Heat pump device and assembly
A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.
1. A heat pump comprising:
one or more thermoelectric devices having one or more thermoelectric elements defining a planar face; and
a heat sink comprising:
a slab of thermally conductive material having a raised portion with a top surface thermally coupled with the planar face, wherein the raised portion of the slab includes:
an outer periphery and a central raised region defined in a shape corresponding to an uneven temperature distribution of the planar face, and
a void region between the outer periphery and the central raised region, wherein the void region substantially surrounds and is substantially contiguous about the central raised region; and
one or more supports of a material having a lower thermal conductivity than the slab, wherein the one or more supports are disposed within the void region so as to support the one or more thermoelectric elements facing the void region wherein both the outer periphery and the central raised region define the top surface of the raised portion which contacts the planar face of the one or more thermoelectric elements, and wherein the one or more supports contact the planar face of the one or more thermoelectric elements facing the void region.
2. The heat pump of claim 1 wherein the heat sink further comprises a plurality of heat dissipating fins thermally coupled with an underside of the slab opposite the raised portion.
3. The heat pump of claim 1 wherein the outer periphery of the slab is rectangular in shape and the central raised region is generally oval or circular in shape.
4. The heat pump of claim 1 wherein the central raised region is generally rectangular in shape.
5. The heat pump of claim 1 wherein the central raised region is a combination of shapes.
6. The heat pump of claim 1 wherein the central raised region is an irregular or non-uniform shape.
7. The heat pump of claim 1 wherein the void region comprises a region of reduced thickness such that the planar face is not in contact with the slab within the void region.
8. The heat pump of claim 7 wherein the void region comprises a thickness of about 50% or less than a thickness of the central raised region.
9. The heat pump of claim 7 wherein the void region comprises a thickness of about 25% or less than a thickness of the central raised region.
10. The heat pump of claim 7 wherein the void region comprises a thickness of about 10% or less than a thickness of the central raised region.
11. The heat pump of claim 7 wherein the void region is a single contiguous void that circumscribes the central raised region.
12. The heat pump of claim 7 wherein the void region is a plurality of voids.
13. The heat pump of claim 1 wherein the slab is dimensioned such that a top surface of the outer periphery of the slab is co-extensive with an outer periphery of the planar face.
14. The heat pump of claim 1 wherein the slab further comprises pockets defined within the void region, wherein the pockets are defined to fittingly receive the one or more supports.
15. The heat pump of claim 1 wherein each of the one or more supports comprise an elastomeric material.
16. The heat pump of claim 15 wherein each of the one or more supports comprise a rubber O-ring.
17. The heat pump of claim 1 wherein the void is partly or entirely filled with a material having low thermal conductivity.
18. The heat pump of claim 1 further comprising:
a thermal interface material disposed between the heat sink and the one or thermoelectric devices.
19. The heat pump of claim 18 wherein the thermal interface material comprises a synthetic graphite.
20. A heat pump comprising:
one or more thermoelectric devices having one or more thermoelectric elements defining a planar face; and
a heat sink comprising:
a slab of thermally conductive material having a raised portion with a top surface thermally coupled with the planar face, wherein the raised portion of the slab includes:
an outer periphery and a central raised region defined in a shape corresponding to an uneven temperature distribution of the planar face,
and
a void region between the outer periphery and the central raised region, wherein the void region substantially surrounds and is substantially contiguous about the central raised region; and
one or more supports of a material having a lower thermal conductivity than the slab, wherein the one or more supports are disposed within the void region so as to support the one or more thermoelectric elements facing the void region, wherein the outer periphery of the raised portion is a rectangular shape and the central raised region is generally oval or circular in shape, wherein the one or more supports comprise at least four supports disposed within the void region along the four inside corners of the rectangular outer periphery.
21. The heat pump of claim 20 wherein each of the at least four supports comprise an elastomeric material.
22. The heat pump of claim 21 wherein each of the at least four supports comprise a rubber O-ring.