, and electronic panel test method

1. A test device comprising:

a plurality of signal test pads electrically connected to pads of an input sensing unit;

a power test pad electrically connected to a power pattern of a display unit;

a test circuit configured to apply a test signal to the signal test pads;

a voltage generator configured to generate a sensing power voltage having a normal level; and

a ripple controller configured to change a voltage level of the sensing power voltage to apply the sensing power voltage to the power test pad,

wherein the ripple controller is configured to introduce a ripple noise to the sensing power voltage such that the voltage level of the sensing power voltage is changed to a lower or higher level than the normal level to be applied to the power test pad.

2. The test device of claim 1 , wherein the ripple controller is configured to provide the ripple noise to the sensing power voltage and to apply the sensing power voltage comprising the ripple noise to the power test pad.

3. The test device of claim 1 , wherein the signal test pads comprise test transmission signal pads and test reception signal pads.

4. The test device of claim 3 , wherein the test circuit is configured to output a test transmission signal to the test transmission signal pads and to receive a test reception signal from the test reception signal pads.

5. The test device of claim 4 , wherein the test circuit is further configured to output switching signals in synchronization with the test transmission signal to select the voltage level of the sensing power voltage.

6. The test device of claim 1 , wherein the test circuit is further configured to output switching signals to select the voltage level of the sensing power voltage.

7. The test device of claim 6 , wherein the ripple controller is configured to change the voltage level of the sensing power voltage in response to the switching signals.

8. The test device of claim 6 , wherein the ripple controller comprises a plurality of current controllers connected to each other in parallel between a first node and a second node and operated in response to the switching signals, the first node is configured to receive the sensing power voltage, and the second node is configured to receive a second voltage.

9. The test device of claim 8 , wherein each of the current controllers comprises:

a resistor comprising one end connected to the first node and the other end; and

a transistor comprising a first electrode connected to the other end of the resistor, a second electrode connected to the second node, and a gate electrode receiving a corresponding switching signal among the switching signals.

10. An electronic panel comprising:

a display unit comprising a display area and a peripheral area adjacent to the display area; and

an input sensing unit on the display unit configured to sense an external input applied to a sensing area overlapping with the display area, the display unit comprising:

a power pad in the peripheral area configured to receive a power voltage; and

a power pattern in the peripheral area and electrically connected to the power pad, the input sensing unit comprising:

a sensing pad in a non-sensing area around the sensing area and configured to receive a sensing power voltage; and

a power line in the non-sensing area and electrically connected to the sensing pad, wherein the power line is electrically connected to the power pattern,

wherein a voltage level of the sensing power voltage is changed to a lower or higher level than a normal level during a test mode such that a ripple noise is introduced to the sensing power voltage applied to the sensing pad during the test mode.

11. The electronic panel of claim 10 , wherein the power line overlaps with the power pattern when viewed in a top view.

12. The electronic panel of claim 10 , wherein the display unit comprises a plurality of pixels in the display area, each of the pixels comprises:

a transistor comprising a semiconductor pattern, a control electrode spaced apart from the semiconductor pattern, an input electrode connected to the semiconductor pattern, and an output electrode on a same layer as the input electrode and connected to the semiconductor pattern, the transistor being covered by an insulating layer; and

an organic light emitting device on the insulating layer and comprising a first electrode, a second electrode on the first electrode, and a light emitting layer between the first electrode and the second electrode, and the power pattern is on a same layer as the output electrode.

13. The electronic panel of claim 12 , wherein the power pattern is electrically connected to the second electrode.

14. The electronic panel of claim 12 , wherein the insulating layer comprises:

a first layer between the first electrode and the output electrode to cover the output electrode;

a second layer on the first layer; and

a third layer on the second layer, and the first electrode is on the third layer.

15. The electronic panel of claim 12 , wherein the power pattern is configured to receive the power voltage via the power pad during a normal mode and to receive the sensing power voltage via the sensing pad and the power line during the test mode.

16. The electronic panel of claim 10 , wherein the sensing power voltage comprises the ripple noise during the test mode.

17. The electronic panel of claim 15 , wherein the input sensing unit further comprises sensing signal pads in the non-sensing area and is configured to receive a test transmission signal during the test mode.

18. A test method of a test device that comprises signal test pads electrically connected to pads of an input sensing unit and a power test pad electrically connected to a power pattern of a display unit, the test method comprising:

outputting a test transmission signal to first pads among the signal test pads;

generating a sensing power voltage;

changing a voltage level of the sensing power voltage; and

receiving a test transmission signal from second pads among the signal test pads,

wherein the changing of the voltage level of the sensing power voltage comprises adding a ripple noise to the sensing power voltage to change the sensing power voltage to a higher level or a lower level than a normal level such that the ripple noise is introduced to the sensing power voltage and applied to the power test pad with the ripple noise.

19. The test method of claim 18 , wherein the changing of the voltage level of the sensing power voltage comprises changing the voltage level of the sensing power voltage in synchronization with the test transmission signal.